世界の半導体用アンダーフィル市場予測（～2028年）：チップオンフィルムアンダーフィル、フリップチップアンダーフィル、CSP/BGAボードレベルアンダーフィル

• 英文タイトル：Global Underfills for Semiconductor Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

• レポートコード：GIR-22E4724 • 出版社/出版日：GlobalInfoResearch / 2022年5月 • レポート形態：英文、PDF、119ページ • 納品方法：Eメール（2~3営業日） • 産業分類：電子＆半導体

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レポート概要

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半導体用アンダーフィル市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 GlobalInfoResearchの最新の調査によると、世界の半導体用アンダーフィルの市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 半導体用アンダーフィル市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメントは次をカバーします。 ・チップオンフィルムアンダーフィル、フリップチップアンダーフィル、CSP/BGAボードレベルアンダーフィル 用途別セグメントは次のように区分されます。 ・産業用電子機器、防衛・航空宇宙用電子機器、家庭用電化製品、自動車用電子機器、医療用電子機器、その他 世界の半導体用アンダーフィル市場の主要な市場プレーヤーは以下のとおりです。 ・Panasonic、Master Bond、Henkel、LORD Corporation、NAMICS、Shin-Etsu、PolyScience、United Adhesives、Nagase ChemteX、DELO、AIM Solder、Panacol-Elosol、Hitachi Chemical、Zymet、HERCEP、Aigeer、Jinledun 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、半導体用アンダーフィル製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要な半導体用アンダーフィルメーカーの企業概要、2019年～2022年までの半導体用アンダーフィルの価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要な半導体用アンダーフィルメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別半導体用アンダーフィルの販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までの半導体用アンダーフィルの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域での半導体用アンダーフィル市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、および半導体用アンダーフィルの産業チェーンを掲載しています。 ・第13、14、15章では、半導体用アンダーフィルの販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 ・メーカー情報（企業概要、製品概要、販売量、価格、売上）：Panasonic、Master Bond、Henkel、LORD Corporation、NAMICS、Shin-Etsu、PolyScience、United Adhesives、Nagase ChemteX、DELO、AIM Solder、Panacol-Elosol、Hitachi Chemical、Zymet、HERCEP、Aigeer、Jinledun ・メーカー別市場シェア ・地域別市場分析2017年-2028年 ・種類別分析2017年-2028年：チップオンフィルムアンダーフィル、フリップチップアンダーフィル、CSP/BGAボードレベルアンダーフィル ・用途別分析2017年-2028年：産業用電子機器、防衛・航空宇宙用電子機器、家庭用電化製品、自動車用電子機器、医療用電子機器、その他 ・半導体用アンダーフィルの北米市場規模2017年-2028年：アメリカ、カナダ、メキシコ ・半導体用アンダーフィルのヨーロッパ市場規模2017年-2028年：ドイツ、イギリス、フランス、ロシア、イタリア ・半導体用アンダーフィルのアジア市場規模2017年-2028年：中国、日本、韓国、インド、東南アジア、オーストラリア ・半導体用アンダーフィルの南米市場規模2017年-2028年：ブラジル、アルゼンチン ・半導体用アンダーフィルの中東・アフリカ市場規模2017年-2028年：サウジアラビア、トルコ、エジプト、南アフリカ ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論

The Underfills for Semiconductor market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Underfills for Semiconductor market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. Industrial Electronics accounting for % of the Underfills for Semiconductor global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Chip-on-film Underfills segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Underfills for Semiconductor include Panasonic, Master Bond, Henkel, LORD Corporation, and NAMICS, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Underfills for Semiconductor market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Chip-on-film Underfills
Flip Chip Underfills
CSP/BGA Board Level Underfills
Market segment by Application can be divided into
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
The key market players for global Underfills for Semiconductor market are listed below:
Panasonic
Master Bond
Henkel
LORD Corporation
NAMICS
Shin-Etsu
PolyScience
United Adhesives
Nagase ChemteX
DELO
AIM Solder
Panacol-Elosol
Hitachi Chemical
Zymet
HERCEP
Aigeer
Jinledun
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Underfills for Semiconductor product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Underfills for Semiconductor, with price, sales, revenue and global market share of Underfills for Semiconductor from 2019 to 2022.
Chapter 3, the Underfills for Semiconductor competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Underfills for Semiconductor breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Underfills for Semiconductor market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Underfills for Semiconductor.
Chapter 13, 14, and 15, to describe Underfills for Semiconductor sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

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1 Market Overview
1.1 Underfills for Semiconductor Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Underfills for Semiconductor Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Chip-on-film Underfills
1.2.3 Flip Chip Underfills
1.2.4 CSP/BGA Board Level Underfills
1.3 Market Analysis by Application
1.3.1 Overview: Global Underfills for Semiconductor Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Industrial Electronics
1.3.3 Defense & Aerospace Electronics
1.3.4 Consumer Electronics
1.3.5 Automotive Electronics
1.3.6 Medical Electronics
1.3.7 Others
1.4 Global Underfills for Semiconductor Market Size & Forecast
1.4.1 Global Underfills for Semiconductor Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Underfills for Semiconductor Sales in Volume (2017-2028)
1.4.3 Global Underfills for Semiconductor Price (2017-2028)
1.5 Global Underfills for Semiconductor Production Capacity Analysis
1.5.1 Global Underfills for Semiconductor Total Production Capacity (2017-2028)
1.5.2 Global Underfills for Semiconductor Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Underfills for Semiconductor Market Drivers
1.6.2 Underfills for Semiconductor Market Restraints
1.6.3 Underfills for Semiconductor Trends Analysis
2 Manufacturers Profiles
2.1 Panasonic
2.1.1 Panasonic Details
2.1.2 Panasonic Major Business
2.1.3 Panasonic Underfills for Semiconductor Product and Services
2.1.4 Panasonic Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Master Bond
2.2.1 Master Bond Details
2.2.2 Master Bond Major Business
2.2.3 Master Bond Underfills for Semiconductor Product and Services
2.2.4 Master Bond Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Henkel
2.3.1 Henkel Details
2.3.2 Henkel Major Business
2.3.3 Henkel Underfills for Semiconductor Product and Services
2.3.4 Henkel Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 LORD Corporation
2.4.1 LORD Corporation Details
2.4.2 LORD Corporation Major Business
2.4.3 LORD Corporation Underfills for Semiconductor Product and Services
2.4.4 LORD Corporation Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 NAMICS
2.5.1 NAMICS Details
2.5.2 NAMICS Major Business
2.5.3 NAMICS Underfills for Semiconductor Product and Services
2.5.4 NAMICS Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Shin-Etsu
2.6.1 Shin-Etsu Details
2.6.2 Shin-Etsu Major Business
2.6.3 Shin-Etsu Underfills for Semiconductor Product and Services
2.6.4 Shin-Etsu Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 PolyScience
2.7.1 PolyScience Details
2.7.2 PolyScience Major Business
2.7.3 PolyScience Underfills for Semiconductor Product and Services
2.7.4 PolyScience Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 United Adhesives
2.8.1 United Adhesives Details
2.8.2 United Adhesives Major Business
2.8.3 United Adhesives Underfills for Semiconductor Product and Services
2.8.4 United Adhesives Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Nagase ChemteX
2.9.1 Nagase ChemteX Details
2.9.2 Nagase ChemteX Major Business
2.9.3 Nagase ChemteX Underfills for Semiconductor Product and Services
2.9.4 Nagase ChemteX Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 DELO
2.10.1 DELO Details
2.10.2 DELO Major Business
2.10.3 DELO Underfills for Semiconductor Product and Services
2.10.4 DELO Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 AIM Solder
2.11.1 AIM Solder Details
2.11.2 AIM Solder Major Business
2.11.3 AIM Solder Underfills for Semiconductor Product and Services
2.11.4 AIM Solder Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 Panacol-Elosol
2.12.1 Panacol-Elosol Details
2.12.2 Panacol-Elosol Major Business
2.12.3 Panacol-Elosol Underfills for Semiconductor Product and Services
2.12.4 Panacol-Elosol Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 Hitachi Chemical
2.13.1 Hitachi Chemical Details
2.13.2 Hitachi Chemical Major Business
2.13.3 Hitachi Chemical Underfills for Semiconductor Product and Services
2.13.4 Hitachi Chemical Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.14 Zymet
2.14.1 Zymet Details
2.14.2 Zymet Major Business
2.14.3 Zymet Underfills for Semiconductor Product and Services
2.14.4 Zymet Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.15 HERCEP
2.15.1 HERCEP Details
2.15.2 HERCEP Major Business
2.15.3 HERCEP Underfills for Semiconductor Product and Services
2.15.4 HERCEP Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.16 Aigeer
2.16.1 Aigeer Details
2.16.2 Aigeer Major Business
2.16.3 Aigeer Underfills for Semiconductor Product and Services
2.16.4 Aigeer Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.17 Jinledun
2.17.1 Jinledun Details
2.17.2 Jinledun Major Business
2.17.3 Jinledun Underfills for Semiconductor Product and Services
2.17.4 Jinledun Underfills for Semiconductor Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Underfills for Semiconductor Breakdown Data by Manufacturer
3.1 Global Underfills for Semiconductor Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Underfills for Semiconductor Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Underfills for Semiconductor
3.4 Market Concentration Rate
3.4.1 Top 3 Underfills for Semiconductor Manufacturer Market Share in 2021
3.4.2 Top 6 Underfills for Semiconductor Manufacturer Market Share in 2021
3.5 Global Underfills for Semiconductor Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Underfills for Semiconductor Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Underfills for Semiconductor Market Size by Region
4.1.1 Global Underfills for Semiconductor Sales in Volume by Region (2017-2028)
4.1.2 Global Underfills for Semiconductor Revenue by Region (2017-2028)
4.2 North America Underfills for Semiconductor Revenue (2017-2028)
4.3 Europe Underfills for Semiconductor Revenue (2017-2028)
4.4 Asia-Pacific Underfills for Semiconductor Revenue (2017-2028)
4.5 South America Underfills for Semiconductor Revenue (2017-2028)
4.6 Middle East and Africa Underfills for Semiconductor Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Underfills for Semiconductor Sales in Volume by Type (2017-2028)
5.2 Global Underfills for Semiconductor Revenue by Type (2017-2028)
5.3 Global Underfills for Semiconductor Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Underfills for Semiconductor Sales in Volume by Application (2017-2028)
6.2 Global Underfills for Semiconductor Revenue by Application (2017-2028)
6.3 Global Underfills for Semiconductor Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Underfills for Semiconductor Sales by Type (2017-2028)
7.2 North America Underfills for Semiconductor Sales by Application (2017-2028)
7.3 North America Underfills for Semiconductor Market Size by Country
7.3.1 North America Underfills for Semiconductor Sales in Volume by Country (2017-2028)
7.3.2 North America Underfills for Semiconductor Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Underfills for Semiconductor Sales by Type (2017-2028)
8.2 Europe Underfills for Semiconductor Sales by Application (2017-2028)
8.3 Europe Underfills for Semiconductor Market Size by Country
8.3.1 Europe Underfills for Semiconductor Sales in Volume by Country (2017-2028)
8.3.2 Europe Underfills for Semiconductor Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Underfills for Semiconductor Sales by Type (2017-2028)
9.2 Asia-Pacific Underfills for Semiconductor Sales by Application (2017-2028)
9.3 Asia-Pacific Underfills for Semiconductor Market Size by Region
9.3.1 Asia-Pacific Underfills for Semiconductor Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Underfills for Semiconductor Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Underfills for Semiconductor Sales by Type (2017-2028)
10.2 South America Underfills for Semiconductor Sales by Application (2017-2028)
10.3 South America Underfills for Semiconductor Market Size by Country
10.3.1 South America Underfills for Semiconductor Sales in Volume by Country (2017-2028)
10.3.2 South America Underfills for Semiconductor Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Underfills for Semiconductor Sales by Type (2017-2028)
11.2 Middle East & Africa Underfills for Semiconductor Sales by Application (2017-2028)
11.3 Middle East & Africa Underfills for Semiconductor Market Size by Country
11.3.1 Middle East & Africa Underfills for Semiconductor Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Underfills for Semiconductor Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Underfills for Semiconductor and Key Manufacturers
12.2 Manufacturing Costs Percentage of Underfills for Semiconductor
12.3 Underfills for Semiconductor Production Process
12.4 Underfills for Semiconductor Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Underfills for Semiconductor Typical Distributors
13.3 Underfills for Semiconductor Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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