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レポート概要
| コロナ禍により、フリップ－チップバンピングの世界市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にフリップ－チップバンピングのグローバル市場のxxx％を占める「銅ピラーバンプ（CPB）」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「300mmウェハー」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。 フリップ－チップバンピングの中国市場規模は2021年にUS$xxxと分析されており、アメリカとヨーロッパの市場規模はそれぞれUS$xxxとUS$xxxです。アメリカの割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパのフリップ－チップバンピング市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。 フリップ－チップバンピングのグローバル主要プレイヤーには、Intel、Samsung、LB Semicon Inc、DuPont、FINECS、Amkor Technology、ASE、Raytek Semiconductor,Inc.、Winstek Semiconductor、Nepes、JiangYin ChangDian Advanced Packaging、sj company co., LTD.、SJ Semiconductor Co、Chipbond、Chip More、ChipMOS、Shenzhen Tongxingda Technology、MacDermid Alpha Electronics、Jiangsu CAS Microelectronics Integration、Tianshui Huatian Technology、JCET Group、Unisem Group、Powertech Technology Inc.、SFA Semicon、International Micro Industries、Jiangsu nepes Semiconductor、Jiangsu Yidu Technologyなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。 フリップ－チップバンピング市場は、種類と用途によって区分されます。世界のフリップ－チップバンピング市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。 【種類別セグメント】 銅ピラーバンプ（CPB）、CuNiAuバンピング、Snバンピング、ゴールドバンプ、鉛フリーバンプ、その他 【用途別セグメント】 300mmウェハー、200mmウェハー 【掲載地域】 北米：アメリカ、カナダ ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア 中南米：メキシコ、ブラジル、アルゼンチン 中東・アフリカ：トルコ、サウジアラビア、UAE 【目次（一部）】 ・調査の範囲 - フリップ－チップバンピング製品概要 - 種類別市場（銅ピラーバンプ（CPB）、CuNiAuバンピング、Snバンピング、ゴールドバンプ、鉛フリーバンプ、その他） - 用途別市場（300mmウェハー、200mmウェハー） - 調査の目的 ・エグゼクティブサマリー - 世界のフリップ－チップバンピング販売量予測2017-2028 - 世界のフリップ－チップバンピング売上予測2017-2028 - フリップ－チップバンピングの地域別販売量 - フリップ－チップバンピングの地域別売上 - 北米市場 - ヨーロッパ市場 - アジア太平洋市場 - 中南米市場 - 中東・アフリカ市場 ・メーカーの競争状況 - 主要メーカー別フリップ－チップバンピング販売量 - 主要メーカー別フリップ－チップバンピング売上 - 主要メーカー別フリップ－チップバンピング価格 - 競争状況の分析 - 企業M&A動向 ・種類別市場規模（銅ピラーバンプ（CPB）、CuNiAuバンピング、Snバンピング、ゴールドバンプ、鉛フリーバンプ、その他） - フリップ－チップバンピングの種類別販売量 - フリップ－チップバンピングの種類別売上 - フリップ－チップバンピングの種類別価格 ・用途別市場規模（300mmウェハー、200mmウェハー） - フリップ－チップバンピングの用途別販売量 - フリップ－チップバンピングの用途別売上 - フリップ－チップバンピングの用途別価格 ・北米市場 - 北米のフリップ－チップバンピング市場規模（種類別、用途別） - 主要国別のフリップ－チップバンピング市場規模（アメリカ、カナダ） ・ヨーロッパ市場 - ヨーロッパのフリップ－チップバンピング市場規模（種類別、用途別） - 主要国別のフリップ－チップバンピング市場規模（ドイツ、フランス、イギリス、イタリア、ロシア） ・アジア太平洋市場 - アジア太平洋のフリップ－チップバンピング市場規模（種類別、用途別） - 主要国別のフリップ－チップバンピング市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア） ・中南米市場 - 中南米のフリップ－チップバンピング市場規模（種類別、用途別） - 主要国別のフリップ－チップバンピング市場規模（メキシコ、ブラジル、アルゼンチン） ・中東・アフリカ市場 - 中東・アフリカのフリップ－チップバンピング市場規模（種類別、用途別） - 主要国別のフリップ－チップバンピング市場規模（トルコ、サウジアラビア） ・企業情報 Intel、Samsung、LB Semicon Inc、DuPont、FINECS、Amkor Technology、ASE、Raytek Semiconductor,Inc.、Winstek Semiconductor、Nepes、JiangYin ChangDian Advanced Packaging、sj company co., LTD.、SJ Semiconductor Co、Chipbond、Chip More、ChipMOS、Shenzhen Tongxingda Technology、MacDermid Alpha Electronics、Jiangsu CAS Microelectronics Integration、Tianshui Huatian Technology、JCET Group、Unisem Group、Powertech Technology Inc.、SFA Semicon、International Micro Industries、Jiangsu nepes Semiconductor、Jiangsu Yidu Technology ・産業チェーン及び販売チャネル分析 - フリップ－チップバンピングの産業チェーン分析 - フリップ－チップバンピングの原材料 - フリップ－チップバンピングの生産プロセス - フリップ－チップバンピングの販売及びマーケティング - フリップ－チップバンピングの主要顧客 ・マーケットドライバー、機会、課題、リスク要因分析 - フリップ－チップバンピングの産業動向 - フリップ－チップバンピングのマーケットドライバー - フリップ－チップバンピングの課題 - フリップ－チップバンピングの阻害要因 ・主な調査結果 |
Report Overview
Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Flip-Chip Bumping estimated at US$ million in the year 2022, is projected to reach a revised size of US$ million by 2028, growing at a CAGR of % during the forecast period 2022-2028.
