世界のウェーハ切断用ブレード市場予測（～2028年）：樹脂刃、金属焼結刃、ニッケル刃、その他

• 英文タイトル：Global Blades for Wafer Cutting Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

• レポートコード：GIR-22E3048 • 出版社/出版日：GlobalInfoResearch / 2022年5月 • レポート形態：英文、PDF、99ページ • 納品方法：Eメール（2~3営業日） • 産業分類：消費財

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レポート概要

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ウェーハ切断用ブレード市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 GlobalInfoResearchの最新の調査によると、世界のウェーハ切断用ブレードの市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 ウェーハ切断用ブレード市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメントは次をカバーします。 ・樹脂刃、金属焼結刃、ニッケル刃、その他 用途別セグメントは次のように区分されます。 ・半導体、その他 世界のウェーハ切断用ブレード市場の主要な市場プレーヤーは以下のとおりです。 ・Accretech、Advanced Dicing Technologies (ADT)、DISCO、K&S、UKAM、Ceiba、Shanghai Sinyang、Kinik、ITI 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、ウェーハ切断用ブレード製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なウェーハ切断用ブレードメーカーの企業概要、2019年～2022年までのウェーハ切断用ブレードの価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なウェーハ切断用ブレードメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別ウェーハ切断用ブレードの販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までのウェーハ切断用ブレードの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのウェーハ切断用ブレード市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、およびウェーハ切断用ブレードの産業チェーンを掲載しています。 ・第13、14、15章では、ウェーハ切断用ブレードの販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 ・メーカー情報（企業概要、製品概要、販売量、価格、売上）：Accretech、Advanced Dicing Technologies (ADT)、DISCO、K&S、UKAM、Ceiba、Shanghai Sinyang、Kinik、ITI ・メーカー別市場シェア ・地域別市場分析2017年-2028年 ・種類別分析2017年-2028年：樹脂刃、金属焼結刃、ニッケル刃、その他 ・用途別分析2017年-2028年：半導体、その他 ・ウェーハ切断用ブレードの北米市場規模2017年-2028年：アメリカ、カナダ、メキシコ ・ウェーハ切断用ブレードのヨーロッパ市場規模2017年-2028年：ドイツ、イギリス、フランス、ロシア、イタリア ・ウェーハ切断用ブレードのアジア市場規模2017年-2028年：中国、日本、韓国、インド、東南アジア、オーストラリア ・ウェーハ切断用ブレードの南米市場規模2017年-2028年：ブラジル、アルゼンチン ・ウェーハ切断用ブレードの中東・アフリカ市場規模2017年-2028年：サウジアラビア、トルコ、エジプト、南アフリカ ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論

The Blades for Wafer Cutting market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Blades for Wafer Cutting market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period. Semiconductor accounting for % of the Blades for Wafer Cutting global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Resin-blades segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Blades for Wafer Cutting include Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, and UKAM, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Blades for Wafer Cutting market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Resin-blades
Metal Sintered Blades
Nickel Blades
Others
Market segment by Application can be divided into
Semiconductor
Others
The key market players for global Blades for Wafer Cutting market are listed below:
Accretech
Advanced Dicing Technologies (ADT)
DISCO
K&S
UKAM
Ceiba
Shanghai Sinyang
Kinik
ITI
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Blades for Wafer Cutting product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Blades for Wafer Cutting, with price, sales, revenue and global market share of Blades for Wafer Cutting from 2019 to 2022.
Chapter 3, the Blades for Wafer Cutting competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Blades for Wafer Cutting breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Blades for Wafer Cutting market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Blades for Wafer Cutting.
Chapter 13, 14, and 15, to describe Blades for Wafer Cutting sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

