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世界の電子パッケージングにおける薄膜基板市場予測(~2028年):リジッド薄膜基板、フレキシブル薄膜基板

• 英文タイトル:Global Thin Film Substrates in Electronic Packaging Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

GlobalInfoResearchが調査・発行した産業分析レポートです。世界の電子パッケージングにおける薄膜基板市場予測(~2028年):リジッド薄膜基板、フレキシブル薄膜基板 / Global Thin Film Substrates in Electronic Packaging Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028 / GIR-22F8303資料のイメージです。• レポートコード:GIR-22F8303
• 出版社/出版日:GlobalInfoResearch / 2022年11月
• レポート形態:英文、PDF、97ページ
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レポート概要
「Global Thin Film Substrates in Electronic Packaging Market 2022」レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
グローバルインフォリサーチ社の最新の調査によると、世界の電子パッケージングにおける薄膜基板の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx%の成長率で成長すると予想されます。

電子パッケージングにおける薄膜基板市場はタイプ(種類)とアプリケーション(用途)によって区分されます。2017年~2028年において、量と金額の観点からタイプ別およびアプリケーション別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

タイプ別セグメントは次をカバーします。
・リジッド薄膜基板、フレキシブル薄膜基板

アプリケーション別セグメントは次のように区分されます。
・パワーエレクトロニクス、ハイブリッドマイクロエレクトロニクス、マルチチップモジュール、その他

世界の電子パッケージングにおける薄膜基板市場の主要な市場プレーヤーは以下のとおりです。
・KYOCERA、Vishay、CoorsTek、MARUWA、Tong Hsing Electronic Industries、Murata Manufacturing、ICP Technology、Leatec Fine Ceramics

地域別セグメントは次の地域・国をカバーします。
・北米市場(米国、カナダ、メキシコ)
・ヨーロッパ市場(ドイツ、フランス、イギリス、ロシア、イタリア)
・アジア太平洋市場(日本、中国、韓国、インド、東南アジア、オーストラリア)
・南米市場(ブラジル、アルゼンチン、コロンビア)
・中東・アフリカ市場(サウジアラビア、UAE、エジプト、南アフリカ)

本調査レポートの内容は計15章あります。
・第1章では、電子パッケージングにおける薄膜基板製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要な電子パッケージングにおける薄膜基板メーカーの企業概要、2019年~2022年までの電子パッケージングにおける薄膜基板の価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要な電子パッケージングにおける薄膜基板メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年~2028年までの地域別電子パッケージングにおける薄膜基板の販売量、売上、成長性を示しています。
・第5、6章では、2017年~2028年までの電子パッケージングにおける薄膜基板のタイプ別とアプリケーション別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年~2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年~2028年までの主要地域での電子パッケージングにおける薄膜基板市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、および電子パッケージングにおける薄膜基板の産業チェーンを掲載しています。
・第13、14、15章では、電子パッケージングにおける薄膜基板の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
- 電子パッケージングにおける薄膜基板の概要
- タイプ別分析(2017年vs2021年vs2028年):リジッド薄膜基板、フレキシブル薄膜基板
- アプリケーション別分析(2017年vs2021年vs2028年):パワーエレクトロニクス、ハイブリッドマイクロエレクトロニクス、マルチチップモジュール、その他
- 世界の電子パッケージングにおける薄膜基板市場規模・予測
- 世界の電子パッケージングにおける薄膜基板生産能力分析
- 市場の成長要因・阻害要因・動向
・メーカー情報(企業概要、製品概要、販売量、価格、売上)
- KYOCERA、Vishay、CoorsTek、MARUWA、Tong Hsing Electronic Industries、Murata Manufacturing、ICP Technology、Leatec Fine Ceramics
・メーカー別市場シェア・市場集中度
・地域別市場分析2017年-2028年
・タイプ別分析2017年-2028年:リジッド薄膜基板、フレキシブル薄膜基板
・アプリケーション別分析2017年-2028年:パワーエレクトロニクス、ハイブリッドマイクロエレクトロニクス、マルチチップモジュール、その他
・電子パッケージングにおける薄膜基板の北米市場分析
- 電子パッケージングにおける薄膜基板の北米市場:タイプ別市場規模2017年-2028年
- 電子パッケージングにおける薄膜基板の北米市場:アプリケーション別市場規模2017年-2028年
- 主要国別市場規模:アメリカ、カナダ、メキシコなど
・電子パッケージングにおける薄膜基板のヨーロッパ市場分析
- :電子パッケージングにおける薄膜基板のヨーロッパ市場:タイプ別市場規模2017年-2028年
- :電子パッケージングにおける薄膜基板のヨーロッパ市場:アプリケーション別市場規模2017年-2028年
- 主要国別市場規模:ドイツ、イギリス、フランス、ロシア、イタリアなど
・電子パッケージングにおける薄膜基板のアジア太平洋市場分析
- 電子パッケージングにおける薄膜基板のアジア太平洋市場:タイプ別市場規模2017年-2028年
- 電子パッケージングにおける薄膜基板のアジア太平洋市場:アプリケーション別市場規模2017年-2028年
- 主要国別市場規模:中国、日本、韓国、インド、東南アジア、オーストラリアなど
・電子パッケージングにおける薄膜基板の南米市場分析
- 電子パッケージングにおける薄膜基板の南米市場:タイプ別市場規模2017年-2028年
- 電子パッケージングにおける薄膜基板の南米市場:アプリケーション別市場規模2017年-2028年
- 主要国別市場規模:ブラジル、アルゼンチンなど
・電子パッケージングにおける薄膜基板の中東・アフリカ市場分析
- 電子パッケージングにおける薄膜基板の中東・アフリカ市場:タイプ別市場規模2017年-2028年
- 電子パッケージングにおける薄膜基板の中東・アフリカ市場:アプリケーション別市場規模2017年-2028年
- 主要国別市場規模:サウジアラビア、トルコ、エジプト、南アフリカなど
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Thin Film Substrates in Electronic Packaging market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Thin Film Substrates in Electronic Packaging market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period. Power Electronics accounting for % of the Thin Film Substrates in Electronic Packaging global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Rigid Thin-Film Substrates segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Thin Film Substrates in Electronic Packaging include KYOCERA, Vishay, CoorsTek, MARUWA, and Tong Hsing Electronic Industries, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Thin Film Substrates in Electronic Packaging market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Rigid Thin-Film Substrates
Flexible Thin-Film Substrates
Market segment by Application can be divided into
Power Electronics
Hybrid Microelectronics
Multi-Chip Modules
Others
The key market players for global Thin Film Substrates in Electronic Packaging market are listed below:
KYOCERA
Vishay
CoorsTek
MARUWA
Tong Hsing Electronic Industries
Murata Manufacturing
ICP Technology
Leatec Fine Ceramics
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thin Film Substrates in Electronic Packaging product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Thin Film Substrates in Electronic Packaging, with price, sales, revenue and global market share of Thin Film Substrates in Electronic Packaging from 2019 to 2022.
Chapter 3, the Thin Film Substrates in Electronic Packaging competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thin Film Substrates in Electronic Packaging breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Thin Film Substrates in Electronic Packaging market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Thin Film Substrates in Electronic Packaging.
Chapter 13, 14, and 15, to describe Thin Film Substrates in Electronic Packaging sales channel, distributors, customers, research findings and conclusion, appendix and data source.