The USA market for Flip-Chip Bumping is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The China market for Flip-Chip Bumping is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The Europe market for Flip-Chip Bumping is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The global key manufacturers of Flip-Chip Bumping include Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, ASE, Raytek Semiconductor,Inc. and Winstek Semiconductor, etc. In 2021, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the Flip-Chip Bumping production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Flip-Chip Bumping by region (region level and country level), by company, by Type and by Wafer Size. from 2017 to 2022 and forecast to 2028.
Report Scope
This latest report researches the industry structure, capacity, production, sales (consumption), revenue, price and gross margin. Major producers’ production locations, market shares, industry ranking and profiles are presented. The primary and secondary research is done in order to access up-to-date government regulations, market information and industry data. Data were collected from the Flip-Chip Bumping manufacturers, distributors, end users, industry associations, governments’ industry bureaus, industry publications, industry experts, third party database, and our in-house databases.
This report also includes a discussion of the major players across each regional Flip-Chip Bumping market. Further, it explains the major drivers and regional dynamics of the global Flip-Chip Bumping market and current trends within the industry.
Key Companies Covered
In this section of the report, the researchers have done a comprehensive analysis of the prominent players operating and the strategies they are focusing on to combat the intense competition. Company profiles and market share analysis of the prominent players are also provided in this section. Additionally, the specialists have done an all-encompassing analysis of each player. They have also provided reliable sales, revenue, price, market share and rank data of the manufacturers for the period 2017-2022. With the assistance of this report, key players, stakeholders, and other participants will be able to stay abreast of the recent and upcoming developments in the business, further enabling them to make efficient choices. Mentioned below are the prime players taken into account in this research report:
Intel
Samsung
LB Semicon Inc
DuPont
FINECS
Amkor Technology
ASE
Raytek Semiconductor,Inc.
Winstek Semiconductor
Nepes
JiangYin ChangDian Advanced Packaging
sj company co., LTD.
SJ Semiconductor Co
Chipbond
Chip More
ChipMOS
Shenzhen Tongxingda Technology
MacDermid Alpha Electronics
Jiangsu CAS Microelectronics Integration
Tianshui Huatian Technology
JCET Group
Unisem Group
Powertech Technology Inc.
SFA Semicon
International Micro Industries
Jiangsu nepes Semiconductor
Jiangsu Yidu Technology
Market Segments
This report has explored the key segments: by Type and by Wafer Size. The lucrativeness and growth potential have been looked into by the industry experts in this report. This report also provides sales, revenue and average price forecast data by type and by application segments based on production, price, and value for the period 2017-2028.
Flip-Chip Bumping Segment by Type
Copper Pillar Bump (CPB)
CuNiAu Bumping
Sn Bumping
Gold Bump
Lead Free Bump
Others
Flip-Chip Bumping Segment by Wafer Size
300mm Wafer
200mm Wafer
Key Regions & Countries
This section of the report provides key insights regarding various regions and the key players operating in each region. This report analyzes the Flip-Chip Bumping production by region/country, and the sales (consumption) by region/country. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the value and sales data of each region and country for the period 2017-2028.
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Flip-Chip Bumping market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Report Includes:
This report presents an overview of global market for Flip-Chip Bumping, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2017 – 2021, estimates for 2022, and projections of CAGR through 2028.
This report researches the key producers of Flip-Chip Bumping, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Flip-Chip Bumping, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Flip-Chip Bumping sales, revenue, market share and industry ranking of main manufacturers, data from 2017 to 2022. Identification of the major stakeholders in the global Flip-Chip Bumping market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by type and by application, sales, revenue, and price, from 2017 to 2028. Evaluation and forecast the market size for Flip-Chip Bumping sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, ASE, Raytek Semiconductor,Inc. and Winstek Semiconductor, etc.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Flip-Chip Bumping capacity, production/output of global and key producers (regions/countries). It provides a quantitative analysis of the capacity, production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Flip-Chip Bumping in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Flip-Chip Bumping manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments according to product types, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments according to application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by type, by wafer size and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by wafer size and by country, sales and revenue for each segment.
Chapter 9: Asia Pacific by type, by wafer size and by country, sales and revenue for each segment.
Chapter 10: Latin America by type, by wafer size and by country, sales and revenue for each segment.
