 | • レポートコード：B-MOR-05323 • 出版社/出版日：Mordor Intelligence / 2018年3月 • レポート形態：英文、PDF、131ページ • 納品方法：Eメール（受注後2営業日） • 産業分類：Chemicals & Materials |
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レポート概要
| 本資料は、相変化サーマルインターフェイスマテリアル（TIM）の世界市場について調べ、相変化サーマルインターフェイスマテリアル（TIM）の世界規模、市場動向、市場環境、導電タイプ別分析、結合剤の種類別分析、充填剤の種類別分析、エンドユーザ産業別分析、アメリカ市場規模、ヨーロッパ市場規模、アジア市場規模、日本市場規模、中国市場規模、企業の競争環境、産業バリューチェーン分析、関連企業情報などをまとめた調査レポートです。 ・イントロダクション ・エグゼクティブサマリー ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場インサイト ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場環境 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場動向 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場規模 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場規模：導電タイプ別 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場規模：結合剤の種類別 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場規模：充填剤の種類別 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場規模：エンドユーザ産業別 ・相変化サーマルインターフェイスマテリアル（TIM）の世界市場：地域別市場規模・分析 ・相変化サーマルインターフェイスマテリアル（TIM）の北米市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）のアメリカ市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）のヨーロッパ市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）のアジア市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）の日本市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）の中国市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）のインド市場規模・予測 ・相変化サーマルインターフェイスマテリアル（TIM）の韓国市場規模・予測 ・関連企業情報・競争状況 |
The global phase change thermal interface materials market is expected to register a CAGR of 11.84% during the forecast period of 2018-2023. Growing consumer electronics industry is expected to significantly drive the phase change thermal interface materials (PCTIM) market through the forecast period. PCTIM is a class of material that remains solid at room temperature and changes to liquid when its temperature starts increasing. PCTIMs are a mixture of fine particle ceramic fillers for thermal enhancement, organic fillers, and supporting substrate.
Growing Consumer Electronics Industry
Phase change thermal interface materials (PCTIM) are penetrating the consumer electronics industry, owing to the need to dissipate large amounts of heat from the semiconductor device junction to ambient surroundings. PCTIMs are polymer-based systems, proven to address critical heating issues and provide long-term reliability performance. In consumer electronics, PCTIMs find a wide range of applications, since it plays a major role in helping smooth out temperature fluctuations. PCTIM is the only technology, which can curb temperature increase in semiconductor applications, without causing cost and space expenses. Asia-Pacific is expected to remain at the forefront of the global demand for electronics. The demand for PCTIMs in Asia-Pacific is witnessing high growth, owing to rapid internet penetration in developing nations. Video on demand (VoD) and internet only shows are growing in popularity, thereby increasing demand for larger displays like laptops and tablets, which are expected to increase the consumption in the electronics industry. As the electronics industry continues to grow, the market for PCTIM will also increase rapidly.
Electrical and Electronics Sector to Dominate the Market
With the development of the high-powered Pentium processor, the utilization of PCTIM in the electronics industry has gained widespread acceptance. Traditionally, thermal grease was used to minimize the interface resistance. However, this process proved to be extremely messy. With the development of PCTIMs, the problem associated with thermal grease is resolved. Though, the electronics market experienced a downfall in 2016, the market was estimated to recover in 2017 by growing at around 3% and continuing the trend through the forecast period. This positive aspect is expected to drive the PCTIM market in the electronics industry, through the forecast period.
Asia-Pacific to Dominate the Global Market
In terms of consumption in 2017, Asia-Pacific accounts for more than 33% of the market, followed by North America and Europe. The extensive demand for the phase change thermal interface materials in countries, such as India and China, from the construction and the electronics sectors have made Asia-Pacific an area of immense potential and opportunities. However, the increasing labor costs in this region have considerably hindered the growth in this market.
Key Developments in the Market
May 2017: Boyd Corporation Completed the acquisition of Aavid Thermalloy.