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1 Market Overview
1.1 Blades for Wafer Cutting Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Blades for Wafer Cutting Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Resin-blades
1.2.3 Metal Sintered Blades
1.2.4 Nickel Blades
1.2.5 Others
1.3 Market Analysis by Application
1.3.1 Overview: Global Blades for Wafer Cutting Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Semiconductor
1.3.3 Others
1.4 Global Blades for Wafer Cutting Market Size & Forecast
1.4.1 Global Blades for Wafer Cutting Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Blades for Wafer Cutting Sales in Volume (2017-2028)
1.4.3 Global Blades for Wafer Cutting Price (2017-2028)
1.5 Global Blades for Wafer Cutting Production Capacity Analysis
1.5.1 Global Blades for Wafer Cutting Total Production Capacity (2017-2028)
1.5.2 Global Blades for Wafer Cutting Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Blades for Wafer Cutting Market Drivers
1.6.2 Blades for Wafer Cutting Market Restraints
1.6.3 Blades for Wafer Cutting Trends Analysis
2 Manufacturers Profiles
2.1 Accretech
2.1.1 Accretech Details
2.1.2 Accretech Major Business
2.1.3 Accretech Blades for Wafer Cutting Product and Services
2.1.4 Accretech Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Advanced Dicing Technologies (ADT)
2.2.1 Advanced Dicing Technologies (ADT) Details
2.2.2 Advanced Dicing Technologies (ADT) Major Business
2.2.3 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Product and Services
2.2.4 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 DISCO
2.3.1 DISCO Details
2.3.2 DISCO Major Business
2.3.3 DISCO Blades for Wafer Cutting Product and Services
2.3.4 DISCO Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 K&S
2.4.1 K&S Details
2.4.2 K&S Major Business
2.4.3 K&S Blades for Wafer Cutting Product and Services
2.4.4 K&S Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 UKAM
2.5.1 UKAM Details
2.5.2 UKAM Major Business
2.5.3 UKAM Blades for Wafer Cutting Product and Services
2.5.4 UKAM Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Ceiba
2.6.1 Ceiba Details
2.6.2 Ceiba Major Business
2.6.3 Ceiba Blades for Wafer Cutting Product and Services
2.6.4 Ceiba Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Shanghai Sinyang
2.7.1 Shanghai Sinyang Details
2.7.2 Shanghai Sinyang Major Business
2.7.3 Shanghai Sinyang Blades for Wafer Cutting Product and Services
2.7.4 Shanghai Sinyang Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Kinik
2.8.1 Kinik Details
2.8.2 Kinik Major Business
2.8.3 Kinik Blades for Wafer Cutting Product and Services
2.8.4 Kinik Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 ITI
2.9.1 ITI Details
2.9.2 ITI Major Business
2.9.3 ITI Blades for Wafer Cutting Product and Services
2.9.4 ITI Blades for Wafer Cutting Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Blades for Wafer Cutting Breakdown Data by Manufacturer
3.1 Global Blades for Wafer Cutting Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Blades for Wafer Cutting Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Blades for Wafer Cutting
3.4 Market Concentration Rate
3.4.1 Top 3 Blades for Wafer Cutting Manufacturer Market Share in 2021
3.4.2 Top 6 Blades for Wafer Cutting Manufacturer Market Share in 2021
3.5 Global Blades for Wafer Cutting Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Blades for Wafer Cutting Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Blades for Wafer Cutting Market Size by Region
4.1.1 Global Blades for Wafer Cutting Sales in Volume by Region (2017-2028)
4.1.2 Global Blades for Wafer Cutting Revenue by Region (2017-2028)
4.2 North America Blades for Wafer Cutting Revenue (2017-2028)
4.3 Europe Blades for Wafer Cutting Revenue (2017-2028)
4.4 Asia-Pacific Blades for Wafer Cutting Revenue (2017-2028)
4.5 South America Blades for Wafer Cutting Revenue (2017-2028)
4.6 Middle East and Africa Blades for Wafer Cutting Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Blades for Wafer Cutting Sales in Volume by Type (2017-2028)
5.2 Global Blades for Wafer Cutting Revenue by Type (2017-2028)
5.3 Global Blades for Wafer Cutting Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Blades for Wafer Cutting Sales in Volume by Application (2017-2028)
6.2 Global Blades for Wafer Cutting Revenue by Application (2017-2028)
6.3 Global Blades for Wafer Cutting Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Blades for Wafer Cutting Sales by Type (2017-2028)
7.2 North America Blades for Wafer Cutting Sales by Application (2017-2028)
7.3 North America Blades for Wafer Cutting Market Size by Country
7.3.1 North America Blades for Wafer Cutting Sales in Volume by Country (2017-2028)
7.3.2 North America Blades for Wafer Cutting Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Blades for Wafer Cutting Sales by Type (2017-2028)
8.2 Europe Blades for Wafer Cutting Sales by Application (2017-2028)
8.3 Europe Blades for Wafer Cutting Market Size by Country
8.3.1 Europe Blades for Wafer Cutting Sales in Volume by Country (2017-2028)
8.3.2 Europe Blades for Wafer Cutting Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Blades for Wafer Cutting Sales by Type (2017-2028)
9.2 Asia-Pacific Blades for Wafer Cutting Sales by Application (2017-2028)
9.3 Asia-Pacific Blades for Wafer Cutting Market Size by Region
9.3.1 Asia-Pacific Blades for Wafer Cutting Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Blades for Wafer Cutting Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Blades for Wafer Cutting Sales by Type (2017-2028)
10.2 South America Blades for Wafer Cutting Sales by Application (2017-2028)
10.3 South America Blades for Wafer Cutting Market Size by Country
10.3.1 South America Blades for Wafer Cutting Sales in Volume by Country (2017-2028)
10.3.2 South America Blades for Wafer Cutting Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Blades for Wafer Cutting Sales by Type (2017-2028)
11.2 Middle East & Africa Blades for Wafer Cutting Sales by Application (2017-2028)
11.3 Middle East & Africa Blades for Wafer Cutting Market Size by Country
11.3.1 Middle East & Africa Blades for Wafer Cutting Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Blades for Wafer Cutting Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Blades for Wafer Cutting and Key Manufacturers
12.2 Manufacturing Costs Percentage of Blades for Wafer Cutting
12.3 Blades for Wafer Cutting Production Process
12.4 Blades for Wafer Cutting Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Blades for Wafer Cutting Typical Distributors
13.3 Blades for Wafer Cutting Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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