Chapter 11: Middle East and Africa by type, by wafer size and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Flip-Chip Bumping sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
1 Study Coverage
1.1 Flip-Chip Bumping Product Introduction
1.2 Market by Type
1.2.1 Global Flip-Chip Bumping Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Copper Pillar Bump (CPB)
1.2.3 CuNiAu Bumping
1.2.4 Sn Bumping
1.2.5 Gold Bump
1.2.6 Lead Free Bump
1.2.7 Others
1.3 Market by Wafer Size
1.3.1 Global Flip-Chip Bumping Market Size by Wafer Size, 2017 VS 2021 VS 2028
1.3.2 300mm Wafer
1.3.3 200mm Wafer
1.4 Study Objectives
1.5 Years Considered
2 Global Flip-Chip Bumping Production
2.1 Global Flip-Chip Bumping Production Capacity (2017-2028)
2.2 Global Flip-Chip Bumping Production by Region: 2017 VS 2021 VS 2028
2.3 Global Flip-Chip Bumping Production by Region
2.3.1 Global Flip-Chip Bumping Historic Production by Region (2017-2022)
2.3.2 Global Flip-Chip Bumping Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 China Taiwan
2.9 South Korea
3 Global Flip-Chip Bumping Sales in Volume & Value Estimates and Forecasts
3.1 Global Flip-Chip Bumping Sales Estimates and Forecasts 2017-2028
3.2 Global Flip-Chip Bumping Revenue Estimates and Forecasts 2017-2028
3.3 Global Flip-Chip Bumping Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Flip-Chip Bumping Sales by Region
3.4.1 Global Flip-Chip Bumping Sales by Region (2017-2022)
3.4.2 Global Sales Flip-Chip Bumping by Region (2023-2028)
3.5 Global Flip-Chip Bumping Revenue by Region
3.5.1 Global Flip-Chip Bumping Revenue by Region (2017-2022)
3.5.2 Global Flip-Chip Bumping Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Flip-Chip Bumping Production Capacity by Manufacturers
4.2 Global Flip-Chip Bumping Sales by Manufacturers
4.2.1 Global Flip-Chip Bumping Sales by Manufacturers (2017-2022)
4.2.2 Global Flip-Chip Bumping Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Flip-Chip Bumping in 2021
4.3 Global Flip-Chip Bumping Revenue by Manufacturers
4.3.1 Global Flip-Chip Bumping Revenue by Manufacturers (2017-2022)
4.3.2 Global Flip-Chip Bumping Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Flip-Chip Bumping Revenue in 2021
4.4 Global Flip-Chip Bumping Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Flip-Chip Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Flip-Chip Bumping Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Flip-Chip Bumping Sales by Type
5.1.1 Global Flip-Chip Bumping Historical Sales by Type (2017-2022)
5.1.2 Global Flip-Chip Bumping Forecasted Sales by Type (2023-2028)
5.1.3 Global Flip-Chip Bumping Sales Market Share by Type (2017-2028)
5.2 Global Flip-Chip Bumping Revenue by Type
5.2.1 Global Flip-Chip Bumping Historical Revenue by Type (2017-2022)
5.2.2 Global Flip-Chip Bumping Forecasted Revenue by Type (2023-2028)
5.2.3 Global Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
5.3 Global Flip-Chip Bumping Price by Type
5.3.1 Global Flip-Chip Bumping Price by Type (2017-2022)
5.3.2 Global Flip-Chip Bumping Price Forecast by Type (2023-2028)
6 Market Size by Wafer Size
6.1 Global Flip-Chip Bumping Sales by Wafer Size
6.1.1 Global Flip-Chip Bumping Historical Sales by Wafer Size (2017-2022)
6.1.2 Global Flip-Chip Bumping Forecasted Sales by Wafer Size (2023-2028)
6.1.3 Global Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
6.2 Global Flip-Chip Bumping Revenue by Wafer Size
6.2.1 Global Flip-Chip Bumping Historical Revenue by Wafer Size (2017-2022)
6.2.2 Global Flip-Chip Bumping Forecasted Revenue by Wafer Size (2023-2028)
6.2.3 Global Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
6.3 Global Flip-Chip Bumping Price by Wafer Size
6.3.1 Global Flip-Chip Bumping Price by Wafer Size (2017-2022)
6.3.2 Global Flip-Chip Bumping Price Forecast by Wafer Size (2023-2028)
7 North America
7.1 North America Flip-Chip Bumping Market Size by Type
7.1.1 North America Flip-Chip Bumping Sales by Type (2017-2028)
7.1.2 North America Flip-Chip Bumping Revenue by Type (2017-2028)
7.2 North America Flip-Chip Bumping Market Size by Wafer Size
7.2.1 North America Flip-Chip Bumping Sales by Wafer Size (2017-2028)
7.2.2 North America Flip-Chip Bumping Revenue by Wafer Size (2017-2028)
7.3 North America Flip-Chip Bumping Sales by Country
7.3.1 North America Flip-Chip Bumping Sales by Country (2017-2028)
7.3.2 North America Flip-Chip Bumping Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Flip-Chip Bumping Market Size by Type
8.1.1 Europe Flip-Chip Bumping Sales by Type (2017-2028)
8.1.2 Europe Flip-Chip Bumping Revenue by Type (2017-2028)
8.2 Europe Flip-Chip Bumping Market Size by Wafer Size
8.2.1 Europe Flip-Chip Bumping Sales by Wafer Size (2017-2028)
8.2.2 Europe Flip-Chip Bumping Revenue by Wafer Size (2017-2028)
8.3 Europe Flip-Chip Bumping Sales by Country
8.3.1 Europe Flip-Chip Bumping Sales by Country (2017-2028)
8.3.2 Europe Flip-Chip Bumping Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Flip-Chip Bumping Market Size by Type
9.1.1 Asia Pacific Flip-Chip Bumping Sales by Type (2017-2028)
9.1.2 Asia Pacific Flip-Chip Bumping Revenue by Type (2017-2028)
9.2 Asia Pacific Flip-Chip Bumping Market Size by Wafer Size
9.2.1 Asia Pacific Flip-Chip Bumping Sales by Wafer Size (2017-2028)
9.2.2 Asia Pacific Flip-Chip Bumping Revenue by Wafer Size (2017-2028)
9.3 Asia Pacific Flip-Chip Bumping Sales by Region
9.3.1 Asia Pacific Flip-Chip Bumping Sales by Region (2017-2028)
9.3.2 Asia Pacific Flip-Chip Bumping Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Flip-Chip Bumping Market Size by Type
10.1.1 Latin America Flip-Chip Bumping Sales by Type (2017-2028)
10.1.2 Latin America Flip-Chip Bumping Revenue by Type (2017-2028)
10.2 Latin America Flip-Chip Bumping Market Size by Wafer Size
10.2.1 Latin America Flip-Chip Bumping Sales by Wafer Size (2017-2028)
10.2.2 Latin America Flip-Chip Bumping Revenue by Wafer Size (2017-2028)
10.3 Latin America Flip-Chip Bumping Sales by Country
10.3.1 Latin America Flip-Chip Bumping Sales by Country (2017-2028)
10.3.2 Latin America Flip-Chip Bumping Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa Flip-Chip Bumping Market Size by Type
11.1.1 Middle East and Africa Flip-Chip Bumping Sales by Type (2017-2028)
11.1.2 Middle East and Africa Flip-Chip Bumping Revenue by Type (2017-2028)
11.2 Middle East and Africa Flip-Chip Bumping Market Size by Wafer Size
11.2.1 Middle East and Africa Flip-Chip Bumping Sales by Wafer Size (2017-2028)
11.2.2 Middle East and Africa Flip-Chip Bumping Revenue by Wafer Size (2017-2028)
11.3 Middle East and Africa Flip-Chip Bumping Sales by Country
11.3.1 Middle East and Africa Flip-Chip Bumping Sales by Country (2017-2028)
11.3.2 Middle East and Africa Flip-Chip Bumping Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Intel
12.1.1 Intel Corporation Information
12.1.2 Intel Overview
12.1.3 Intel Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Intel Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Intel Recent Developments
12.2 Samsung
12.2.1 Samsung Corporation Information
12.2.2 Samsung Overview
12.2.3 Samsung Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Samsung Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Samsung Recent Developments
12.3 LB Semicon Inc
12.3.1 LB Semicon Inc Corporation Information
12.3.2 LB Semicon Inc Overview
12.3.3 LB Semicon Inc Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 LB Semicon Inc Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 LB Semicon Inc Recent Developments
12.4 DuPont
12.4.1 DuPont Corporation Information
12.4.2 DuPont Overview
12.4.3 DuPont Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 DuPont Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 DuPont Recent Developments
12.5 FINECS
12.5.1 FINECS Corporation Information
12.5.2 FINECS Overview
12.5.3 FINECS Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 FINECS Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 FINECS Recent Developments
12.6 Amkor Technology
12.6.1 Amkor Technology Corporation Information
12.6.2 Amkor Technology Overview
12.6.3 Amkor Technology Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Amkor Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Amkor Technology Recent Developments
12.7 ASE
12.7.1 ASE Corporation Information
12.7.2 ASE Overview
12.7.3 ASE Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 ASE Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 ASE Recent Developments
12.8 Raytek Semiconductor,Inc.
12.8.1 Raytek Semiconductor,Inc. Corporation Information
12.8.2 Raytek Semiconductor,Inc. Overview
12.8.3 Raytek Semiconductor,Inc. Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Raytek Semiconductor,Inc. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Raytek Semiconductor,Inc. Recent Developments
12.9 Winstek Semiconductor
12.9.1 Winstek Semiconductor Corporation Information
12.9.2 Winstek Semiconductor Overview
12.9.3 Winstek Semiconductor Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Winstek Semiconductor Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Winstek Semiconductor Recent Developments
12.10 Nepes
12.10.1 Nepes Corporation Information
12.10.2 Nepes Overview
12.10.3 Nepes Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 Nepes Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Nepes Recent Developments
12.11 JiangYin ChangDian Advanced Packaging
12.11.1 JiangYin ChangDian Advanced Packaging Corporation Information
12.11.2 JiangYin ChangDian Advanced Packaging Overview
12.11.3 JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 JiangYin ChangDian Advanced Packaging Recent Developments
12.12 sj company co., LTD.
12.12.1 sj company co., LTD. Corporation Information
12.12.2 sj company co., LTD. Overview
12.12.3 sj company co., LTD. Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 sj company co., LTD. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 sj company co., LTD. Recent Developments
12.13 SJ Semiconductor Co
12.13.1 SJ Semiconductor Co Corporation Information
12.13.2 SJ Semiconductor Co Overview
12.13.3 SJ Semiconductor Co Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 SJ Semiconductor Co Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 SJ Semiconductor Co Recent Developments
12.14 Chipbond
12.14.1 Chipbond Corporation Information
12.14.2 Chipbond Overview
12.14.3 Chipbond Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Chipbond Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Chipbond Recent Developments
12.15 Chip More
12.15.1 Chip More Corporation Information
12.15.2 Chip More Overview
12.15.3 Chip More Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 Chip More Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 Chip More Recent Developments
12.16 ChipMOS
12.16.1 ChipMOS Corporation Information
12.16.2 ChipMOS Overview
12.16.3 ChipMOS Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 ChipMOS Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 ChipMOS Recent Developments
12.17 Shenzhen Tongxingda Technology
12.17.1 Shenzhen Tongxingda Technology Corporation Information
12.17.2 Shenzhen Tongxingda Technology Overview
12.17.3 Shenzhen Tongxingda Technology Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 Shenzhen Tongxingda Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 Shenzhen Tongxingda Technology Recent Developments
12.18 MacDermid Alpha Electronics
12.18.1 MacDermid Alpha Electronics Corporation Information
12.18.2 MacDermid Alpha Electronics Overview
12.18.3 MacDermid Alpha Electronics Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 MacDermid Alpha Electronics Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 MacDermid Alpha Electronics Recent Developments
12.19 Jiangsu CAS Microelectronics Integration
12.19.1 Jiangsu CAS Microelectronics Integration Corporation Information
12.19.2 Jiangsu CAS Microelectronics Integration Overview
12.19.3 Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Jiangsu CAS Microelectronics Integration Recent Developments
12.20 Tianshui Huatian Technology
12.20.1 Tianshui Huatian Technology Corporation Information
12.20.2 Tianshui Huatian Technology Overview
12.20.3 Tianshui Huatian Technology Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.20.4 Tianshui Huatian Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.20.5 Tianshui Huatian Technology Recent Developments
12.21 JCET Group
12.21.1 JCET Group Corporation Information
12.21.2 JCET Group Overview
12.21.3 JCET Group Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.21.4 JCET Group Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.21.5 JCET Group Recent Developments
12.22 Unisem Group
12.22.1 Unisem Group Corporation Information
12.22.2 Unisem Group Overview
12.22.3 Unisem Group Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.22.4 Unisem Group Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.22.5 Unisem Group Recent Developments
12.23 Powertech Technology Inc.
12.23.1 Powertech Technology Inc. Corporation Information
12.23.2 Powertech Technology Inc. Overview
12.23.3 Powertech Technology Inc. Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.23.4 Powertech Technology Inc. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.23.5 Powertech Technology Inc. Recent Developments
12.24 SFA Semicon
12.24.1 SFA Semicon Corporation Information
12.24.2 SFA Semicon Overview
12.24.3 SFA Semicon Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.24.4 SFA Semicon Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.24.5 SFA Semicon Recent Developments
12.25 International Micro Industries
12.25.1 International Micro Industries Corporation Information
12.25.2 International Micro Industries Overview
12.25.3 International Micro Industries Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.25.4 International Micro Industries Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.25.5 International Micro Industries Recent Developments
12.26 Jiangsu nepes Semiconductor
12.26.1 Jiangsu nepes Semiconductor Corporation Information
12.26.2 Jiangsu nepes Semiconductor Overview
12.26.3 Jiangsu nepes Semiconductor Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.26.4 Jiangsu nepes Semiconductor Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.26.5 Jiangsu nepes Semiconductor Recent Developments
12.27 Jiangsu Yidu Technology
12.27.1 Jiangsu Yidu Technology Corporation Information
12.27.2 Jiangsu Yidu Technology Overview
12.27.3 Jiangsu Yidu Technology Flip-Chip Bumping Sales, Price, Revenue and Gross Margin (2017-2022)
12.27.4 Jiangsu Yidu Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
12.27.5 Jiangsu Yidu Technology Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Flip-Chip Bumping Industry Chain Analysis
13.2 Flip-Chip Bumping Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Flip-Chip Bumping Production Mode & Process
13.4 Flip-Chip Bumping Sales and Marketing
13.4.1 Flip-Chip Bumping Sales Channels
13.4.2 Flip-Chip Bumping Distributors
13.5 Flip-Chip Bumping Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Flip-Chip Bumping Industry Trends
14.2 Flip-Chip Bumping Market Drivers
14.3 Flip-Chip Bumping Market Challenges
14.4 Flip-Chip Bumping Market Restraints
15 Key Finding in The Global Flip-Chip Bumping Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Table 1. Global Flip-Chip Bumping Market Size Growth Rate by Type, 2017 VS 2021 VS 2028 (US$ Million)
Table 2. Major Manufacturers of Copper Pillar Bump (CPB)
Table 3. Major Manufacturers of CuNiAu Bumping
Table 4. Major Manufacturers of Sn Bumping
Table 5. Major Manufacturers of Gold Bump
Table 6. Major Manufacturers of Lead Free Bump
Table 7. Major Manufacturers of Others
Table 8. Global Flip-Chip Bumping Market Size Growth Rate by Wafer Size, 2017 VS 2021 2028 (US$ Million)
Table 9. Global Flip-Chip Bumping Production by Region: 2017 VS 2021 VS 2028 (Million Units)
Table 10. Global Flip-Chip Bumping Production by Region (2017-2022) & (Million Units)
Table 11. Global Flip-Chip Bumping Production Market Share by Region (2017-2022)
Table 12. Global Flip-Chip Bumping Production by Region (2023-2028) & (Million Units)
Table 13. Global Flip-Chip Bumping Production Market Share by Region (2023-2028)
Table 14. Global Flip-Chip Bumping Revenue by Region: 2017 VS 2021 VS 2028 (US$ Million)
Table 15. Global Flip-Chip Bumping Sales by Region (2017-2022) & (Million Units)
Table 16. Global Flip-Chip Bumping Sales Market Share by Region (2017-2022)
Table 17. Global Flip-Chip Bumping Sales by Region (2023-2028) & (Million Units)
Table 18. Global Flip-Chip Bumping Sales Market Share by Region (2023-2028)
Table 19. Global Flip-Chip Bumping Revenue by Region (2017-2022) & (US$ Million)
Table 20. Global Flip-Chip Bumping Revenue Market Share by Region (2017-2022)
Table 21. Global Flip-Chip Bumping Revenue by Region (2023-2028) & (US$ Million)
Table 22. Global Flip-Chip Bumping Revenue Market Share by Region (2023-2028)
Table 23. Global Flip-Chip Bumping Production Capacity by Manufacturers (2017-2022) & (Million Units)
Table 24. Global Flip-Chip Bumping Capacity Market Share by Manufacturers (2017-2022)
Table 25. Global Flip-Chip Bumping Sales by Manufacturers (2017-2022) & (Million Units)
Table 26. Global Flip-Chip Bumping Sales Market Share by Manufacturers (2017-2022)
Table 27. Global Flip-Chip Bumping Revenue by Manufacturers (2017-2022) & (US$ Million)
Table 28. Global Flip-Chip Bumping Revenue Share by Manufacturers (2017-2022)
Table 29. Flip-Chip Bumping Price by Manufacturers 2017-2022 (US$/K Unit)
Table 30. Global Flip-Chip Bumping Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 31. Global Flip-Chip Bumping by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Flip-Chip Bumping as of 2021)
Table 32. Flip-Chip Bumping Manufacturing Base Distribution and Headquarters
Table 33. Manufacturers Flip-Chip Bumping Product Offered
Table 34. Date of Manufacturers Enter into Flip-Chip Bumping Market
Table 35. Mergers & Acquisitions, Expansion Plans
Table 36. Global Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 37. Global Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 38. Global Flip-Chip Bumping Sales Share by Type (2017-2022)
Table 39. Global Flip-Chip Bumping Sales Share by Type (2023-2028)
Table 40. Global Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 41. Global Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 42. Global Flip-Chip Bumping Revenue Share by Type (2017-2022)
Table 43. Global Flip-Chip Bumping Revenue Share by Type (2023-2028)
Table 44. Flip-Chip Bumping Price by Type (2017-2022) & (US$/K Unit)
Table 45. Global Flip-Chip Bumping Price Forecast by Type (2023-2028) & (US$/K Unit)
Table 46. Global Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 47. Global Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 48. Global Flip-Chip Bumping Sales Share by Wafer Size (2017-2022)
Table 49. Global Flip-Chip Bumping Sales Share by Wafer Size (2023-2028)
Table 50. Global Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 51. Global Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 52. Global Flip-Chip Bumping Revenue Share by Wafer Size (2017-2022)
Table 53. Global Flip-Chip Bumping Revenue Share by Wafer Size (2023-2028)
Table 54. Flip-Chip Bumping Price by Wafer Size (2017-2022) & (US$/K Unit)
Table 55. Global Flip-Chip Bumping Price Forecast by Wafer Size (2023-2028) & (US$/K Unit)
Table 56. North America Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 57. North America Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 58. North America Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 59. North America Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 60. North America Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 61. North America Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 62. North America Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 63. North America Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 64. North America Flip-Chip Bumping Sales by Country (2017-2022) & (Million Units)
Table 65. North America Flip-Chip Bumping Sales by Country (2023-2028) & (Million Units)
Table 66. North America Flip-Chip Bumping Revenue by Country (2017-2022) & (US$ Million)
Table 67. North America Flip-Chip Bumping Revenue by Country (2023-2028) & (US$ Million)
Table 68. Europe Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 69. Europe Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 70. Europe Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 71. Europe Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 72. Europe Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 73. Europe Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 74. Europe Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 75. Europe Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 76. Europe Flip-Chip Bumping Sales by Country (2017-2022) & (Million Units)
Table 77. Europe Flip-Chip Bumping Sales by Country (2023-2028) & (Million Units)
Table 78. Europe Flip-Chip Bumping Revenue by Country (2017-2022) & (US$ Million)
Table 79. Europe Flip-Chip Bumping Revenue by Country (2023-2028) & (US$ Million)
Table 80. Asia Pacific Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 81. Asia Pacific Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 82. Asia Pacific Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 83. Asia Pacific Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 84. Asia Pacific Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 85. Asia Pacific Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 86. Asia Pacific Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 87. Asia Pacific Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 88. Asia Pacific Flip-Chip Bumping Sales by Region (2017-2022) & (Million Units)
Table 89. Asia Pacific Flip-Chip Bumping Sales by Region (2023-2028) & (Million Units)
Table 90. Asia Pacific Flip-Chip Bumping Revenue by Region (2017-2022) & (US$ Million)
Table 91. Asia Pacific Flip-Chip Bumping Revenue by Region (2023-2028) & (US$ Million)
Table 92. Latin America Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 93. Latin America Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 94. Latin America Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 95. Latin America Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 96. Latin America Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 97. Latin America Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 98. Latin America Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 99. Latin America Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 100. Latin America Flip-Chip Bumping Sales by Country (2017-2022) & (Million Units)
Table 101. Latin America Flip-Chip Bumping Sales by Country (2023-2028) & (Million Units)
Table 102. Latin America Flip-Chip Bumping Revenue by Country (2017-2022) & (US$ Million)
Table 103. Latin America Flip-Chip Bumping Revenue by Country (2023-2028) & (US$ Million)
Table 104. Middle East and Africa Flip-Chip Bumping Sales by Type (2017-2022) & (Million Units)
Table 105. Middle East and Africa Flip-Chip Bumping Sales by Type (2023-2028) & (Million Units)
Table 106. Middle East and Africa Flip-Chip Bumping Revenue by Type (2017-2022) & (US$ Million)
Table 107. Middle East and Africa Flip-Chip Bumping Revenue by Type (2023-2028) & (US$ Million)
Table 108. Middle East and Africa Flip-Chip Bumping Sales by Wafer Size (2017-2022) & (Million Units)
Table 109. Middle East and Africa Flip-Chip Bumping Sales by Wafer Size (2023-2028) & (Million Units)
Table 110. Middle East and Africa Flip-Chip Bumping Revenue by Wafer Size (2017-2022) & (US$ Million)
Table 111. Middle East and Africa Flip-Chip Bumping Revenue by Wafer Size (2023-2028) & (US$ Million)
Table 112. Middle East and Africa Flip-Chip Bumping Sales by Country (2017-2022) & (Million Units)
Table 113. Middle East and Africa Flip-Chip Bumping Sales by Country (2023-2028) & (Million Units)
Table 114. Middle East and Africa Flip-Chip Bumping Revenue by Country (2017-2022) & (US$ Million)
Table 115. Middle East and Africa Flip-Chip Bumping Revenue by Country (2023-2028) & (US$ Million)
Table 116. Intel Corporation Information
Table 117. Intel Description and Major Businesses
Table 118. Intel Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 119. Intel Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 120. Intel Recent Development
Table 121. Samsung Corporation Information
Table 122. Samsung Description and Major Businesses
Table 123. Samsung Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 124. Samsung Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 125. Samsung Recent Development
Table 126. LB Semicon Inc Corporation Information
Table 127. LB Semicon Inc Description and Major Businesses
Table 128. LB Semicon Inc Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 129. LB Semicon Inc Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 130. LB Semicon Inc Recent Development
Table 131. DuPont Corporation Information
Table 132. DuPont Description and Major Businesses
Table 133. DuPont Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 134. DuPont Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 135. DuPont Recent Development
Table 136. FINECS Corporation Information
Table 137. FINECS Description and Major Businesses
Table 138. FINECS Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 139. FINECS Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 140. FINECS Recent Development
Table 141. Amkor Technology Corporation Information
Table 142. Amkor Technology Description and Major Businesses
Table 143. Amkor Technology Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 144. Amkor Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 145. Amkor Technology Recent Development
Table 146. ASE Corporation Information
Table 147. ASE Description and Major Businesses
Table 148. ASE Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 149. ASE Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 150. ASE Recent Development
Table 151. Raytek Semiconductor,Inc. Corporation Information
Table 152. Raytek Semiconductor,Inc. Description and Major Businesses
Table 153. Raytek Semiconductor,Inc. Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 154. Raytek Semiconductor,Inc. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 155. Raytek Semiconductor,Inc. Recent Development
Table 156. Winstek Semiconductor Corporation Information
Table 157. Winstek Semiconductor Description and Major Businesses