レポート目次

1 Market Overview
1.1 Thin Film Substrates in Electronic Packaging Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Thin Film Substrates in Electronic Packaging Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Rigid Thin-Film Substrates
1.2.3 Flexible Thin-Film Substrates
1.3 Market Analysis by Application
1.3.1 Overview: Global Thin Film Substrates in Electronic Packaging Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Power Electronics
1.3.3 Hybrid Microelectronics
1.3.4 Multi-Chip Modules
1.3.5 Others
1.4 Global Thin Film Substrates in Electronic Packaging Market Size & Forecast
1.4.1 Global Thin Film Substrates in Electronic Packaging Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Thin Film Substrates in Electronic Packaging Sales in Volume (2017-2028)
1.4.3 Global Thin Film Substrates in Electronic Packaging Price (2017-2028)
1.5 Global Thin Film Substrates in Electronic Packaging Production Capacity Analysis
1.5.1 Global Thin Film Substrates in Electronic Packaging Total Production Capacity (2017-2028)
1.5.2 Global Thin Film Substrates in Electronic Packaging Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Thin Film Substrates in Electronic Packaging Market Drivers
1.6.2 Thin Film Substrates in Electronic Packaging Market Restraints
1.6.3 Thin Film Substrates in Electronic Packaging Trends Analysis
2 Manufacturers Profiles
2.1 KYOCERA
2.1.1 KYOCERA Details
2.1.2 KYOCERA Major Business
2.1.3 KYOCERA Thin Film Substrates in Electronic Packaging Product and Services
2.1.4 KYOCERA Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Vishay
2.2.1 Vishay Details
2.2.2 Vishay Major Business
2.2.3 Vishay Thin Film Substrates in Electronic Packaging Product and Services
2.2.4 Vishay Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 CoorsTek
2.3.1 CoorsTek Details
2.3.2 CoorsTek Major Business
2.3.3 CoorsTek Thin Film Substrates in Electronic Packaging Product and Services
2.3.4 CoorsTek Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 MARUWA
2.4.1 MARUWA Details
2.4.2 MARUWA Major Business
2.4.3 MARUWA Thin Film Substrates in Electronic Packaging Product and Services
2.4.4 MARUWA Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Tong Hsing Electronic Industries
2.5.1 Tong Hsing Electronic Industries Details
2.5.2 Tong Hsing Electronic Industries Major Business
2.5.3 Tong Hsing Electronic Industries Thin Film Substrates in Electronic Packaging Product and Services
2.5.4 Tong Hsing Electronic Industries Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Murata Manufacturing
2.6.1 Murata Manufacturing Details
2.6.2 Murata Manufacturing Major Business
2.6.3 Murata Manufacturing Thin Film Substrates in Electronic Packaging Product and Services
2.6.4 Murata Manufacturing Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 ICP Technology
2.7.1 ICP Technology Details
2.7.2 ICP Technology Major Business
2.7.3 ICP Technology Thin Film Substrates in Electronic Packaging Product and Services
2.7.4 ICP Technology Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Leatec Fine Ceramics
2.8.1 Leatec Fine Ceramics Details
2.8.2 Leatec Fine Ceramics Major Business
2.8.3 Leatec Fine Ceramics Thin Film Substrates in Electronic Packaging Product and Services
2.8.4 Leatec Fine Ceramics Thin Film Substrates in Electronic Packaging Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Thin Film Substrates in Electronic Packaging Breakdown Data by Manufacturer
3.1 Global Thin Film Substrates in Electronic Packaging Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Thin Film Substrates in Electronic Packaging Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Thin Film Substrates in Electronic Packaging
3.4 Market Concentration Rate
3.4.1 Top 3 Thin Film Substrates in Electronic Packaging Manufacturer Market Share in 2021
3.4.2 Top 6 Thin Film Substrates in Electronic Packaging Manufacturer Market Share in 2021
3.5 Global Thin Film Substrates in Electronic Packaging Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Thin Film Substrates in Electronic Packaging Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Thin Film Substrates in Electronic Packaging Market Size by Region
