 | • レポートコード：GIR-22F7184 • 出版社/出版日：GlobalInfoResearch / 2022年11月 • レポート形態：英文、PDF、102ページ • 納品方法：Eメール（2~3営業日） • 産業分類：電子＆半導体 |
| Single User | ￥515,040 (USD3,480) | ▷ お問い合わせ |
| Multi User | ￥772,560 (USD5,220) | ▷ お問い合わせ |
| Corporate User | ￥1,030,080 (USD6,960) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| 「Global Direct Bonded Copper Substrate Market 2022」レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 グローバルインフォリサーチ社の最新の調査によると、世界のダイレクトボンド銅基板の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 ダイレクトボンド銅基板市場はタイプ（種類）とアプリケーション（用途）によって区分されます。2017年～2028年において、量と金額の観点からタイプ別およびアプリケーション別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 タイプ別セグメントは次をカバーします。 ・AlN DBCセラミック基板、Al2O3 DBCセラミック基板 アプリケーション別セグメントは次のように区分されます。 ・IGBTモジュール、自動車、家電・CPV、航空宇宙・その他 世界のダイレクトボンド銅基板市場の主要な市場プレーヤーは以下のとおりです。 ・Rogers/Curamik、KCC、Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)、Heraeus Electronics、Nanjing Zhongjiang New Material Science & Technology、NGK Electronics Devices、Littelfuse IXYS、Remtec、Stellar Industries Corp、Tong Hsing (acquired HCS)、Zibo Linzi Yinhe High-Tech Development 地域別セグメントは次の地域・国をカバーします。 ・北米市場（米国、カナダ、メキシコ） ・ヨーロッパ市場（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋市場（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南米市場（ブラジル、アルゼンチン、コロンビア） ・中東・アフリカ市場（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、ダイレクトボンド銅基板製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なダイレクトボンド銅基板メーカーの企業概要、2019年～2022年までのダイレクトボンド銅基板の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なダイレクトボンド銅基板メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別ダイレクトボンド銅基板の販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までのダイレクトボンド銅基板のタイプ別とアプリケーション別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのダイレクトボンド銅基板市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、およびダイレクトボンド銅基板の産業チェーンを掲載しています。 ・第13、14、15章では、ダイレクトボンド銅基板の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 - ダイレクトボンド銅基板の概要 - タイプ別分析（2017年vs2021年vs2028年）：AlN DBCセラミック基板、Al2O3 DBCセラミック基板 - アプリケーション別分析（2017年vs2021年vs2028年）：IGBTモジュール、自動車、家電・CPV、航空宇宙・その他 - 世界のダイレクトボンド銅基板市場規模・予測 - 世界のダイレクトボンド銅基板生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - Rogers/Curamik、KCC、Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)、Heraeus Electronics、Nanjing Zhongjiang New Material Science & Technology、NGK Electronics Devices、Littelfuse IXYS、Remtec、Stellar Industries Corp、Tong Hsing (acquired HCS)、Zibo Linzi Yinhe High-Tech Development ・メーカー別市場シェア・市場集中度 ・地域別市場分析2017年-2028年 ・タイプ別分析2017年-2028年：AlN DBCセラミック基板、Al2O3 DBCセラミック基板 ・アプリケーション別分析2017年-2028年：IGBTモジュール、自動車、家電・CPV、航空宇宙・その他 ・ダイレクトボンド銅基板の北米市場分析 - ダイレクトボンド銅基板の北米市場：タイプ別市場規模2017年-2028年 - ダイレクトボンド銅基板の北米市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・ダイレクトボンド銅基板のヨーロッパ市場分析 - ：ダイレクトボンド銅基板のヨーロッパ市場：タイプ別市場規模2017年-2028年 - ：ダイレクトボンド銅基板のヨーロッパ市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・ダイレクトボンド銅基板のアジア太平洋市場分析 - ダイレクトボンド銅基板のアジア太平洋市場：タイプ別市場規模2017年-2028年 - ダイレクトボンド銅基板のアジア太平洋市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・ダイレクトボンド銅基板の南米市場分析 - ダイレクトボンド銅基板の南米市場：タイプ別市場規模2017年-2028年 - ダイレクトボンド銅基板の南米市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・ダイレクトボンド銅基板の中東・アフリカ市場分析 - ダイレクトボンド銅基板の中東・アフリカ市場：タイプ別市場規模2017年-2028年 - ダイレクトボンド銅基板の中東・アフリカ市場：アプリケーション別市場規模2017年-2028年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
The Direct Bonded Copper Substrate market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Direct Bonded Copper Substrate market size is estimated to be worth US$ 289.5 million in 2021 and is forecast to a readjusted size of USD 516.3 million by 2028 with a CAGR of 8.6% during review period. IGBT Modules accounting for % of the Direct Bonded Copper Substrate global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While AlN DBC Ceramic Substrate segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Direct Bonded Copper Substrate include Rogers/Curamik, KCC, Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Heraeus Electronics, and Nanjing Zhongjiang New Material Science & Technology, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Direct Bonded Copper Substrate market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
AlN DBC Ceramic Substrate
Al2O3 DBC Ceramic Substrate
Market segment by Application can be divided into
IGBT Modules
Automotive
Home Appliances and CPV
Aerospace and Others
The key market players for global Direct Bonded Copper Substrate market are listed below:
Rogers/Curamik
KCC
Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
Heraeus Electronics
Nanjing Zhongjiang New Material Science & Technology
NGK Electronics Devices
Littelfuse IXYS
Remtec
Stellar Industries Corp
Tong Hsing (acquired HCS)
Zibo Linzi Yinhe High-Tech Development
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Direct Bonded Copper Substrate product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Direct Bonded Copper Substrate, with price, sales, revenue and global market share of Direct Bonded Copper Substrate from 2019 to 2022.
Chapter 3, the Direct Bonded Copper Substrate competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Direct Bonded Copper Substrate breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Direct Bonded Copper Substrate market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Direct Bonded Copper Substrate.
Chapter 13, 14, and 15, to describe Direct Bonded Copper Substrate sales channel, distributors, customers, research findings and conclusion, appendix and data source.
1 Market Overview
1.1 Direct Bonded Copper Substrate Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Direct Bonded Copper Substrate Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 AlN DBC Ceramic Substrate
1.2.3 Al2O3 DBC Ceramic Substrate
1.3 Market Analysis by Application
1.3.1 Overview: Global Direct Bonded Copper Substrate Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 IGBT Modules
1.3.3 Automotive
1.3.4 Home Appliances and CPV
1.3.5 Aerospace and Others
1.4 Global Direct Bonded Copper Substrate Market Size & Forecast
1.4.1 Global Direct Bonded Copper Substrate Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Direct Bonded Copper Substrate Sales in Volume (2017-2028)
1.4.3 Global Direct Bonded Copper Substrate Price (2017-2028)
1.5 Global Direct Bonded Copper Substrate Production Capacity Analysis
1.5.1 Global Direct Bonded Copper Substrate Total Production Capacity (2017-2028)
1.5.2 Global Direct Bonded Copper Substrate Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Direct Bonded Copper Substrate Market Drivers
1.6.2 Direct Bonded Copper Substrate Market Restraints
1.6.3 Direct Bonded Copper Substrate Trends Analysis
2 Manufacturers Profiles
2.1 Rogers/Curamik
2.1.1 Rogers/Curamik Details
2.1.2 Rogers/Curamik Major Business
2.1.3 Rogers/Curamik Direct Bonded Copper Substrate Product and Services
2.1.4 Rogers/Curamik Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 KCC
2.2.1 KCC Details
2.2.2 KCC Major Business
2.2.3 KCC Direct Bonded Copper Substrate Product and Services
2.2.4 KCC Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
2.3.1 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Details
2.3.2 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Major Business
2.3.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Direct Bonded Copper Substrate Product and Services
2.3.4 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Heraeus Electronics
2.4.1 Heraeus Electronics Details
2.4.2 Heraeus Electronics Major Business
2.4.3 Heraeus Electronics Direct Bonded Copper Substrate Product and Services
2.4.4 Heraeus Electronics Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Nanjing Zhongjiang New Material Science & Technology
2.5.1 Nanjing Zhongjiang New Material Science & Technology Details
2.5.2 Nanjing Zhongjiang New Material Science & Technology Major Business
2.5.3 Nanjing Zhongjiang New Material Science & Technology Direct Bonded Copper Substrate Product and Services
2.5.4 Nanjing Zhongjiang New Material Science & Technology Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 NGK Electronics Devices
2.6.1 NGK Electronics Devices Details
2.6.2 NGK Electronics Devices Major Business
2.6.3 NGK Electronics Devices Direct Bonded Copper Substrate Product and Services
2.6.4 NGK Electronics Devices Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Littelfuse IXYS
2.7.1 Littelfuse IXYS Details
2.7.2 Littelfuse IXYS Major Business
2.7.3 Littelfuse IXYS Direct Bonded Copper Substrate Product and Services
2.7.4 Littelfuse IXYS Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Remtec
2.8.1 Remtec Details
2.8.2 Remtec Major Business
2.8.3 Remtec Direct Bonded Copper Substrate Product and Services
2.8.4 Remtec Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Stellar Industries Corp
2.9.1 Stellar Industries Corp Details
2.9.2 Stellar Industries Corp Major Business
2.9.3 Stellar Industries Corp Direct Bonded Copper Substrate Product and Services
2.9.4 Stellar Industries Corp Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Tong Hsing (acquired HCS)
2.10.1 Tong Hsing (acquired HCS) Details
2.10.2 Tong Hsing (acquired HCS) Major Business
2.10.3 Tong Hsing (acquired HCS) Direct Bonded Copper Substrate Product and Services
2.10.4 Tong Hsing (acquired HCS) Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Zibo Linzi Yinhe High-Tech Development
2.11.1 Zibo Linzi Yinhe High-Tech Development Details