Table 158. Winstek Semiconductor Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 159. Winstek Semiconductor Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 160. Winstek Semiconductor Recent Development
Table 161. Nepes Corporation Information
Table 162. Nepes Description and Major Businesses
Table 163. Nepes Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 164. Nepes Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 165. Nepes Recent Development
Table 166. JiangYin ChangDian Advanced Packaging Corporation Information
Table 167. JiangYin ChangDian Advanced Packaging Description and Major Businesses
Table 168. JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 169. JiangYin ChangDian Advanced Packaging Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 170. JiangYin ChangDian Advanced Packaging Recent Development
Table 171. sj company co., LTD. Corporation Information
Table 172. sj company co., LTD. Description and Major Businesses
Table 173. sj company co., LTD. Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 174. sj company co., LTD. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 175. sj company co., LTD. Recent Development
Table 176. SJ Semiconductor Co Corporation Information
Table 177. SJ Semiconductor Co Description and Major Businesses
Table 178. SJ Semiconductor Co Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 179. SJ Semiconductor Co Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 180. SJ Semiconductor Co Recent Development
Table 181. Chipbond Corporation Information
Table 182. Chipbond Description and Major Businesses
Table 183. Chipbond Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 184. Chipbond Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 185. Chipbond Recent Development
Table 186. Chip More Corporation Information
Table 187. Chip More Description and Major Businesses
Table 188. Chip More Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 189. Chip More Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 190. Chip More Recent Development
Table 191. ChipMOS Corporation Information
Table 192. ChipMOS Description and Major Businesses
Table 193. ChipMOS Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 194. ChipMOS Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 195. ChipMOS Recent Development
Table 196. Shenzhen Tongxingda Technology Corporation Information
Table 197. Shenzhen Tongxingda Technology Description and Major Businesses
Table 198. Shenzhen Tongxingda Technology Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 199. Shenzhen Tongxingda Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 200. Shenzhen Tongxingda Technology Recent Development
Table 201. MacDermid Alpha Electronics Corporation Information
Table 202. MacDermid Alpha Electronics Description and Major Businesses
Table 203. MacDermid Alpha Electronics Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 204. MacDermid Alpha Electronics Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 205. MacDermid Alpha Electronics Recent Development
Table 206. Jiangsu CAS Microelectronics Integration Corporation Information
Table 207. Jiangsu CAS Microelectronics Integration Description and Major Businesses
Table 208. Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 209. Jiangsu CAS Microelectronics Integration Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 210. Jiangsu CAS Microelectronics Integration Recent Development
Table 211. Tianshui Huatian Technology Corporation Information
Table 212. Tianshui Huatian Technology Description and Major Businesses
Table 213. Tianshui Huatian Technology Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 214. Tianshui Huatian Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 215. Tianshui Huatian Technology Recent Development
Table 216. JCET Group Corporation Information
Table 217. JCET Group Description and Major Businesses
Table 218. JCET Group Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 219. JCET Group Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 220. JCET Group Recent Development
Table 221. Unisem Group Corporation Information
Table 222. Unisem Group Description and Major Businesses
Table 223. Unisem Group Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 224. Unisem Group Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 225. Unisem Group Recent Development
Table 226. Powertech Technology Inc. Corporation Information
Table 227. Powertech Technology Inc. Description and Major Businesses
Table 228. Powertech Technology Inc. Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 229. Powertech Technology Inc. Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 230. Powertech Technology Inc. Recent Development
Table 231. SFA Semicon Corporation Information
Table 232. SFA Semicon Description and Major Businesses
Table 233. SFA Semicon Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 234. SFA Semicon Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 235. SFA Semicon Recent Development
Table 236. International Micro Industries Corporation Information
Table 237. International Micro Industries Description and Major Businesses
Table 238. International Micro Industries Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 239. International Micro Industries Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 240. International Micro Industries Recent Development
Table 241. Jiangsu nepes Semiconductor Corporation Information
Table 242. Jiangsu nepes Semiconductor Description and Major Businesses
Table 243. Jiangsu nepes Semiconductor Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 244. Jiangsu nepes Semiconductor Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 245. Jiangsu nepes Semiconductor Recent Development
Table 246. Jiangsu Yidu Technology Corporation Information
Table 247. Jiangsu Yidu Technology Description and Major Businesses
Table 248. Jiangsu Yidu Technology Flip-Chip Bumping Sales (Million Units), Revenue (US$ Million), Price (US$/K Unit) and Gross Margin (2017-2022)
Table 249. Jiangsu Yidu Technology Flip-Chip Bumping Product Model Numbers, Pictures, Descriptions and Specifications
Table 250. Jiangsu Yidu Technology Recent Development
Table 251. Key Raw Materials Lists
Table 252. Raw Materials Key Suppliers Lists
Table 253. Flip-Chip Bumping Distributors List
Table 254. Flip-Chip Bumping Customers List
Table 255. Flip-Chip Bumping Market Trends
Table 256. Flip-Chip Bumping Market Drivers
Table 257. Flip-Chip Bumping Market Challenges
Table 258. Flip-Chip Bumping Market Restraints
Table 259. Research Programs/Design for This Report
Table 260. Key Data Information from Secondary Sources
Table 261. Key Data Information from Primary Sources
List of Figures
Figure 1. Flip-Chip Bumping Product Picture
Figure 2. Global Flip-Chip Bumping Market Share by Type in 2021 & 2028
Figure 3. Copper Pillar Bump (CPB) Product Picture
Figure 4. CuNiAu Bumping Product Picture
Figure 5. Sn Bumping Product Picture
Figure 6. Gold Bump Product Picture
Figure 7. Lead Free Bump Product Picture
Figure 8. Others Product Picture
Figure 9. Global Flip-Chip Bumping Market Share by Wafer Size in 2021 & 2028
Figure 10. 300mm Wafer
Figure 11. 200mm Wafer
Figure 12. Flip-Chip Bumping Report Years Considered
Figure 13. Global Flip-Chip Bumping Capacity, Production and Utilization (2017-2028) & (Million Units)
Figure 14. Global Flip-Chip Bumping Production Market Share by Region in Percentage: 2021 Versus 2028
Figure 15. Global Flip-Chip Bumping Production Market Share by Region (2017-2022)
Figure 16. Global Flip-Chip Bumping Production Market Share by Region (2023-2028)
Figure 17. Flip-Chip Bumping Production Growth Rate in North America (2017-2028) & (Million Units)
Figure 18. Flip-Chip Bumping Production Growth Rate in Europe (2017-2028) & (Million Units)
Figure 19. Flip-Chip Bumping Production Growth Rate in China (2017-2028) & (Million Units)
Figure 20. Flip-Chip Bumping Production Growth Rate in Japan (2017-2028) & (Million Units)
Figure 21. Flip-Chip Bumping Production Growth Rate in China Taiwan (2017-2028) & (Million Units)
Figure 22. Flip-Chip Bumping Production Growth Rate in South Korea (2017-2028) & (Million Units)
Figure 23. Global Flip-Chip Bumping Sales 2017-2028 (Million Units)
Figure 24. Global Flip-Chip Bumping Revenue, (US$ Million), 2017 VS 2021 VS 2028
Figure 25. Global Flip-Chip Bumping Revenue 2017-2028 (US$ Million)
Figure 26. Global Flip-Chip Bumping Revenue Market Share by Region in Percentage: 2021 Versus 2028
Figure 27. Global Flip-Chip Bumping Sales Market Share by Region (2017-2022)
Figure 28. Global Flip-Chip Bumping Sales Market Share by Region (2023-2028)
Figure 29. North America Flip-Chip Bumping Sales YoY (2017-2028) & (Million Units)
Figure 30. North America Flip-Chip Bumping Revenue YoY (2017-2028) & (US$ Million)
Figure 31. Europe Flip-Chip Bumping Sales YoY (2017-2028) & (Million Units)
Figure 32. Europe Flip-Chip Bumping Revenue YoY (2017-2028) & (US$ Million)
Figure 33. Asia-Pacific Flip-Chip Bumping Sales YoY (2017-2028) & (Million Units)
Figure 34. Asia-Pacific Flip-Chip Bumping Revenue YoY (2017-2028) & (US$ Million)
Figure 35. Latin America Flip-Chip Bumping Sales YoY (2017-2028) & (Million Units)
Figure 36. Latin America Flip-Chip Bumping Revenue YoY (2017-2028) & (US$ Million)
Figure 37. Middle East & Africa Flip-Chip Bumping Sales YoY (2017-2028) & (Million Units)
Figure 38. Middle East & Africa Flip-Chip Bumping Revenue YoY (2017-2028) & (US$ Million)
Figure 39. The Flip-Chip Bumping Market Share of Top 10 and Top 5 Largest Manufacturers Around the World in 2021
Figure 40. The Top 5 and 10 Largest Manufacturers of Flip-Chip Bumping in the World: Market Share by Flip-Chip Bumping Revenue in 2021
Figure 41. Flip-Chip Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2017 VS 2021
Figure 42. Global Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 43. Global Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 44. Global Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 45. Global Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 46. North America Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 47. North America Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 48. North America Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 49. North America Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 50. North America Flip-Chip Bumping Sales Share by Country (2017-2028)
Figure 51. North America Flip-Chip Bumping Revenue Share by Country (2017-2028)
Figure 52. United States Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 53. Canada Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 54. Europe Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 55. Europe Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 56. Europe Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 57. Europe Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 58. Europe Flip-Chip Bumping Sales Share by Country (2017-2028)
Figure 59. Europe Flip-Chip Bumping Revenue Share by Country (2017-2028)
Figure 60. Germany Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 61. France Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 62. U.K. Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 63. Italy Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 64. Russia Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 65. Asia Pacific Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 66. Asia Pacific Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 67. Asia Pacific Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 68. Asia Pacific Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 69. Asia Pacific Flip-Chip Bumping Sales Share by Region (2017-2028)
Figure 70. Asia Pacific Flip-Chip Bumping Revenue Share by Region (2017-2028)
Figure 71. China Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 72. Japan Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 73. South Korea Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 74. India Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 75. Australia Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 76. China Taiwan Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 77. Indonesia Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 78. Thailand Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 79. Malaysia Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 80. Latin America Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 81. Latin America Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 82. Latin America Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 83. Latin America Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 84. Latin America Flip-Chip Bumping Sales Share by Country (2017-2028)
Figure 85. Latin America Flip-Chip Bumping Revenue Share by Country (2017-2028)
Figure 86. Mexico Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 87. Brazil Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 88. Argentina Flip-Chip Bumping Revenue (2017-2028) & (US$ Million)
Figure 89. Middle East and Africa Flip-Chip Bumping Sales Market Share by Type (2017-2028)
Figure 90. Middle East and Africa Flip-Chip Bumping Revenue Market Share by Type (2017-2028)
Figure 91. Middle East and Africa Flip-Chip Bumping Sales Market Share by Wafer Size (2017-2028)
Figure 92. Middle East and Africa Flip-Chip Bumping Revenue Market Share by Wafer Size (2017-2028)
Figure 93. Middle East and Africa Flip-Chip Bumping Sales Share by Country (2017-2028)
Figure 94. Middle East and Africa Flip-Chip Bumping Revenue Share by Country (2017-2028)
Figure 95. Turkey Flip-Chip Bumping Revenue (2017-2028) & (