4.1.1 Global Thin Film Substrates in Electronic Packaging Sales in Volume by Region (2017-2028)
4.1.2 Global Thin Film Substrates in Electronic Packaging Revenue by Region (2017-2028)
4.2 North America Thin Film Substrates in Electronic Packaging Revenue (2017-2028)
4.3 Europe Thin Film Substrates in Electronic Packaging Revenue (2017-2028)
4.4 Asia-Pacific Thin Film Substrates in Electronic Packaging Revenue (2017-2028)
4.5 South America Thin Film Substrates in Electronic Packaging Revenue (2017-2028)
4.6 Middle East and Africa Thin Film Substrates in Electronic Packaging Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Thin Film Substrates in Electronic Packaging Sales in Volume by Type (2017-2028)
5.2 Global Thin Film Substrates in Electronic Packaging Revenue by Type (2017-2028)
5.3 Global Thin Film Substrates in Electronic Packaging Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Thin Film Substrates in Electronic Packaging Sales in Volume by Application (2017-2028)
6.2 Global Thin Film Substrates in Electronic Packaging Revenue by Application (2017-2028)
6.3 Global Thin Film Substrates in Electronic Packaging Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Thin Film Substrates in Electronic Packaging Sales by Type (2017-2028)
7.2 North America Thin Film Substrates in Electronic Packaging Sales by Application (2017-2028)
7.3 North America Thin Film Substrates in Electronic Packaging Market Size by Country
7.3.1 North America Thin Film Substrates in Electronic Packaging Sales in Volume by Country (2017-2028)
7.3.2 North America Thin Film Substrates in Electronic Packaging Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Thin Film Substrates in Electronic Packaging Sales by Type (2017-2028)
8.2 Europe Thin Film Substrates in Electronic Packaging Sales by Application (2017-2028)
8.3 Europe Thin Film Substrates in Electronic Packaging Market Size by Country
8.3.1 Europe Thin Film Substrates in Electronic Packaging Sales in Volume by Country (2017-2028)
8.3.2 Europe Thin Film Substrates in Electronic Packaging Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Thin Film Substrates in Electronic Packaging Sales by Type (2017-2028)
9.2 Asia-Pacific Thin Film Substrates in Electronic Packaging Sales by Application (2017-2028)
9.3 Asia-Pacific Thin Film Substrates in Electronic Packaging Market Size by Region
9.3.1 Asia-Pacific Thin Film Substrates in Electronic Packaging Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Thin Film Substrates in Electronic Packaging Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Thin Film Substrates in Electronic Packaging Sales by Type (2017-2028)
10.2 South America Thin Film Substrates in Electronic Packaging Sales by Application (2017-2028)
10.3 South America Thin Film Substrates in Electronic Packaging Market Size by Country
10.3.1 South America Thin Film Substrates in Electronic Packaging Sales in Volume by Country (2017-2028)
10.3.2 South America Thin Film Substrates in Electronic Packaging Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Thin Film Substrates in Electronic Packaging Sales by Type (2017-2028)
11.2 Middle East & Africa Thin Film Substrates in Electronic Packaging Sales by Application (2017-2028)
11.3 Middle East & Africa Thin Film Substrates in Electronic Packaging Market Size by Country
11.3.1 Middle East & Africa Thin Film Substrates in Electronic Packaging Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Thin Film Substrates in Electronic Packaging Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Thin Film Substrates in Electronic Packaging and Key Manufacturers
12.2 Manufacturing Costs Percentage of Thin Film Substrates in Electronic Packaging
12.3 Thin Film Substrates in Electronic Packaging Production Process
12.4 Thin Film Substrates in Electronic Packaging Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Thin Film Substrates in Electronic Packaging Typical Distributors
13.3 Thin Film Substrates in Electronic Packaging Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer