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レポート概要
| 本調査資料は次の情報を含め、全自動半導体成型装置のグローバル市場規模と予測を記載しています。・全自動半導体成型装置のグローバル市場：売上、2017年-2022年、2023年-2028年 ・全自動半導体成型装置のグローバル市場：販売量、2017年-2022年、2023年-2028年 ・世界のトップ5企業、2021年 全自動半導体成型装置のグローバル市場規模は2021年に000Mドルと評価され、予測期間中に000％のCAGRで2028年までに000Mドルに達すると予測されています。米国市場は2021年に000Mドルと推定されており、中国は2028年までに000Mドルに達すると予測されています。「油圧式半導体成形装置」セグメントは今後6年間、000%のCAGRで2028年までに000Mドルに成長すると予測されています。 全自動半導体成型装置のグローバル主要企業は、TOWA、 ASMPT、 Besi、 I-PEX、 Yamada、 TAKARA TOOL & DIE、 Asahi Engineering、 Tongling Fushi Sanjia、 Nextool Technology、 DAHUA Technologyなどです。2021年にトップ5企業がグローバル売上シェアの約000%を占めています。 マーケットモニターグローバル（MMG）社は、全自動半導体成型装置のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。 【セグメント別市場分析】 世界の全自動半導体成型装置市場：タイプ別、2017年-2022年、2023年-2028年 世界の全自動半導体成型装置市場：タイプ別市場シェア、2021年 ・油圧式半導体成形装置、電気式半導体成形装置 世界の全自動半導体成型装置市場：用途別、2017年-2022年、2023年-2028年 世界の全自動半導体成型装置市場：用途別市場シェア、2021年 ・ウエハーレベルパッケージ、BGAパッケージ、フラットパネルパッケージ、その他 世界の全自動半導体成型装置市場：地域・国別、2017年-2022年、2023年-2028年 世界の全自動半導体成型装置市場：地域別市場シェア、2021年 ・北米：アメリカ、カナダ、メキシコ ・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア ・アジア：中国、日本、韓国、東南アジア、インド ・南米：ブラジル、アルゼンチン ・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE 【競合分析】 また、当レポートは主要な市場参加者の分析を提供します。 ・主要企業における全自動半導体成型装置のグローバル売上、2017年-2022年 ・主要企業における全自動半導体成型装置のグローバル売上シェア、2021年 ・主要企業における全自動半導体成型装置のグローバル販売量、2017年-2022年 ・主要企業における全自動半導体成型装置のグローバル販売量シェア、2021年 さらに、当レポートは主要企業のプロファイルを提示します。 TOWA、 ASMPT、 Besi、 I-PEX、 Yamada、 TAKARA TOOL & DIE、 Asahi Engineering、 Tongling Fushi Sanjia、 Nextool Technology、 DAHUA Technology ************************************************************* ・調査・分析レポートの概要 全自動半導体成型装置市場の定義 市場セグメント 世界の全自動半導体成型装置市場概要 当レポートの特徴・ベネフィット 調査手法と情報源 ・世界の全自動半導体成型装置市場規模 世界の全自動半導体成型装置市場規模：2021年 VS 2028年 世界の全自動半導体成型装置市場規模と予測 2017年-2028年 ・競争状況 グローバルトップ企業 売上ベースでのグローバルトップ企業 企業別グローバルでの全自動半導体成型装置の売上 グローバルトップ3およびトップ5企業、2021年売上ベース グローバル企業の全自動半導体成型装置製品タイプ グローバルにおけるティア1、ティア2、ティア3企業 ・タイプ別市場分析 タイプ区分：油圧式半導体成形装置、電気式半導体成形装置 全自動半導体成型装置のタイプ別グローバル売上・予測 ・用途別市場分析 用途区分：ウエハーレベルパッケージ、BGAパッケージ、フラットパネルパッケージ、その他 全自動半導体成型装置の用途別グローバル売上・予測 ・地域別市場分析 地域別全自動半導体成型装置市場規模 2021年と2028年 地域別全自動半導体成型装置売上・予測 北米市場 - アメリカの全自動半導体成型装置市場規模2017年-2028年 - カナダの全自動半導体成型装置市場規模2017年-2028年 - メキシコの全自動半導体成型装置市場規模2017年-2028年 ヨーロッパ市場 - ドイツの全自動半導体成型装置市場規模2017年-2028年 - フランスの全自動半導体成型装置市場規模2017年-2028年 - イギリスの全自動半導体成型装置市場規模2017年-2028年 - イタリアの全自動半導体成型装置市場規模2017年-2028年 - ロシアの全自動半導体成型装置市場規模2017年-2028年 アジア市場 - 中国の全自動半導体成型装置市場規模2017年-2028年 - 日本の全自動半導体成型装置市場規模2017年-2028年 - 韓国の全自動半導体成型装置市場規模2017年-2028年 - 東南アジアの全自動半導体成型装置市場規模2017年-2028年 - インドの全自動半導体成型装置市場規模2017年-2028年 南米市場 - ブラジルの全自動半導体成型装置市場規模2017年-2028年 - アルゼンチンの全自動半導体成型装置市場規模2017年-2028年 中東・アフリカ市場 - トルコの全自動半導体成型装置市場規模2017年-2028年 - イスラエルの全自動半導体成型装置市場規模2017年-2028年 - サウジアラビアの全自動半導体成型装置市場規模2017年-2028年 - UAEの全自動半導体成型装置市場規模2017年-2028年 ・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど） TOWA、 ASMPT、 Besi、 I-PEX、 Yamada、 TAKARA TOOL & DIE、 Asahi Engineering、 Tongling Fushi Sanjia、 Nextool Technology、 DAHUA Technology ... |
This report contains market size and forecasts of Fully Automatic Semiconductor Molding Equipment in global, including the following market information:
Global Fully Automatic Semiconductor Molding Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Fully Automatic Semiconductor Molding Equipment Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Fully Automatic Semiconductor Molding Equipment companies in 2021 (%)
The global Fully Automatic Semiconductor Molding Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Hydraulic Semiconductor Molding System Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Fully Automatic Semiconductor Molding Equipment include TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Fully Automatic Semiconductor Molding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fully Automatic Semiconductor Molding Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Type, 2021 (%)
Hydraulic Semiconductor Molding System
Electric Semiconductor Molding System
Global Fully Automatic Semiconductor Molding Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Application, 2021 (%)
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Global Fully Automatic Semiconductor Molding Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fully Automatic Semiconductor Molding Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Fully Automatic Semiconductor Molding Equipment revenues share in global market, 2021 (%)
Key companies Fully Automatic Semiconductor Molding Equipment sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Fully Automatic Semiconductor Molding Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
1 Introduction to Research & Analysis Reports
1.1 Fully Automatic Semiconductor Molding Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fully Automatic Semiconductor Molding Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fully Automatic Semiconductor Molding Equipment Overall Market Size
2.1 Global Fully Automatic Semiconductor Molding Equipment Market Size: 2021 VS 2028
2.2 Global Fully Automatic Semiconductor Molding Equipment Revenue, Prospects & Forecasts: 2017-2028
2.3 Global Fully Automatic Semiconductor Molding Equipment Sales: 2017-2028
3 Company Landscape
3.1 Top Fully Automatic Semiconductor Molding Equipment Players in Global Market
3.2 Top Global Fully Automatic Semiconductor Molding Equipment Companies Ranked by Revenue
3.3 Global Fully Automatic Semiconductor Molding Equipment Revenue by Companies
3.4 Global Fully Automatic Semiconductor Molding Equipment Sales by Companies
3.5 Global Fully Automatic Semiconductor Molding Equipment Price by Manufacturer (2017-2022)
3.6 Top 3 and Top 5 Fully Automatic Semiconductor Molding Equipment Companies in Global Market, by Revenue in 2021
3.7 Global Manufacturers Fully Automatic Semiconductor Molding Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 Fully Automatic Semiconductor Molding Equipment Players in Global Market
3.8.1 List of Global Tier 1 Fully Automatic Semiconductor Molding Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 Fully Automatic Semiconductor Molding Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Fully Automatic Semiconductor Molding Equipment Market Size Markets, 2021 & 2028
4.1.2 Hydraulic Semiconductor Molding System
4.1.3 Electric Semiconductor Molding System
4.2 By Type – Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
4.2.1 By Type – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
4.2.2 By Type – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
4.2.3 By Type – Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
4.3 By Type – Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
4.3.1 By Type – Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
4.3.2 By Type – Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
4.3.3 By Type – Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
4.4 By Type – Global Fully Automatic Semiconductor Molding Equipment Price (Manufacturers Selling Prices), 2017-2028
5 Sights By Application
5.1 Overview
5.1.1 By Application – Global Fully Automatic Semiconductor Molding Equipment Market Size, 2021 & 2028
5.1.2 Wafer Level Packaging
5.1.3 BGA Packaging
5.1.4 Flat Panel Packaging
5.1.5 Others
5.2 By Application – Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
5.2.1 By Application – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
5.2.2 By Application – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
5.2.3 By Application – Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
5.3 By Application – Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
5.3.1 By Application – Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
5.3.2 By Application – Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
5.3.3 By Application – Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
5.4 By Application – Global Fully Automatic Semiconductor Molding Equipment Price (Manufacturers Selling Prices), 2017-2028
6 Sights by Region
6.1 By Region – Global Fully Automatic Semiconductor Molding Equipment Market Size, 2021 & 2028
6.2 By Region – Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
6.2.1 By Region – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
6.2.2 By Region – Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
6.2.3 By Region – Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
6.3 By Region – Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
6.3.1 By Region – Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
6.3.2 By Region – Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
6.3.3 By Region – Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
6.4 North America
6.4.1 By Country – North America Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.4.2 By Country – North America Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.4.3 US Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.4.4 Canada Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.4.5 Mexico Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5 Europe
6.5.1 By Country – Europe Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.5.2 By Country – Europe Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.5.3 Germany Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.4 France Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.5 U.K. Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.6 Italy Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.7 Russia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.8 Nordic Countries Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.9 Benelux Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6 Asia