2.11.2 Zibo Linzi Yinhe High-Tech Development Major Business
2.11.3 Zibo Linzi Yinhe High-Tech Development Direct Bonded Copper Substrate Product and Services
2.11.4 Zibo Linzi Yinhe High-Tech Development Direct Bonded Copper Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Direct Bonded Copper Substrate Breakdown Data by Manufacturer
3.1 Global Direct Bonded Copper Substrate Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Direct Bonded Copper Substrate Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Direct Bonded Copper Substrate
3.4 Market Concentration Rate
3.4.1 Top 3 Direct Bonded Copper Substrate Manufacturer Market Share in 2021
3.4.2 Top 6 Direct Bonded Copper Substrate Manufacturer Market Share in 2021
3.5 Global Direct Bonded Copper Substrate Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Direct Bonded Copper Substrate Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Direct Bonded Copper Substrate Market Size by Region
4.1.1 Global Direct Bonded Copper Substrate Sales in Volume by Region (2017-2028)
4.1.2 Global Direct Bonded Copper Substrate Revenue by Region (2017-2028)
4.2 North America Direct Bonded Copper Substrate Revenue (2017-2028)
4.3 Europe Direct Bonded Copper Substrate Revenue (2017-2028)
4.4 Asia-Pacific Direct Bonded Copper Substrate Revenue (2017-2028)
4.5 South America Direct Bonded Copper Substrate Revenue (2017-2028)
4.6 Middle East and Africa Direct Bonded Copper Substrate Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Direct Bonded Copper Substrate Sales in Volume by Type (2017-2028)
5.2 Global Direct Bonded Copper Substrate Revenue by Type (2017-2028)
5.3 Global Direct Bonded Copper Substrate Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Direct Bonded Copper Substrate Sales in Volume by Application (2017-2028)
6.2 Global Direct Bonded Copper Substrate Revenue by Application (2017-2028)
6.3 Global Direct Bonded Copper Substrate Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Direct Bonded Copper Substrate Sales by Type (2017-2028)
7.2 North America Direct Bonded Copper Substrate Sales by Application (2017-2028)
7.3 North America Direct Bonded Copper Substrate Market Size by Country
7.3.1 North America Direct Bonded Copper Substrate Sales in Volume by Country (2017-2028)
7.3.2 North America Direct Bonded Copper Substrate Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Direct Bonded Copper Substrate Sales by Type (2017-2028)
8.2 Europe Direct Bonded Copper Substrate Sales by Application (2017-2028)
8.3 Europe Direct Bonded Copper Substrate Market Size by Country
8.3.1 Europe Direct Bonded Copper Substrate Sales in Volume by Country (2017-2028)
8.3.2 Europe Direct Bonded Copper Substrate Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Direct Bonded Copper Substrate Sales by Type (2017-2028)
9.2 Asia-Pacific Direct Bonded Copper Substrate Sales by Application (2017-2028)
9.3 Asia-Pacific Direct Bonded Copper Substrate Market Size by Region
9.3.1 Asia-Pacific Direct Bonded Copper Substrate Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Direct Bonded Copper Substrate Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Direct Bonded Copper Substrate Sales by Type (2017-2028)
10.2 South America Direct Bonded Copper Substrate Sales by Application (2017-2028)
10.3 South America Direct Bonded Copper Substrate Market Size by Country
10.3.1 South America Direct Bonded Copper Substrate Sales in Volume by Country (2017-2028)
10.3.2 South America Direct Bonded Copper Substrate Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Direct Bonded Copper Substrate Sales by Type (2017-2028)
11.2 Middle East & Africa Direct Bonded Copper Substrate Sales by Application (2017-2028)
11.3 Middle East & Africa Direct Bonded Copper Substrate Market Size by Country
11.3.1 Middle East & Africa Direct Bonded Copper Substrate Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Direct Bonded Copper Substrate Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Direct Bonded Copper Substrate and Key Manufacturers
12.2 Manufacturing Costs Percentage of Direct Bonded Copper Substrate
12.3 Direct Bonded Copper Substrate Production Process
12.4 Direct Bonded Copper Substrate Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Direct Bonded Copper Substrate Typical Distributors
13.3 Direct Bonded Copper Substrate Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer