 | • レポートコード：B-MOR-08581 • 出版社/出版日：Mordor Intelligence / 2018年7月30日 • レポート形態：英文、PDF、101ページ • 納品方法：Eメール（受注後2営業日） • 産業分類：電子 |
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レポート概要
| 本資料は、薄型ウエハー加工およびダイシング装置の世界市場について調べ、薄型ウエハー加工およびダイシング装置の世界規模、市場動向、市場環境、装置種類別（シンニング装置、ダイシング装置）分析、装置技術別（シンニング装置、ダイシング装置）分析、用途別分析、アメリカ市場規模、ヨーロッパ市場規模、アジア市場規模、産業バリューチェーン分析、関連企業情報などをまとめた調査レポートです。 ・イントロダクション ・エグゼクティブサマリー ・薄型ウエハー加工およびダイシング装置の世界市場インサイト ・薄型ウエハー加工およびダイシング装置の世界市場環境 ・薄型ウエハー加工およびダイシング装置の世界市場動向 ・薄型ウエハー加工およびダイシング装置の世界市場規模 ・薄型ウエハー加工およびダイシング装置の世界市場規模：装置種類別（シンニング装置、ダイシング装置） ・薄型ウエハー加工およびダイシング装置の世界市場規模：装置技術別（シンニング装置、ダイシング装置） ・薄型ウエハー加工およびダイシング装置の世界市場規模：用途別 ・薄型ウエハー加工およびダイシング装置の世界市場：地域別市場規模・分析 ・薄型ウエハー加工およびダイシング装置の北米市場規模・予測 ・薄型ウエハー加工およびダイシング装置のアメリカ市場規模・予測 ・薄型ウエハー加工およびダイシング装置のヨーロッパ市場規模・予測 ・薄型ウエハー加工およびダイシング装置のアジア市場規模・予測 ・関連企業情報・競争状況 |
The thin wafer processing and dicing equipment market is expected to grow at a CAGR of over 6% during the forecast period (2018 – 2023).
Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period
Applications in RFID to Create a Huge Demand
Radio Frequency Identification (RFID) is a major source of demand for wafer processing and dicing equipment. Generally, traditional methods of grinding or thinning are preferred to prepare wafers feasible for RFID applications. This involves grinding wafers as thin as 50 to 120 micrometers. But with most of the RFID technology being integrated into several consumer electronics and identity solutions such as smart cards and identification tags, end-users are increasingly asking for ultra-smooth surfaces and thinner wafers to incorporate them into these devices seamlessly.
This is one of the prime reasons why techniques like chemical mechanical polishing (CMP) are combined with traditional grinding mechanisms increasingly to conform to high-quality plane surface standards of the wafer. This scenario coupled with strong demand for enterprise identity management solutions and automobile telematics applications of the RFID technology is expected to create more demand for thinner wafers driving positive growth for processing and dicing equipment over the forecast period.
Asia Pacific is growing at A Faster Pace
Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments. In case of India, the recent increment in customs duties on imported electronics is playing a pivotal role attracting companies like Apple to set up local manufacturing plants. According to the SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, more than 90% of the foundries being constructed in the world during 2017 were situated in the Asia Pacific. It is estimated that most of these foundries are concentrated in China and Japan. With initiatives for Tokyo Olympics 2020 already in motion, semiconductor manufacturing region is expected open up better opportunities for the thinning and dicing equipment shortly.
Key Developments in the Market
• February 2018 – SPTS Technologies received approximately USD 37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS’s Omega plasma etch, Delta PECVD, and Sigma PVD are expected to be installed in these foundries to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure.
Major Players: SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC, HAN’S LASER TECHNOLOGY CO. LTD, and ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V., amongst others.
Reasons to Purchase this Report
• Current and future thin wafer processing and dicing equipment market outlook in the developed and emerging markets
• Analyzing various perspectives of the market with the help of Porter’s five forces analysis
• The segment that is expected to dominate the market
• Regions that are expected to witness the fastest growth during the forecast period
• Identify the latest developments, market shares and strategies employed by the major market players.
• 3 months analyst support along with the Market Estimate sheet (in excel).
Customization of the Report
• This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
レポート目次1. Introduction
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Research Methodology
1.4 Key Findings
2. Executive Summary
3. Market Overview
3.1 Overview
3.2 Value Chain Analysis
3.3 Industry Attractiveness – Porter’s Five Forces
3.3.1 Bargaining Power Of Suppliers
3.3.2 Bargaining Power Of Consumers
3.3.3 Threat Of New Entrants
3.3.4 Threat Of Substitute Product
3.3.5 Competitive Rivalry Within The Industry
3.4 Industry Policies
4. Market Dynamics
4.1 Drivers
4.1.1 Increasing Need for Miniaturization of Semiconductors
4.1.2 Increasing Demand for Smart Cards and RFID Technology
4.2 Restraints
4.2.1 High Initial Cost of Equipment
4.3 Opportunities
4.3.1 Increasing IoT Applications
4.3.2 Rapid Adoption of Industry 4.0 Policies
5. Global Thin Wafer Processing and Dicing Equipment Market Segmentation
5.1 By Equipment Type
5.1.1 Thinning Equipment
5.1.2 Dicing Equipment
5.2 By Equipment Technology
5.2.1 Thinning Equipment
5.2.1.1 Grinding
5.2.1.2 Grinding + CPM
5.2.1.3 Wet/Dry Etching
5.2.1.4 TAIKO
5.2.2 Dicing Equipment
5.2.2.1 Blade Dicing
5.2.2.2 Laser Ablation
5.2.2.3 Stealth Dicing
5.2.2.4 Plasma Dicing
5.3 By Application
5.3.1 Memory and Logic (TSV)
5.3.2 MEMS Devices
5.3.3 Power Devices
5.3.4 CMOS Image Sensors
5.3.5 RFID
5.4 By Region
5.4.1 North America
5.4.2 Europe
5.4.3 Asia-Pacific
5.4.4 Rest of the World
6. Company Profiles
6.1 Suzhou Delphi Laser Co., Ltd
6.2 SPTS Technologies Limited (Orbotech)
6.3 Plasma-Therm LLC
6.4 Han’s Laser Technology Co. Ltd
6.5 ASM Laser Separation International (ALSI) B.V.
6.6 DISCO Corporation
6.7 Tokyo Seimitsu Co., Ltd. (Accretech)
6.8 Neon Tech Co., Ltd
6.9 Nippon Pulse Motor Taiwan (NPMT)
6.10 Panasonic Corporation
*List is Not Exhaustive
7. Investment Analysis
8. Future Of Global Thin Wafer Processing and Dicing Equipment Market