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レポート概要
| 本調査レポートは、埋め込み型ダイパッケージングの世界市場について調査し、序論、仮定/調査手法、エグゼクティブサマリー、市場概要、市場分析/予測、プラットフォーム別（ICパッケージ基板、リジッドPCB、フレキシブルPCB）分析、用途別分析、エンドユーズ産業別分析、地域別（北米、ヨーロッパ、アジア太平洋、中東/アフリカ、南米）分析、競争状況、企業概要などを掲載しています。 ・序論 ・仮定/調査手法 ・エグゼクティブサマリー ・市場概要 ・市場分析/予測 ・埋め込み型ダイパッケージングの世界市場規模：プラットフォーム別（ICパッケージ基板、リジッドPCB、フレキシブルPCB） ・埋め込み型ダイパッケージングの世界市場規模：用途別 ・埋め込み型ダイパッケージングの世界市場規模：エンドユーズ産業別 ・埋め込み型ダイパッケージングの世界市場規模：地域別（北米、ヨーロッパ、アジア太平洋、中東/アフリカ、南米） ・競争状況 ・企業概要 |
Embedded Die Packaging Market – Scope of the Report
A new study on the global embedded die packaging market is published by Transparency Market Research (TMR). It presents detailed information on key market dynamics, including drivers, trends, and challenges for the global embedded die packaging market as well as its structure. TMR’s study offers valuable information on the global embedded die packaging market in order to illustrate how the market is expected to expand during the forecast period i.e. 2020–2030.
Key indicators of market growth, which include value chain analysis and compound annual growth rate (CAGR), have been elucidated in TMR’s study in a comprehensive manner. This data can help readers interpret the quantitative growth aspects of the global embedded die packaging market.
An extensive analysis of business strategies adopted by leading market players has also been featured in TMR’s study on the global embedded die packaging market. This can help readers understand key factors responsible for growth of the global embedded die packaging market. In this study, readers can also find specific data on avenues for qualitative and quantitative growth of the global embedded die packaging market. This data would guide market players in making apt decisions in the near future.
Embedded Die Packaging Market – Segmentation
TMR’s study of the global embedded die packaging market segments the market based on platform, application, end-use industry, and region. Changing market trends and other crucial market dynamics associated with segments of the global embedded die packaging market have been discussed in detail in TMR’s study.
Key Questions Answered in TMR’s Study on Embedded Die Packaging Market
What would be the Y-o-Y growth trend of the global embedded die packaging market between 2020 and 2030?
What is the influence of changing trends in the platform segment on the global embedded die packaging market?
Would Asia Pacific continue to be the most dominant regional market for providers of embedded die packaging over the next few years?
Which factors would hinder the global embedded die packaging market during the forecast period?
Which are the leading companies operating in the global embedded die packaging market?
Research Methodology
A unique research methodology has been utilized by TMR to conduct comprehensive research on the global embedded die packaging market and arrive at conclusions on future growth prospects for the market. This research methodology is a combination of primary and secondary research, which helps analysts warrant the accuracy and reliability of the conclusions drawn.
Secondary research sources referred to by analysts during production of the report on the global embedded die packaging market include statistics from company annual reports, SEC filings, company websites, World Bank database, investor presentations, regulatory databases, government publications, and market white papers. Analysts have also interviewed senior managers, product portfolio managers, CEOs, VPs, and market intelligence managers, who have contributed to production of TMR’s study on the global embedded die packaging market as a primary research source.
These primary and secondary sources provided exclusive information during interviews, which served as a validation from leading players operating in the global embedded die packaging market. Access to an extensive internal repository as well as external proprietary databases allowed this report to address specific details and questions about the global embedded die packaging market with accuracy. The study also uses a top-down approach to assess the numbers for each segment and a bottom-up approach to counter-validate them. This has helped in making TMR’s estimates on future prospects for the global embedded die packaging market more reliable and accurate.
レポート目次1. Preface
1.1. Market Definition and Scope
1.2. Market Segmentation
1.3. Key Research Objectives
1.4. Research Highlights
2. Assumptions and Research Methodology
3. Executive Summary: Global Embedded Die Packaging Market
4. Market Overview
4.1. Introduction
4.2. Market Dynamics
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.3. Key Trends Analysis
4.4. Regulations and Policies
4.5. Global Pacific Embedded Die Packaging Market Analysis and Forecast, 2018 – 2030
4.5.1. Market Revenue Projections (US$ Mn)
4.6. Porter’s Five Forces Analysis – Global Embedded Die Packaging Market
4.7. Value Chain Analysis – Global Embedded Die Packaging Market
4.8. Market Outlook
5. Global Embedded Package Substrate Market Analysis and Forecast, 2018 – 2030
5.1. Overview & Definitions of Embedded Substrate
5.2. Technical Requirement for Embedded Package by Application
5.3. Embedded Package Substrate Market Size (US$ Mn) Forecast, 2018 – 2030
5.4. Key Players in Embedded Package – Strategy Adopted, Technology Innovation, Recent Developments, Product Details
5.5. Penetration of Global Embedded Package in Total Packaged Substrate (2018-2030)
6. Global Embedded Die Packaging Market Analysis and Forecast, By Platform
6.1. Overview & Definitions
6.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
6.2.1. IC Package Substrate
6.2.2. Rigid PCB
6.2.3. Flexible PCB
6.3. Platform Comparison Matrix
6.4. Market Attractiveness By Platform
7. Global Embedded Die Packaging Market Analysis and Forecast, By Application
7.1. Overview & Definition
7.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
7.2.1. Smartphone & Tablets
7.2.2. Medical Implants and Wearable Devices
7.2.3. Industrial Sensing Devices
7.2.4. Industrial Controlling Devices
7.2.5. Industrial Metering Devices
7.2.6. Military Communication & Power Devices
7.2.7. Aircrafts
7.2.8. Security Devices
7.2.9. Automotive Modules
7.2.10. Communication & Computing Devices
7.2.11. Others (Security Cameras, Access Control, Etc.)
7.3. Application Comparison Matrix
7.4. Market Attractiveness By Application
8. Global Embedded Die Packaging Market Analysis and Forecast, By End-use Industry
8.1. Overview & Definition
8.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
8.2.1. Consumer Electronics
8.2.2. IT & Telecommunication
8.2.3. Healthcare
8.2.4. Aerospace & Defense
8.2.5. Automotive
8.2.6. Industrial
8.2.7. Others
8.3. End-use Industry Comparison Matrix
8.4. Market Attractiveness By End-use Industry
9. Global Embedded Die Packaging Market Analysis and Forecast, by Region
9.1. Key Findings
9.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, by Region, 2018 – 2030
9.2.1. North America
9.2.2. Europe
9.2.3. Asia Pacific
9.2.4. Middle East & Africa
9.2.5. South America
9.3. Market Attractiveness by Region
10. North America Embedded Die Packaging Market Analysis and Forecast
10.1. Key Findings
10.2. Key Trends
10.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
10.3.1. IC Package Substrate
10.3.2. Rigid PCB
10.3.3. Flexible PCB
10.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
10.4.1. Smartphone & Tablets
10.4.2. Medical Implants and Wearable Devices
10.4.3. Industrial Sensing Devices
10.4.4. Industrial Controlling Devices
10.4.5. Industrial Metering Devices
10.4.6. Military Communication & Power Devices
10.4.7. Aircrafts
10.4.8. Security Devices
10.4.9. Automotive Modules
10.4.10. Communication & Computing Devices
10.4.11. Others (Security Cameras, Access Control, Etc.)
10.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
10.5.1. Consumer Electronics
10.5.2. IT & Telecommunication
10.5.3. Healthcare
10.5.4. Aerospace & Defense
10.5.5. Automotive
10.5.6. Industrial
10.5.7. Others
10.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 – 2030
10.6.1. U.S.
10.6.2. Canada
10.6.3. Rest of North America
10.7. Market Attractiveness Analysis
10.7.1. By Platform
10.7.2. By Application
10.7.3. By End-use Industry
10.7.4. By Country
11. Europe Embedded Die Packaging Market Analysis and Forecast
11.1. Key Findings
11.2. Key Trends
11.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
11.3.1. IC Package Substrate
11.3.2. Rigid PCB
11.3.3. Flexible PCB
11.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
11.4.1. Smartphone & Tablets
11.4.2. Medical Implants and Wearable Devices
11.4.3. Industrial Sensing Devices
11.4.4. Industrial Controlling Devices
11.4.5. Industrial Metering Devices
11.4.6. Military Communication & Power Devices
11.4.7. Aircrafts
11.4.8. Security Devices
11.4.9. Automotive Modules
11.4.10. Communication & Computing Devices
11.4.11. Others (Security Cameras, Access Control, Etc.)
11.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
11.5.1. