▶ 調査レポート

世界のボンディング・露光装置市場予測(~2028年):露光装置、 ボンディング装置

• 英文タイトル:Global Bonding and Lithography Equipment Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

GlobalInfoResearchが調査・発行した産業分析レポートです。世界のボンディング・露光装置市場予測(~2028年):露光装置、 ボンディング装置 / Global Bonding and Lithography Equipment Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028 / GIR-22E5544資料のイメージです。• レポートコード:GIR-22E5544
• 出版社/出版日:GlobalInfoResearch / 2022年5月
• レポート形態:英文、PDF、103ページ
• 納品方法:Eメール(2~3営業日)
• 産業分類:産業機械&装置
• 販売価格(消費税別)
  Single User¥515,040 (USD3,480)▷ お問い合わせ
  Multi User¥772,560 (USD5,220)▷ お問い合わせ
  Corporate User¥1,030,080 (USD6,960)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
ボンディング・露光装置市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
GlobalInfoResearchの最新の調査によると、世界のボンディング・露光装置の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx%の成長率で成長すると予想されます。

ボンディング・露光装置市場は種類と用途によって区分されます。2017年~2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

種類別セグメントは次をカバーします。
・露光装置、 ボンディング装置

用途別セグメントは次のように区分されます。
・高度包装、MEMS・センサー、RF、LED、CIS、電源、その他

世界のボンディング・露光装置市場の主要な市場プレーヤーは以下のとおりです。
・EV Group、SUSS MicroTec、Tokyo Electron、AML、Mitsubishi、Ayumi Industry、SMEE、ASML、Nikon、Canon

地域別セグメントは次の地域・国をカバーします。
・北米(米国、カナダ、メキシコ)
・ヨーロッパ(ドイツ、フランス、イギリス、ロシア、イタリア)
・アジア太平洋(日本、中国、韓国、インド、東南アジア、オーストラリア)
・南アメリカ(ブラジル、アルゼンチン、コロンビア)
・中東およびアフリカ(サウジアラビア、UAE、エジプト、南アフリカ)

本調査レポートの内容は計15章あります。
・第1章では、ボンディング・露光装置製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要なボンディング・露光装置メーカーの企業概要、2019年~2022年までのボンディング・露光装置の価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要なボンディング・露光装置メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年~2028年までの地域別ボンディング・露光装置の販売量、売上、成長性を示しています。
・第5、6章では、2017年~2028年までのボンディング・露光装置の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年~2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年~2028年までの主要地域でのボンディング・露光装置市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、およびボンディング・露光装置の産業チェーンを掲載しています。
・第13、14、15章では、ボンディング・露光装置の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
・メーカー情報(企業概要、製品概要、販売量、価格、売上):EV Group、SUSS MicroTec、Tokyo Electron、AML、Mitsubishi、Ayumi Industry、SMEE、ASML、Nikon、Canon
・メーカー別市場シェア
・地域別市場分析2017年-2028年
・種類別分析2017年-2028年:露光装置、 ボンディング装置
・用途別分析2017年-2028年:高度包装、MEMS・センサー、RF、LED、CIS、電源、その他
・ボンディング・露光装置の北米市場規模2017年-2028年:アメリカ、カナダ、メキシコ
・ボンディング・露光装置のヨーロッパ市場規模2017年-2028年:ドイツ、イギリス、フランス、ロシア、イタリア
・ボンディング・露光装置のアジア市場規模2017年-2028年:中国、日本、韓国、インド、東南アジア、オーストラリア
・ボンディング・露光装置の南米市場規模2017年-2028年:ブラジル、アルゼンチン
・ボンディング・露光装置の中東・アフリカ市場規模2017年-2028年:サウジアラビア、トルコ、エジプト、南アフリカ
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Bonding and Lithography Equipment market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Bonding and Lithography Equipment market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period. Advanced Packaging accounting for % of the Bonding and Lithography Equipment global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Lithography Equipment segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Bonding and Lithography Equipment include EV Group, SUSS MicroTec, Tokyo Electron, AML, and Mitsubishi, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Bonding and Lithography Equipment market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Lithography Equipment
Bonding Equipment
Market segment by Application can be divided into
Advanced Packaging
MEMS & Sensors
RF
LED
CIS
Power
Other
The key market players for global Bonding and Lithography Equipment market are listed below:
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
ASML
Nikon
Canon
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Bonding and Lithography Equipment product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Bonding and Lithography Equipment, with price, sales, revenue and global market share of Bonding and Lithography Equipment from 2019 to 2022.
Chapter 3, the Bonding and Lithography Equipment competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Bonding and Lithography Equipment breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Bonding and Lithography Equipment market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Bonding and Lithography Equipment.
Chapter 13, 14, and 15, to describe Bonding and Lithography Equipment sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

1 Market Overview
1.1 Bonding and Lithography Equipment Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Bonding and Lithography Equipment Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Lithography Equipment
1.2.3 Bonding Equipment
1.3 Market Analysis by Application
1.3.1 Overview: Global Bonding and Lithography Equipment Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Advanced Packaging
1.3.3 MEMS & Sensors
1.3.4 RF
1.3.5 LED
1.3.6 CIS
1.3.7 Power
1.3.8 Other
1.4 Global Bonding and Lithography Equipment Market Size & Forecast
1.4.1 Global Bonding and Lithography Equipment Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Bonding and Lithography Equipment Sales in Volume (2017-2028)
1.4.3 Global Bonding and Lithography Equipment Price (2017-2028)
1.5 Global Bonding and Lithography Equipment Production Capacity Analysis
1.5.1 Global Bonding and Lithography Equipment Total Production Capacity (2017-2028)
1.5.2 Global Bonding and Lithography Equipment Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Bonding and Lithography Equipment Market Drivers
1.6.2 Bonding and Lithography Equipment Market Restraints
1.6.3 Bonding and Lithography Equipment Trends Analysis
2 Manufacturers Profiles
2.1 EV Group
2.1.1 EV Group Details
2.1.2 EV Group Major Business
2.1.3 EV Group Bonding and Lithography Equipment Product and Services
2.1.4 EV Group Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 SUSS MicroTec
2.2.1 SUSS MicroTec Details
2.2.2 SUSS MicroTec Major Business
2.2.3 SUSS MicroTec Bonding and Lithography Equipment Product and Services
2.2.4 SUSS MicroTec Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Tokyo Electron
2.3.1 Tokyo Electron Details
2.3.2 Tokyo Electron Major Business
2.3.3 Tokyo Electron Bonding and Lithography Equipment Product and Services
2.3.4 Tokyo Electron Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 AML
2.4.1 AML Details
2.4.2 AML Major Business
2.4.3 AML Bonding and Lithography Equipment Product and Services
2.4.4 AML Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Mitsubishi
2.5.1 Mitsubishi Details
2.5.2 Mitsubishi Major Business
2.5.3 Mitsubishi Bonding and Lithography Equipment Product and Services
2.5.4 Mitsubishi Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Ayumi Industry
2.6.1 Ayumi Industry Details
2.6.2 Ayumi Industry Major Business
2.6.3 Ayumi Industry Bonding and Lithography Equipment Product and Services
2.6.4 Ayumi Industry Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 SMEE
2.7.1 SMEE Details
2.7.2 SMEE Major Business
2.7.3 SMEE Bonding and Lithography Equipment Product and Services
2.7.4 SMEE Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 ASML
2.8.1 ASML Details
2.8.2 ASML Major Business
2.8.3 ASML Bonding and Lithography Equipment Product and Services
2.8.4 ASML Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Nikon
2.9.1 Nikon Details
2.9.2 Nikon Major Business
2.9.3 Nikon Bonding and Lithography Equipment Product and Services
2.9.4 Nikon Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Canon
2.10.1 Canon Details
2.10.2 Canon Major Business
2.10.3 Canon Bonding and Lithography Equipment Product and Services
2.10.4 Canon Bonding and Lithography Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Bonding and Lithography Equipment Breakdown Data by Manufacturer
3.1 Global Bonding and Lithography Equipment Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Bonding and Lithography Equipment Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Bonding and Lithography Equipment
3.4 Market Concentration Rate
3.4.1 Top 3 Bonding and Lithography Equipment Manufacturer Market Share in 2021
3.4.2 Top 6 Bonding and Lithography Equipment Manufacturer Market Share in 2021
3.5 Global Bonding and Lithography Equipment Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Bonding and Lithography Equipment Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Bonding and Lithography Equipment Market Size by Region
4.1.1 Global Bonding and Lithography Equipment Sales in Volume by Region (2017-2028)
4.1.2 Global Bonding and Lithography Equipment Revenue by Region (2017-2028)
4.2 North America Bonding and Lithography Equipment Revenue (2017-2028)
4.3 Europe Bonding and Lithography Equipment Revenue (2017-2028)
4.4 Asia-Pacific Bonding and Lithography Equipment Revenue (2017-2028)
4.5 South America Bonding and Lithography Equipment Revenue (2017-2028)
4.6 Middle East and Africa Bonding and Lithography Equipment Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Bonding and Lithography Equipment Sales in Volume by Type (2017-2028)
5.2 Global Bonding and Lithography Equipment Revenue by Type (2017-2028)
5.3 Global Bonding and Lithography Equipment Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Bonding and Lithography Equipment Sales in Volume by Application (2017-2028)
6.2 Global Bonding and Lithography Equipment Revenue by Application (2017-2028)
6.3 Global Bonding and Lithography Equipment Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Bonding and Lithography Equipment Sales by Type (2017-2028)
7.2 North America Bonding and Lithography Equipment Sales by Application (2017-2028)
7.3 North America Bonding and Lithography Equipment Market Size by Country
7.3.1 North America Bonding and Lithography Equipment Sales in Volume by Country (2017-2028)
7.3.2 North America Bonding and Lithography Equipment Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Bonding and Lithography Equipment Sales by Type (2017-2028)
8.2 Europe Bonding and Lithography Equipment Sales by Application (2017-2028)
8.3 Europe Bonding and Lithography Equipment Market Size by Country
8.3.1 Europe Bonding and Lithography Equipment Sales in Volume by Country (2017-2028)
8.3.2 Europe Bonding and Lithography Equipment Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Bonding and Lithography Equipment Sales by Type (2017-2028)
9.2 Asia-Pacific Bonding and Lithography Equipment Sales by Application (2017-2028)
9.3 Asia-Pacific Bonding and Lithography Equipment Market Size by Region
9.3.1 Asia-Pacific Bonding and Lithography Equipment Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Bonding and Lithography Equipment Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Bonding and Lithography Equipment Sales by Type (2017-2028)
10.2 South America Bonding and Lithography Equipment Sales by Application (2017-2028)
10.3 South America Bonding and Lithography Equipment Market Size by Country
10.3.1 South America Bonding and Lithography Equipment Sales in Volume by Country (2017-2028)
10.3.2 South America Bonding and Lithography Equipment Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Bonding and Lithography Equipment Sales by Type (2017-2028)
11.2 Middle East & Africa Bonding and Lithography Equipment Sales by Application (2017-2028)
11.3 Middle East & Africa Bonding and Lithography Equipment Market Size by Country
11.3.1 Middle East & Africa Bonding and Lithography Equipment Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Bonding and Lithography Equipment Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Bonding and Lithography Equipment and Key Manufacturers
12.2 Manufacturing Costs Percentage of Bonding and Lithography Equipment
12.3 Bonding and Lithography Equipment Production Process
12.4 Bonding and Lithography Equipment Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Bonding and Lithography Equipment Typical Distributors
13.3 Bonding and Lithography Equipment Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer