【市場調査レポート】ウェーハバンピングのグローバル市場インサイト・予測（～2028年）

• 英文タイトル：Global Wafer Bumping Market Insights, Forecast to 2028

QYResearchが調査・発行した産業分析レポートです。ウェーハバンピングのグローバル市場インサイト・予測（～2028年） / Global Wafer Bumping Market Insights, Forecast to 2028 / QY2207E05188資料のイメージです。

• レポートコード：QY2207E05188
• 出版社/出版日：QYResearch / 2022年7月
• レポート形態：英文、PDF、112ページ
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レポート概要

新型コロナウイルス感染症のパンデミックにより、世界のウェーハバンピングの市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にウェーハバンピングの世界市場のxxx％を占める「銅柱バンプ」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「4&6インチ」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。
中国のウェーハバンピングの市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパのウェーハバンピング市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパのウェーハバンピング市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。

ウェーハバンピングのグローバル主要メーカーには、ASE Global、Fujitsu、Amkor Technology、MacDermid Alpha Electronics Solutions、Maxell、JCET Group、Unisem Group、Powertech Technology、SFA Semicon、Semi-Pac Inc、ChipMOS TECHNOLOGIES、NEPES、TI、International Micro Industries、Raytek Semiconductor、Jiangsu CAS Microelectronics Integrationなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

ウェーハバンピング市場は、種類と用途によって区分されます。世界のウェーハバンピング市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
銅柱バンプ、鉛フリーバンプ、その他

【用途別セグメント】
4&6インチ、8&12インチ

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- ウェーハバンピング製品概要
- 種類別市場（銅柱バンプ、鉛フリーバンプ、その他）
- 用途別市場（4&6インチ、8&12インチ）
- 調査の目的
・エグゼクティブサマリー
- 世界のウェーハバンピング販売量予測2017-2028
- 世界のウェーハバンピング売上予測2017-2028
- ウェーハバンピングの地域別販売量
- ウェーハバンピングの地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別ウェーハバンピング販売量
- 主要メーカー別ウェーハバンピング売上
- 主要メーカー別ウェーハバンピング価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模（銅柱バンプ、鉛フリーバンプ、その他）
- ウェーハバンピングの種類別販売量
- ウェーハバンピングの種類別売上
- ウェーハバンピングの種類別価格
・用途別市場規模（4&6インチ、8&12インチ）
- ウェーハバンピングの用途別販売量
- ウェーハバンピングの用途別売上
- ウェーハバンピングの用途別価格
・北米市場
- 北米のウェーハバンピング市場規模（種類別、用途別）
- 主要国別のウェーハバンピング市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパのウェーハバンピング市場規模（種類別、用途別）
- 主要国別のウェーハバンピング市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋のウェーハバンピング市場規模（種類別、用途別）
- 主要国別のウェーハバンピング市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米のウェーハバンピング市場規模（種類別、用途別）
- 主要国別のウェーハバンピング市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカのウェーハバンピング市場規模（種類別、用途別）
- 主要国別のウェーハバンピング市場規模（トルコ、サウジアラビア）
・企業情報
ASE Global、Fujitsu、Amkor Technology、MacDermid Alpha Electronics Solutions、Maxell、JCET Group、Unisem Group、Powertech Technology、SFA Semicon、Semi-Pac Inc、ChipMOS TECHNOLOGIES、NEPES、TI、International Micro Industries、Raytek Semiconductor、Jiangsu CAS Microelectronics Integration
・産業チェーン及び販売チャネル分析
- ウェーハバンピングの産業チェーン分析
- ウェーハバンピングの原材料
- ウェーハバンピングの生産プロセス
- ウェーハバンピングの販売及びマーケティング
- ウェーハバンピングの主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- ウェーハバンピングの産業動向
- ウェーハバンピングのマーケットドライバー
- ウェーハバンピングの課題
- ウェーハバンピングの阻害要因
・主な調査結果

Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.
Market Analysis and Insights: Global Wafer Bumping Market
The global Wafer Bumping market size is projected to reach US$ million by 2028, from US$ million in 2021, at a CAGR of % during 2022-2028.
Fully considering the economic change by this health crisis, Copper Pillar Bump accounting for % of the Wafer Bumping global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While 4&6 Inch segment is altered to an % CAGR throughout this forecast period.
China Wafer Bumping market size is valued at US$ million in 2021, while the North America and Europe Wafer Bumping are US$ million and US$ million, severally. The proportion of the North America is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Wafer Bumping landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Wafer Bumping market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Wafer Bumping market in terms of revenue.
Overall, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Wafer Bumping market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Wafer Bumping market.
Global Wafer Bumping Scope and Market Size
Wafer Bumping market is segmented by players, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Wafer Bumping market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Copper Pillar Bump
Lead Free Bump
Others
Segment by Application
4&6 Inch
8&12 Inch
By Company
ASE Global
Fujitsu
Amkor Technology
MacDermid Alpha Electronics Solutions
Maxell
JCET Group
Unisem Group
Powertech Technology
SFA Semicon
Semi-Pac Inc
ChipMOS TECHNOLOGIES
NEPES
TI
International Micro Industries
Raytek Semiconductor
Jiangsu CAS Microelectronics Integration
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

レポート目次

1 Report Business Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Bumping Market Size Growth Rate by Type, 2017 VS 2021 VS 2028
1.2.2 Copper Pillar Bump
1.2.3 Lead Free Bump
1.2.4 Others
1.3 Market by Application
1.3.1 Global Wafer Bumping Market Size Growth Rate by Application, 2017 VS 2021 VS 2028
1.3.2 4&6 Inch
1.3.3 8&12 Inch
1.4 Study Objectives
1.5 Years Considered
2 Global Growth Trends
2.1 Global Wafer Bumping Market Perspective (2017-2028)
2.2 Wafer Bumping Growth Trends by Region
2.2.1 Wafer Bumping Market Size by Region: 2017 VS 2021 VS 2028
2.2.2 Wafer Bumping Historic Market Size by Region (2017-2022)
2.2.3 Wafer Bumping Forecasted Market Size by Region (2023-2028)
2.3 Wafer Bumping Market Dynamics
2.3.1 Wafer Bumping Industry Trends
2.3.2 Wafer Bumping Market Drivers
2.3.3 Wafer Bumping Market Challenges
2.3.4 Wafer Bumping Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Wafer Bumping Players by Revenue
3.1.1 Global Top Wafer Bumping Players by Revenue (2017-2022)
3.1.2 Global Wafer Bumping Revenue Market Share by Players (2017-2022)
3.2 Global Wafer Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Wafer Bumping Revenue
3.4 Global Wafer Bumping Market Concentration Ratio
3.4.1 Global Wafer Bumping Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Wafer Bumping Revenue in 2021
3.5 Wafer Bumping Key Players Head office and Area Served
3.6 Key Players Wafer Bumping Product Solution and Service
3.7 Date of Enter into Wafer Bumping Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer Bumping Breakdown Data by Type
4.1 Global Wafer Bumping Historic Market Size by Type (2017-2022)
4.2 Global Wafer Bumping Forecasted Market Size by Type (2023-2028)
5 Wafer Bumping Breakdown Data by Application
5.1 Global Wafer Bumping Historic Market Size by Application (2017-2022)
5.2 Global Wafer Bumping Forecasted Market Size by Application (2023-2028)
6 North America
6.1 North America Wafer Bumping Market Size (2017-2028)
6.2 North America Wafer Bumping Market Size by Type
6.2.1 North America Wafer Bumping Market Size by Type (2017-2022)
6.2.2 North America Wafer Bumping Market Size by Type (2023-2028)
6.2.3 North America Wafer Bumping Market Share by Type (2017-2028)
6.3 North America Wafer Bumping Market Size by Application
6.3.1 North America Wafer Bumping Market Size by Application (2017-2022)
6.3.2 North America Wafer Bumping Market Size by Application (2023-2028)
6.3.3 North America Wafer Bumping Market Share by Application (2017-2028)
6.4 North America Wafer Bumping Market Size by Country
6.4.1 North America Wafer Bumping Market Size by Country (2017-2022)
6.4.2 North America Wafer Bumping Market Size by Country (2023-2028)
6.4.3 United States
6.4.4 Canada
7 Europe
7.1 Europe Wafer Bumping Market Size (2017-2028)
7.2 Europe Wafer Bumping Market Size by Type
7.2.1 Europe Wafer Bumping Market Size by Type (2017-2022)
7.2.2 Europe Wafer Bumping Market Size by Type (2023-2028)
7.2.3 Europe Wafer Bumping Market Share by Type (2017-2028)
7.3 Europe Wafer Bumping Market Size by Application
7.3.1 Europe Wafer Bumping Market Size by Application (2017-2022)
7.3.2 Europe Wafer Bumping Market Size by Application (2023-2028)
7.3.3 Europe Wafer Bumping Market Share by Application (2017-2028)
7.4 Europe Wafer Bumping Market Size by Country
7.4.1 Europe Wafer Bumping Market Size by Country (2017-2022)
7.4.2 Europe Wafer Bumping Market Size by Country (2023-2028)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Wafer Bumping Market Size (2017-2028)
8.2 Asia-Pacific Wafer Bumping Market Size by Type
8.2.1 Asia-Pacific Wafer Bumping Market Size by Type (2017-2022)
8.2.2 Asia-Pacific Wafer Bumping Market Size by Type (2023-2028)
8.2.3 Asia-Pacific Wafer Bumping Market Share by Type (2017-2028)
8.3 Asia-Pacific Wafer Bumping Market Size by Application
8.3.1 Asia-Pacific Wafer Bumping Market Size by Application (2017-2022)
8.3.2 Asia-Pacific Wafer Bumping Market Size by Application (2023-2028)
8.3.3 Asia-Pacific Wafer Bumping Market Share by Application (2017-2028)
8.4 Asia-Pacific Wafer Bumping Market Size by Region
8.4.1 Asia-Pacific Wafer Bumping Market Size by Region (2017-2022)
8.4.2 Asia-Pacific Wafer Bumping Market Size by Region (2023-2028)
8.4.3 China
8.4.4 Japan
8.4.5 South Korea
8.4.6 Southeast Asia
8.4.7 India
8.4.8 Australia
9 Latin America
9.1 Latin America Wafer Bumping Market Size (2017-2028)
9.2 Latin America Wafer Bumping Market Size by Type
9.2.1 Latin America Wafer Bumping Market Size by Type (2017-2022)
9.2.2 Latin America Wafer Bumping Market Size by Type (2023-2028)
9.2.3 Latin America Wafer Bumping Market Share by Type (2017-2028)
9.3 Latin America Wafer Bumping Market Size by Application
9.3.1 Latin America Wafer Bumping Market Size by Application (2017-2022)
9.3.2 Latin America Wafer Bumping Market Size by Application (2023-2028)
9.3.3 Latin America Wafer Bumping Market Share by Application (2017-2028)
9.4 Latin America Wafer Bumping Market Size by Country
9.4.1 Latin America Wafer Bumping Market Size by Country (2017-2022)
9.4.2 Latin America Wafer Bumping Market Size by Country (2023-2028)
9.4.3 Mexico
9.4.4 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Wafer Bumping Market Size (2017-2028)
10.2 Middle East & Africa Wafer Bumping Market Size by Type
10.2.1 Middle East & Africa Wafer Bumping Market Size by Type (2017-2022)
10.2.2 Middle East & Africa Wafer Bumping Market Size by Type (2023-2028)
10.2.3 Middle East & Africa Wafer Bumping Market Share by Type (2017-2028)
10.3 Middle East & Africa Wafer Bumping Market Size by Application
10.3.1 Middle East & Africa Wafer Bumping Market Size by Application (2017-2022)
10.3.2 Middle East & Africa Wafer Bumping Market Size by Application (2023-2028)
10.3.3 Middle East & Africa Wafer Bumping Market Share by Application (2017-2028)
10.4 Middle East & Africa Wafer Bumping Market Size by Country
10.4.1 Middle East & Africa Wafer Bumping Market Size by Country (2017-2022)
10.4.2 Middle East & Africa Wafer Bumping Market Size by Country (2023-2028)
10.4.3 Turkey
10.4.4 Saudi Arabia
10.4.5 UAE
11 Key Players Profiles
11.1 ASE Global
11.1.1 ASE Global Company Details
11.1.2 ASE Global Business Overview
11.1.3 ASE Global Wafer Bumping Introduction
11.1.4 ASE Global Revenue in Wafer Bumping Business (2017-2022)
11.1.5 ASE Global Recent Developments
11.2 Fujitsu
11.2.1 Fujitsu Company Details
11.2.2 Fujitsu Business Overview
11.2.3 Fujitsu Wafer Bumping Introduction
11.2.4 Fujitsu Revenue in Wafer Bumping Business (2017-2022)
11.2.5 Fujitsu Recent Developments
11.3 Amkor Technology
11.3.1 Amkor Technology Company Details
11.3.2 Amkor Technology Business Overview
11.3.3 Amkor Technology Wafer Bumping Introduction
11.3.4 Amkor Technology Revenue in Wafer Bumping Business (2017-2022)
11.3.5 Amkor Technology Recent Developments
11.4 MacDermid Alpha Electronics Solutions
11.4.1 MacDermid Alpha Electronics Solutions Company Details
11.4.2 MacDermid Alpha Electronics Solutions Business Overview
11.4.3 MacDermid Alpha Electronics Solutions Wafer Bumping Introduction
11.4.4 MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2017-2022)
11.4.5 MacDermid Alpha Electronics Solutions Recent Developments
11.5 Maxell
11.5.1 Maxell Company Details
11.5.2 Maxell Business Overview
11.5.3 Maxell Wafer Bumping Introduction
11.5.4 Maxell Revenue in Wafer Bumping Business (2017-2022)
11.5.5 Maxell Recent Developments
11.6 JCET Group
11.6.1 JCET Group Company Details
11.6.2 JCET Group Business Overview
11.6.3 JCET Group Wafer Bumping Introduction
11.6.4 JCET Group Revenue in Wafer Bumping Business (2017-2022)
11.6.5 JCET Group Recent Developments
11.7 Unisem Group
11.7.1 Unisem Group Company Details
11.7.2 Unisem Group Business Overview
11.7.3 Unisem Group Wafer Bumping Introduction
11.7.4 Unisem Group Revenue in Wafer Bumping Business (2017-2022)
11.7.5 Unisem Group Recent Developments
11.8 Powertech Technology
11.8.1 Powertech Technology Company Details
11.8.2 Powertech Technology Business Overview
11.8.3 Powertech Technology Wafer Bumping Introduction
11.8.4 Powertech Technology Revenue in Wafer Bumping Business (2017-2022)
11.8.5 Powertech Technology Recent Developments
11.9 SFA Semicon
11.9.1 SFA Semicon Company Details
11.9.2 SFA Semicon Business Overview
11.9.3 SFA Semicon Wafer Bumping Introduction
11.9.4 SFA Semicon Revenue in Wafer Bumping Business (2017-2022)
11.9.5 SFA Semicon Recent Developments
11.10 Semi-Pac Inc
11.10.1 Semi-Pac Inc Company Details
11.10.2 Semi-Pac Inc Business Overview
11.10.3 Semi-Pac Inc Wafer Bumping Introduction
11.10.4 Semi-Pac Inc Revenue in Wafer Bumping Business (2017-2022)
11.10.5 Semi-Pac Inc Recent Developments
11.11 ChipMOS TECHNOLOGIES
11.11.1 ChipMOS TECHNOLOGIES Company Details
11.11.2 ChipMOS TECHNOLOGIES Business Overview
11.11.3 ChipMOS TECHNOLOGIES Wafer Bumping Introduction
11.11.4 ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2017-2022)
11.11.5 ChipMOS TECHNOLOGIES Recent Developments
11.12 NEPES
11.12.1 NEPES Company Details
11.12.2 NEPES Business Overview
11.12.3 NEPES Wafer Bumping Introduction
11.12.4 NEPES Revenue in Wafer Bumping Business (2017-2022)
11.12.5 NEPES Recent Developments
11.13 TI
11.13.1 TI Company Details
11.13.2 TI Business Overview
11.13.3 TI Wafer Bumping Introduction
11.13.4 TI Revenue in Wafer Bumping Business (2017-2022)
11.13.5 TI Recent Developments
11.14 International Micro Industries
11.14.1 International Micro Industries Company Details
11.14.2 International Micro Industries Business Overview
11.14.3 International Micro Industries Wafer Bumping Introduction
11.14.4 International Micro Industries Revenue in Wafer Bumping Business (2017-2022)
11.14.5 International Micro Industries Recent Developments
11.15 Raytek Semiconductor
11.15.1 Raytek Semiconductor Company Details
11.15.2 Raytek Semiconductor Business Overview
11.15.3 Raytek Semiconductor Wafer Bumping Introduction
11.15.4 Raytek Semiconductor Revenue in Wafer Bumping Business (2017-2022)
11.15.5 Raytek Semiconductor Recent Developments
11.16 Jiangsu CAS Microelectronics Integration
11.16.1 Jiangsu CAS Microelectronics Integration Company Details
11.16.2 Jiangsu CAS Microelectronics Integration Business Overview
11.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Introduction
11.16.4 Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2017-2022)
11.16.5 Jiangsu CAS Microelectronics Integration Recent Developments
12 Analyst’s Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Author Details
13.3 Disclaimer

List of Tables
Table 1. Global Wafer Bumping Market Size Growth Rate by Type (US$ Million), 2017 VS 2021 VS 2028
Table 2. Key Players of Copper Pillar Bump
Table 3. Key Players of Lead Free Bump
Table 4. Key Players of Others
Table 5. Global Wafer Bumping Market Size Growth Rate by Application (US$ Million), 2017 VS 2021 VS 2028
Table 6. Global Wafer Bumping Market Size by Region (US$ Million): 2017 VS 2021 VS 2028
Table 7. Global Wafer Bumping Market Size by Region (2017-2022) & (US$ Million)
Table 8. Global Wafer Bumping Market Share by Region (2017-2022)
Table 9. Global Wafer Bumping Forecasted Market Size by Region (2023-2028) & (US$ Million)
Table 10. Global Wafer Bumping Market Share by Region (2023-2028)
Table 11. Wafer Bumping Market Trends
Table 12. Wafer Bumping Market Drivers
Table 13. Wafer Bumping Market Challenges
Table 14. Wafer Bumping Market Restraints
Table 15. Global Wafer Bumping Revenue by Players (2017-2022) & (US$ Million)
Table 16. Global Wafer Bumping Revenue Share by Players (2017-2022)
Table 17. Global Top Wafer Bumping by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2021)
Table 18. Ranking of Global Top Wafer Bumping Companies by Revenue (US$ Million) in 2021
Table 19. Global 5 Largest Players Market Share by Wafer Bumping Revenue (CR5 and HHI) & (2017-2022)
Table 20. Key Players Headquarters and Area Served
Table 21. Key Players Wafer Bumping Product Solution and Service
Table 22. Date of Enter into Wafer Bumping Market
Table 23. Mergers & Acquisitions, Expansion Plans
Table 24. Global Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 25. Global Wafer Bumping Revenue Market Share by Type (2017-2022)
Table 26. Global Wafer Bumping Forecasted Market Size by Type (2023-2028) & (US$ Million)
Table 27. Global Wafer Bumping Revenue Market Share by Type (2023-2028)
Table 28. Global Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 29. Global Wafer Bumping Revenue Share by Application (2017-2022)
Table 30. Global Wafer Bumping Forecasted Market Size by Application (2023-2028) & (US$ Million)
Table 31. Global Wafer Bumping Revenue Share by Application (2023-2028)
Table 32. North America Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 33. North America Wafer Bumping Market Size by Type (2023-2028) & (US$ Million)
Table 34. North America Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 35. North America Wafer Bumping Market Size by Application (2023-2028) & (US$ Million)
Table 36. North America Wafer Bumping Market Size by Country (2017-2022) & (US$ Million)
Table 37. North America Wafer Bumping Market Size by Country (2023-2028) & (US$ Million)
Table 38. Europe Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 39. Europe Wafer Bumping Market Size by Type (2023-2028) & (US$ Million)
Table 40. Europe Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 41. Europe Wafer Bumping Market Size by Application (2023-2028) & (US$ Million)
Table 42. Europe Wafer Bumping Market Size by Country (2017-2022) & (US$ Million)
Table 43. Europe Wafer Bumping Market Size by Country (2023-2028) & (US$ Million)
Table 44. Asia Pacific Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 45. Asia Pacific Wafer Bumping Market Size by Type (2023-2028) & (US$ Million)
Table 46. Asia Pacific Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 47. Asia Pacific Wafer Bumping Market Size by Application (2023-2028) & (US$ Million)
Table 48. Asia Pacific Wafer Bumping Market Size by Region (2017-2022) & (US$ Million)
Table 49. Asia Pacific Wafer Bumping Market Size by Region (2023-2028) & (US$ Million)
Table 50. Latin America Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 51. Latin America Wafer Bumping Market Size by Type (2023-2028) & (US$ Million)
Table 52. Latin America Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 53. Latin America Wafer Bumping Market Size by Application (2023-2028) & (US$ Million)
Table 54. Latin America Wafer Bumping Market Size by Country (2017-2022) & (US$ Million)
Table 55. Latin America Wafer Bumping Market Size by Country (2023-2028) & (US$ Million)
Table 56. Middle East and Africa Wafer Bumping Market Size by Type (2017-2022) & (US$ Million)
Table 57. Middle East and Africa Wafer Bumping Market Size by Type (2023-2028) & (US$ Million)
Table 58. Middle East and Africa Wafer Bumping Market Size by Application (2017-2022) & (US$ Million)
Table 59. Middle East and Africa Wafer Bumping Market Size by Application (2023-2028) & (US$ Million)
Table 60. Middle East and Africa Wafer Bumping Market Size by Country (2017-2022) & (US$ Million)
Table 61. Middle East and Africa Wafer Bumping Market Size by Country (2023-2028) & (US$ Million)
Table 62. ASE Global Company Details
Table 63. ASE Global Business Overview
Table 64. ASE Global Wafer Bumping Product
Table 65. ASE Global Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 66. ASE Global Recent Developments
Table 67. Fujitsu Company Details
Table 68. Fujitsu Business Overview
Table 69. Fujitsu Wafer Bumping Product
Table 70. Fujitsu Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 71. Fujitsu Recent Developments
Table 72. Amkor Technology Company Details
Table 73. Amkor Technology Business Overview
Table 74. Amkor Technology Wafer Bumping Product
Table 75. Amkor Technology Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 76. Amkor Technology Recent Developments
Table 77. MacDermid Alpha Electronics Solutions Company Details
Table 78. MacDermid Alpha Electronics Solutions Business Overview
Table 79. MacDermid Alpha Electronics Solutions Wafer Bumping Product
Table 80. MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 81. MacDermid Alpha Electronics Solutions Recent Developments
Table 82. Maxell Company Details
Table 83. Maxell Business Overview
Table 84. Maxell Wafer Bumping Product
Table 85. Maxell Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 86. Maxell Recent Developments
Table 87. JCET Group Company Details
Table 88. JCET Group Business Overview
Table 89. JCET Group Wafer Bumping Product
Table 90. JCET Group Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 91. JCET Group Recent Developments
Table 92. Unisem Group Company Details
Table 93. Unisem Group Business Overview
Table 94. Unisem Group Wafer Bumping Product
Table 95. Unisem Group Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 96. Unisem Group Recent Developments
Table 97. Powertech Technology Company Details
Table 98. Powertech Technology Business Overview
Table 99. Powertech Technology Wafer Bumping Product
Table 100. Powertech Technology Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 101. Powertech Technology Recent Developments
Table 102. SFA Semicon Company Details
Table 103. SFA Semicon Business Overview
Table 104. SFA Semicon Wafer Bumping Product
Table 105. SFA Semicon Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 106. SFA Semicon Recent Developments
Table 107. Semi-Pac Inc Company Details
Table 108. Semi-Pac Inc Business Overview
Table 109. Semi-Pac Inc Wafer Bumping Product
Table 110. Semi-Pac Inc Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 111. Semi-Pac Inc Recent Developments
Table 112. ChipMOS TECHNOLOGIES Company Details
Table 113. ChipMOS TECHNOLOGIES Business Overview
Table 114. ChipMOS TECHNOLOGIES Wafer Bumping Product
Table 115. ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 116. ChipMOS TECHNOLOGIES Recent Developments
Table 117. NEPES Company Details
Table 118. NEPES Business Overview
Table 119. NEPES Wafer Bumping Product
Table 120. NEPES Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 121. NEPES Recent Developments
Table 122. TI Company Details
Table 123. TI Business Overview
Table 124. TI Wafer Bumping Product
Table 125. TI Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 126. TI Recent Developments
Table 127. International Micro Industries Company Details
Table 128. International Micro Industries Business Overview
Table 129. International Micro Industries Wafer Bumping Product
Table 130. International Micro Industries Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 131. International Micro Industries Recent Developments
Table 132. Raytek Semiconductor Company Details
Table 133. Raytek Semiconductor Business Overview
Table 134. Raytek Semiconductor Wafer Bumping Product
Table 135. Raytek Semiconductor Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 136. Raytek Semiconductor Recent Developments
Table 137. Jiangsu CAS Microelectronics Integration Company Details
Table 138. Jiangsu CAS Microelectronics Integration Business Overview
Table 139. Jiangsu CAS Microelectronics Integration Wafer Bumping Product
Table 140. Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2017-2022) & (US$ Million)
Table 141. Jiangsu CAS Microelectronics Integration Recent Developments
Table 142. Research Programs/Design for This Report
Table 143. Key Data Information from Secondary Sources
Table 144. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Wafer Bumping Market Share by Type: 2021 VS 2028
Figure 2. Copper Pillar Bump Features
Figure 3. Lead Free Bump Features
Figure 4. Others Features
Figure 5. Global Wafer Bumping Market Share by Application: 2021 VS 2028
Figure 6. 4&6 Inch Case Studies
Figure 7. 8&12 Inch Case Studies
Figure 8. Wafer Bumping Report Years Considered
Figure 9. Global Wafer Bumping Market Size (US$ Million), Year-over-Year: 2017-2028
Figure 10. Global Wafer Bumping Market Size, (US$ Million), 2017 VS 2021 VS 2028
Figure 11. Global Wafer Bumping Market Share by Region: 2021 VS 2028
Figure 12. Global Wafer Bumping Market Share by Players in 2021
Figure 13. Global Top Wafer Bumping Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2021)
Figure 14. The Top 10 and 5 Players Market Share by Wafer Bumping Revenue in 2021
Figure 15. North America Wafer Bumping Market Size YoY (2017-2028) & (US$ Million)
Figure 16. North America Wafer Bumping Market Size Market Share by Type (2017-2028)
Figure 17. North America Wafer Bumping Market Size Market Share by Application (2017-2028)
Figure 18. North America Wafer Bumping Market Size Share by Country (2017-2028)
Figure 19. United States Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 20. Canada Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 21. Europe Wafer Bumping Market Size YoY (2017-2028) & (US$ Million)
Figure 22. Europe Wafer Bumping Market Size Market Share by Type (2017-2028)
Figure 23. Europe Wafer Bumping Market Size Market Share by Application (2017-2028)
Figure 24. Europe Wafer Bumping Market Size Share by Country (2017-2028)
Figure 25. Germany Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 26. France Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 27. U.K. Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 28. Italy Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 29. Russia Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 30. Nordic Countries Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 31. Asia-Pacific Wafer Bumping Market Size YoY (2017-2028) & (US$ Million)
Figure 32. Asia Pacific Wafer Bumping Market Size Market Share by Type (2017-2028)
Figure 33. Asia Pacific Wafer Bumping Market Size Market Share by Application (2017-2028)
Figure 34. Asia Pacific Wafer Bumping Market Size Share by Region (2017-2028)
Figure 35. China Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 36. Japan Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 37. South Korea Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 38. Southeast Asia Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 39. India Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 40. Australia Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
List of Figures
Figure 41. Latin America Wafer Bumping Market Size YoY (2017-2028) & (US$ Million)
Figure 42. Latin America Wafer Bumping Market Size Market Share by Type (2017-2028)
Figure 43. Latin America Wafer Bumping Market Size Market Share by Application (2017-2028)
Figure 44. Latin America Wafer Bumping Market Size Share by Country (2017-2028)
Figure 45. Mexico Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 46. Brazil Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 47. Middle East & Africa Wafer Bumping Market Size YoY (2017-2028) & (US$ Million)
Figure 48. Middle East and Africa Wafer Bumping Market Size Market Share by Type (2017-2028)
Figure 49. Middle East and Africa Wafer Bumping Market Size Market Share by Application (2017-2028)
Figure 50. Middle East and Africa Wafer Bumping Market Size Share by Country (2017-2028)
Figure 51. Turkey Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 52. Saudi Arabia Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 53. UAE Wafer Bumping Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 54. ASE Global Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 55. Fujitsu Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 56. Amkor Technology Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 57. MacDermid Alpha Electronics Solutions Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 58. Maxell Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 59. JCET Group Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 60. Unisem Group Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 61. Powertech Technology Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 62. SFA Semicon Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 63. Semi-Pac Inc Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 64. ChipMOS TECHNOLOGIES Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 65. NEPES Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 66. TI Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 67. International Micro Industries Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 68. Raytek Semiconductor Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 69. Jiangsu CAS Microelectronics Integration Revenue Growth Rate in Wafer Bumping Business (2017-2022)
Figure 70. Bottom-up and Top-down Approaches for This Report
Figure 71. Data Triangulation
Figure 72. Key Executives Interviewed

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