March 2017: Honeywell announced the availability of a Thermal Interface Materials (TIM) solution to help smartphone manufacturers and designers manage heat dissipation in phones.
Major players are Henkel AG & Co. KGaA, Dow Corning, Microtek Laboratories, Parker Chomerics, Croda International, and Sunoco, amongst others.
Reasons to Purchase the Report
Analyzing various perspectives of the market with the help of Porter’s Five Forces Analysis.
Identify the segments which are expected to dominate the market.
Identify the regions which are expected to witness the fastest growth during the forecast period.
Identify the latest developments, market shares, and strategies employed by the major market players.
3-month analyst support along with the Market Estimate sheet (in Excel).
Customization of the Report
This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
レポート目次1. Introduction
1.1 Research Phases
1.2 Study Deliverables
1.3 Scope of the Report
2. Executive Summary
3. Market Insights
3.1 Industry Value Chain Analysis
3.2 Industry Attractiveness – Porter’s Five Forces Analysis
3.2.1 Bargaining Power of Suppliers
3.2.2 Bargaining Power of Consumers
3.2.3 Threat of New Entrants
3.2.4 Threat of Substitute Products and Services
3.2.5 Degree of Competition
4. Market Dynamics
4.1 Drivers
4.1.1 Growing Consumer Electronics Industry
4.1.2 Increasing Demand from Graphics Hardware Industry
4.1.3 Rising Demand from Power Modules
4.1.4 Growing Use in LED Cooling
4.2 Restraints
4.2.1 Reduced Demand in Japan
4.2.2 Development of Non-silicone Substitutes
4.3 Opportunities
4.3.1 Replacement of Thermal Greases
4.3.2 Technological Improvements
4.3.3 Growing Use in Automotive Industry
5. Market Segmentation and Analysis
5.1 By Conductive Type
5.1.1 Electrically Conductive
5.1.2 Non-electrically Conductive
5.2 By Binder Type
5.2.1 Paraffin
5.2.2 Non-paraffin (organic)
5.2.3 Eutectic Salts
5.2.4 Salt Hydrates
5.3 By Filler Type
5.3.1 Aluminum Oxide
5.3.2 Boron Nitride
5.3.3 Aluminum Nitride
5.3.4 Zinc Oxide
5.3.5 Others
5.4 By End-user Industry
5.4.1 Computer
5.4.2 Electrical & Electronics
5.4.3 Telecom
5.4.4 Automotive
5.4.5 Others
6. Regional Analysis
6.1 Asia-Pacific
6.1.1 China
6.1.2 India
6.1.3 Japan
6.1.4 South Korea
6.1.5 Rest of Asia-Pacific
6.2 North America
6.2.1 United States
6.2.2 Canada
6.2.3 Mexico
6.2.4 Rest of North America
6.3 Europe
6.3.1 Germany
6.3.2 United Kingdom
6.3.3 Italy
6.3.4 France
6.3.5 Rest of Europe
6.4 Rest of the World
6.4.1 Brazil
6.4.2 Saudi Arabia
6.4.3 Rest of the Countries
6.4.4 Rest of Middle East & Africa
7. Competitive Landscape
7.1 Mergers & Acquisitions, Joint Ventures, Collaborations, and Agreements
7.2 Market Share Analysis**
7.3 Strategies Adopted by Leading Players
8. Company Profiles (Overview, Financials**, Products & Services, and Recent Developments)
8.1 3M
8.2 Aavid Thermalloy
8.3 AI Technology
8.4 Arctic Silver
8.5 Bergquist Company
8.6 Dow Corning Corp.
8.7 Enerdyne Thermal Solutions
8.8 Henkel AG & Co. KGaA
8.9 Honeywell International, Inc.
8.10 Indium
8.11 Laird Technologies
8.12 Momentive
8.13 NuSil Technology
8.14 Parker Chomerics
8.15 Shin-Etsu Chemical
8.16 Stockwell Elastomerics
8.17 Wakefield-Vette
*List not Exhaustive
9. Future of the Market
10. Disclaimer
**Subject to Availability in Public Domain