6.6.1 By Region – Asia Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.6.2 By Region – Asia Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.6.3 China Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.4 Japan Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.5 South Korea Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.6 Southeast Asia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.7 India Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.7 South America
6.7.1 By Country – South America Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.7.2 By Country – South America Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.7.3 Brazil Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.7.4 Argentina Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.8.2 By Country – Middle East & Africa Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.8.3 Turkey Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.4 Israel Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.5 Saudi Arabia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.6 UAE Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
7 Manufacturers & Brands Profiles
7.1 TOWA
7.1.1 TOWA Corporate Summary
7.1.2 TOWA Business Overview
7.1.3 TOWA Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.1.4 TOWA Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.1.5 TOWA Key News
7.2 ASMPT
7.2.1 ASMPT Corporate Summary
7.2.2 ASMPT Business Overview
7.2.3 ASMPT Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.2.4 ASMPT Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.2.5 ASMPT Key News
7.3 Besi
7.3.1 Besi Corporate Summary
7.3.2 Besi Business Overview
7.3.3 Besi Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.3.4 Besi Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.3.5 Besi Key News
7.4 I-PEX
7.4.1 I-PEX Corporate Summary
7.4.2 I-PEX Business Overview
7.4.3 I-PEX Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.4.4 I-PEX Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.4.5 I-PEX Key News
7.5 Yamada
7.5.1 Yamada Corporate Summary
7.5.2 Yamada Business Overview
7.5.3 Yamada Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.5.4 Yamada Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.5.5 Yamada Key News
7.6 TAKARA TOOL & DIE
7.6.1 TAKARA TOOL & DIE Corporate Summary
7.6.2 TAKARA TOOL & DIE Business Overview
7.6.3 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.6.4 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.6.5 TAKARA TOOL & DIE Key News
7.7 Asahi Engineering
7.7.1 Asahi Engineering Corporate Summary
7.7.2 Asahi Engineering Business Overview
7.7.3 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.7.4 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.7.5 Asahi Engineering Key News
7.8 Tongling Fushi Sanjia
7.8.1 Tongling Fushi Sanjia Corporate Summary
7.8.2 Tongling Fushi Sanjia Business Overview
7.8.3 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.8.4 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.8.5 Tongling Fushi Sanjia Key News
7.9 Nextool Technology
7.9.1 Nextool Technology Corporate Summary
7.9.2 Nextool Technology Business Overview
7.9.3 Nextool Technology Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.9.4 Nextool Technology Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.9.5 Nextool Technology Key News
7.10 DAHUA Technology
7.10.1 DAHUA Technology Corporate Summary
7.10.2 DAHUA Technology Business Overview
7.10.3 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.10.4 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.10.5 DAHUA Technology Key News
8 Global Fully Automatic Semiconductor Molding Equipment Production Capacity, Analysis
8.1 Global Fully Automatic Semiconductor Molding Equipment Production Capacity, 2017-2028
8.2 Fully Automatic Semiconductor Molding Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global Fully Automatic Semiconductor Molding Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Fully Automatic Semiconductor Molding Equipment Supply Chain Analysis
10.1 Fully Automatic Semiconductor Molding Equipment Industry Value Chain
10.2 Fully Automatic Semiconductor Molding Equipment Upstream Market
10.3 Fully Automatic Semiconductor Molding Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Fully Automatic Semiconductor Molding Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer