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レポート概要
| 「Global Wafer Grinder (Wafer Thinning Equipment) Market 2022」レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 グローバルインフォリサーチ社の最新の調査によると、世界のウェーハグラインダー（ウェーハ薄化装置）の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 ウェーハグラインダー（ウェーハ薄化装置）市場はタイプ（種類）とアプリケーション（用途）によって区分されます。2017年～2028年において、量と金額の観点からタイプ別およびアプリケーション別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 タイプ別セグメントは次をカバーします。 ・全自動、半自動 アプリケーション別セグメントは次のように区分されます。 ・200mmウェーハ、300mmウェーハ、その他 世界のウェーハグラインダー（ウェーハ薄化装置）市場の主要な市場プレーヤーは以下のとおりです。 ・Disco、TOKYO SEIMITSU、G&N、Okamoto Semiconductor Equipment Division、CETC、Koyo Machinery、Revasum、Daitron、WAIDA MFG、Hunan Yujing Machine Industrial、SpeedFam 地域別セグメントは次の地域・国をカバーします。 ・北米市場（米国、カナダ、メキシコ） ・ヨーロッパ市場（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋市場（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南米市場（ブラジル、アルゼンチン、コロンビア） ・中東・アフリカ市場（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、ウェーハグラインダー（ウェーハ薄化装置）製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なウェーハグラインダー（ウェーハ薄化装置）メーカーの企業概要、2019年～2022年までのウェーハグラインダー（ウェーハ薄化装置）の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なウェーハグラインダー（ウェーハ薄化装置）メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別ウェーハグラインダー（ウェーハ薄化装置）の販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までのウェーハグラインダー（ウェーハ薄化装置）のタイプ別とアプリケーション別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのウェーハグラインダー（ウェーハ薄化装置）市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、およびウェーハグラインダー（ウェーハ薄化装置）の産業チェーンを掲載しています。 ・第13、14、15章では、ウェーハグラインダー（ウェーハ薄化装置）の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 - ウェーハグラインダー（ウェーハ薄化装置）の概要 - タイプ別分析（2017年vs2021年vs2028年）：全自動、半自動 - アプリケーション別分析（2017年vs2021年vs2028年）：200mmウェーハ、300mmウェーハ、その他 - 世界のウェーハグラインダー（ウェーハ薄化装置）市場規模・予測 - 世界のウェーハグラインダー（ウェーハ薄化装置）生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - Disco、TOKYO SEIMITSU、G&N、Okamoto Semiconductor Equipment Division、CETC、Koyo Machinery、Revasum、Daitron、WAIDA MFG、Hunan Yujing Machine Industrial、SpeedFam ・メーカー別市場シェア・市場集中度 ・地域別市場分析2017年-2028年 ・タイプ別分析2017年-2028年：全自動、半自動 ・アプリケーション別分析2017年-2028年：200mmウェーハ、300mmウェーハ、その他 ・ウェーハグラインダー（ウェーハ薄化装置）の北米市場分析 - ウェーハグラインダー（ウェーハ薄化装置）の北米市場：タイプ別市場規模2017年-2028年 - ウェーハグラインダー（ウェーハ薄化装置）の北米市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・ウェーハグラインダー（ウェーハ薄化装置）のヨーロッパ市場分析 - ：ウェーハグラインダー（ウェーハ薄化装置）のヨーロッパ市場：タイプ別市場規模2017年-2028年 - ：ウェーハグラインダー（ウェーハ薄化装置）のヨーロッパ市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・ウェーハグラインダー（ウェーハ薄化装置）のアジア太平洋市場分析 - ウェーハグラインダー（ウェーハ薄化装置）のアジア太平洋市場：タイプ別市場規模2017年-2028年 - ウェーハグラインダー（ウェーハ薄化装置）のアジア太平洋市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・ウェーハグラインダー（ウェーハ薄化装置）の南米市場分析 - ウェーハグラインダー（ウェーハ薄化装置）の南米市場：タイプ別市場規模2017年-2028年 - ウェーハグラインダー（ウェーハ薄化装置）の南米市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・ウェーハグラインダー（ウェーハ薄化装置）の中東・アフリカ市場分析 - ウェーハグラインダー（ウェーハ薄化装置）の中東・アフリカ市場：タイプ別市場規模2017年-2028年 - ウェーハグラインダー（ウェーハ薄化装置）の中東・アフリカ市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
The Wafer Grinder (Wafer Thinning Equipment) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Wafer Grinder (Wafer Thinning Equipment) market size is estimated to be worth US$ 705.3 million in 2021 and is forecast to a readjusted size of USD 1140 million by 2028 with a CAGR of 7.1% during forecast period 2022-2028. 200 mm Wafer accounting for % of the Wafer Grinder (Wafer Thinning Equipment) global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Full Automatic segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Wafer Grinder (Wafer Thinning Equipment) include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, and CETC, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Wafer Grinder (Wafer Thinning Equipment) market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Full Automatic
Semi Automatic
Market segment by Application can be divided into
200 mm Wafer
300 mm Wafer
Others
The key market players for global Wafer Grinder (Wafer Thinning Equipment) market are listed below:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinder (Wafer Thinning Equipment) product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Wafer Grinder (Wafer Thinning Equipment), with price, sales, revenue and global market share of Wafer Grinder (Wafer Thinning Equipment) from 2019 to 2022.
Chapter 3, the Wafer Grinder (Wafer Thinning Equipment) competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinder (Wafer Thinning Equipment) breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Wafer Grinder (Wafer Thinning Equipment) market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Wafer Grinder (Wafer Thinning Equipment).
Chapter 13, 14, and 15, to describe Wafer Grinder (Wafer Thinning Equipment) sales channel, distributors, customers, research findings and conclusion, appendix and data source.
1 Market Overview
1.1 Wafer Grinder (Wafer Thinning Equipment) Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Full Automatic
1.2.3 Semi Automatic
1.3 Market Analysis by Application
1.3.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 200 mm Wafer
1.3.3 300 mm Wafer
1.3.4 Others
1.4 Global Wafer Grinder (Wafer Thinning Equipment) Market Size & Forecast
1.4.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Volume (2017-2028)
1.4.3 Global Wafer Grinder (Wafer Thinning Equipment) Price (2017-2028)
1.5 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity Analysis
1.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Total Production Capacity (2017-2028)
1.5.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Wafer Grinder (Wafer Thinning Equipment) Market Drivers
1.6.2 Wafer Grinder (Wafer Thinning Equipment) Market Restraints
1.6.3 Wafer Grinder (Wafer Thinning Equipment) Trends Analysis
2 Manufacturers Profiles
2.1 Disco
2.1.1 Disco Details
2.1.2 Disco Major Business
2.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 TOKYO SEIMITSU
2.2.1 TOKYO SEIMITSU Details
2.2.2 TOKYO SEIMITSU Major Business
2.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 G&N
2.3.1 G&N Details
2.3.2 G&N Major Business
2.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Okamoto Semiconductor Equipment Division
2.4.1 Okamoto Semiconductor Equipment Division Details
2.4.2 Okamoto Semiconductor Equipment Division Major Business
2.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 CETC
2.5.1 CETC Details
2.5.2 CETC Major Business
2.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Koyo Machinery
2.6.1 Koyo Machinery Details
2.6.2 Koyo Machinery Major Business
2.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Revasum
2.7.1 Revasum Details
2.7.2 Revasum Major Business
2.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Daitron
2.8.1 Daitron Details
2.8.2 Daitron Major Business
2.8.3 Daitron Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.8.4 Daitron Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 WAIDA MFG
2.9.1 WAIDA MFG Details
2.9.2 WAIDA MFG Major Business
2.9.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.9.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Hunan Yujing Machine Industrial
2.10.1 Hunan Yujing Machine Industrial Details
2.10.2 Hunan Yujing Machine Industrial Major Business
2.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.10.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 SpeedFam
2.11.1 SpeedFam Details
2.11.2 SpeedFam Major Business
2.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product and Services
2.11.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Wafer Grinder (Wafer Thinning Equipment) Breakdown Data by Manufacturer
3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Wafer Grinder (Wafer Thinning Equipment)
3.4 Market Concentration Rate
3.4.1 Top 3 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2021
3.4.2 Top 6 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2021
3.5 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Wafer Grinder (Wafer Thinning Equipment) Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
4.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Region (2017-2028)
4.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Region (2017-2028)
4.2 North America Wafer Grinder (Wafer Thinning Equipment) Revenue (2017-2028)
4.3 Europe Wafer Grinder (Wafer Thinning Equipment) Revenue (2017-2028)
4.4 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Revenue (2017-2028)
4.5 South America Wafer Grinder (Wafer Thinning Equipment) Revenue (2017-2028)
4.6 Middle East and Africa Wafer Grinder (Wafer Thinning Equipment) Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Type (2017-2028)
5.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Type (2017-2028)
5.3 Global Wafer Grinder (Wafer Thinning Equipment) Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Application (2017-2028)
6.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Application (2017-2028)
6.3 Global Wafer Grinder (Wafer Thinning Equipment) Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales by Type (2017-2028)
7.2 North America Wafer Grinder (Wafer Thinning Equipment) Sales by Application (2017-2028)
7.3 North America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
7.3.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Country (2017-2028)
7.3.2 North America Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Type (2017-2028)
8.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Application (2017-2028)
8.3 Europe Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
8.3.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Country (2017-2028)
8.3.2 Europe Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales by Type (2017-2028)
9.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales by Application (2017-2028)
9.3 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
9.3.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales by Type (2017-2028)
10.2 South America Wafer Grinder (Wafer Thinning Equipment) Sales by Application (2017-2028)
10.3 South America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
10.3.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Country (2017-2028)
10.3.2 South America Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Type (2017-2028)
11.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Application (2017-2028)
11.3 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
11.3.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Wafer Grinder (Wafer Thinning Equipment) and Key Manufacturers
12.2 Manufacturing Costs Percentage of Wafer Grinder (Wafer Thinning Equipment)
12.3 Wafer Grinder (Wafer Thinning Equipment) Production Process
12.4 Wafer Grinder (Wafer Thinning Equipment) Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Wafer Grinder (Wafer Thinning Equipment) Typical Distributors
13.3 Wafer Grinder (Wafer Thinning Equipment) Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer