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電子機器組立受託の世界市場:組立タイプ別(PCB、ケーブル・ハーネス、メンブレン・キーパッドスイッチ)、エンドユーザー別(ヘルスケア、自動車、民生機器)、地域別分析

• 英文タイトル:Global Electronic Contract Assembly Market - Segmented by Type of Activity (PCB Assembly Services, Cable/Harness Assembly Services, Membrane/Keypad Switch Assembly Services), End User (Healthcare, Automotive, Consumer Electronics), and Geography - Growth, Trends, and Forecasts (2018 - 2023)

Mordor Intelligenceが調査・発行した産業分析レポートです。電子機器組立受託の世界市場:組立タイプ別(PCB、ケーブル・ハーネス、メンブレン・キーパッドスイッチ)、エンドユーザー別(ヘルスケア、自動車、民生機器)、地域別分析 / Global Electronic Contract Assembly Market - Segmented by Type of Activity (PCB Assembly Services, Cable/Harness Assembly Services, Membrane/Keypad Switch Assembly Services), End User (Healthcare, Automotive, Consumer Electronics), and Geography - Growth, Trends, and Forecasts (2018 - 2023) / B-MOR-05175資料のイメージです。• レポートコード:B-MOR-05175
• 出版社/出版日:Mordor Intelligence / 2018年4月
• レポート形態:英文、PDF、94ページ
• 納品方法:Eメール(受注後2営業日)
• 産業分類:ICT
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レポート概要
本資料は、電子機器組立受託の世界市場について調べ、電子機器組立受託の世界規模、市場動向、市場環境、組立タイプ別(PCB、ケーブル・ハーネス、メンブレン・キーパッドスイッチ)分析、エンドユーザー別(ヘルスケア、自動車、民生機器)分析、アメリカ市場規模、ヨーロッパ市場規模、アジア市場規模、日本市場規模、中国市場規模、関連企業情報などをまとめた調査レポートです。
・イントロダクション
・エグゼクティブサマリー
・電子機器組立受託の世界市場インサイト
・電子機器組立受託の世界市場環境
・電子機器組立受託の世界市場動向
・電子機器組立受託の世界市場規模
・電子機器組立受託の世界市場規模:組立タイプ別(PCB、ケーブル・ハーネス、メンブレン・キーパッドスイッチ)
・電子機器組立受託の世界市場規模:エンドユーザー別(ヘルスケア、自動車、民生機器)
・電子機器組立受託の世界市場:地域別市場規模・分析
・電子機器組立受託の北米市場規模・予測
・電子機器組立受託のアメリカ市場規模・予測
・電子機器組立受託のヨーロッパ市場規模・予測
・電子機器組立受託のアジア市場規模・予測
・電子機器組立受託の日本市場規模・予測
・電子機器組立受託の中国市場規模・予測
・電子機器組立受託のインド市場規模・予測
・関連企業情報・競争状況

The global electronic contract assembly market is expected to register a CAGR of 9.2% during the forecast period of 2018 – 2023. Electronic contract manufacturers have been using a wide range of productive functions for component design, assembly of circuit board, and several such other services. Electronic contract assembly services are expected to witness robust growth across several end users, such as consumer electronics, automotive, and healthcare, due to low penetration rates and significant growth opportunities. The increasing need to optimize the resources is a major factor influencing the growth of the electronic contract assembly services market over the forecast period. The significant benefit of using electronic contract manufacturing services, like assembling of PCBs, is expected to reduce the time and be cost effective with several resources, in addition to firms being able to focus on core competencies better, rather than utilizing resources for manufacturing activities.

The Automotive Sector Accounts for a Significant Share

The upsurge in the demand for electrical vehicles has boosted the need for companies to outsource their electronic component manufacturing, thereby spurring the EMS market in the automotive sector. Connected car and vehicle infotainment system features are at the forefront, enhancing the need for increasingly complex software-driven functionality.

Asia-Pacific Poised to Account for the Major Share

Due to the demand from countries like China and India, Asia-Pacific occupied a significant market share. China has transformed into a major hub of electronics production. The low-cost labor and availability of raw materials are some of the factors influencing the electronic assembly services in this region.

Major Players – AMPHENOL INTERCONNECT PRODUCTS CORP. (AIPC), ATL TECHNOLOGY, COMPULINK, CABLE ASSEMBLIES INC., CONNECT SYSTEMS NV, LEONI SPECIAL CABLES LTD, SEASON COMPONENTS CO. LTD, TYCO ELECTRONICS, VOLEX GROUP PLC, MACK TECHNOLOGIES INC., MULTI-FINELINE ELECTRONIX INC., TTM TECHNOLOGIES INC., and VIASYSTEMS GROUP INC., amongst others.

Key Developments in the Market

• December 2017 – Connect Group expanded its production capacity in Eastern Europe, to address the increasing customer requirements.

Reasons to Purchase this Report

• Impact of increasing applications in the automotive industry.
• Analyzing various perspectives of the market, with the help of Porter’s five forces analysis.
• Growth across various end users, such as automotive, industrial, and healthcare.
• Regional analysis of the market.
• Identify the latest developments, market shares, and strategies employed by the major players.
• 3 months analyst supports along with the Market Estimate sheet (in excel).

Customization of the Report

• This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

レポート目次

1. Introduction

1.1 Key Deliverables of the Study

1.2 Study Assumptions

1.3 Market Definition

1.4 Key Findings of the Study

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

4.1 Market Overview

4.2 Factors Driving the Market

4.3 Factors Restraining the Market

4.4 Industry Attractiveness – Porter’s Five Forces Analysis

4.4.1 Bargaining Power of Suppliers

4.4.2 Bargaining Power of Consumers

4.4.3 Threat of New Entrants

4.4.4 Threat of Substitute Products or Services

4.4.5 Competitive Rivalry among Existing Competitors

5. Global Electronic Contract Assembly Market Segmentation

5.1 By Type of Activity

5.1.1 PCB Assembly Services

5.1.2 Cable/Harness Assembly Services

5.1.3 Membrane/Keypad Switch Assembly Services

5.2 By Application

5.2.1 Healthcare

5.2.2 Automotive

5.2.3 Industrial

5.2.4 IT & Telecom

5.2.5 Consumer Electronics

5.2.6 Others

5.3 By Geography

5.3.1 North America

5.3.1.1 United States

5.3.1.2 Canada

5.3.2 Europe

5.3.2.1 United Kingdom

5.3.2.2 Germany

5.3.2.3 France

5.3.2.4 Rest of Europe

5.3.3 Asia-Pacific

5.3.3.1 China

5.3.3.2 India

5.3.3.3 Japan

5.3.3.4 Rest of Asia-Pacific

5.3.4 Rest of the World

5.3.4.1 Latin America

5.3.4.2 Middle East & Africa

6. Competitive Intelligence – Company Profiles

6.1 Amphenol Interconnect Products Corp. (AIPC)

6.2 ATL Technology

6.3 Compulink Cable Assemblies Inc.

6.4 Connect Systems NV

6.5 Leoni Special Cables Ltd

6.6 Season Components Co. Ltd

6.7 Tyco Electronics

6.8 Volex Group PLC

6.9 Mack Technologies Inc.

6.10 Multi-Fineline Electronix Inc.

6.11 Ttm Technologies Inc.

6.12 Viasystems Group Inc.

*List not Exhaustive

7. Investment Analysis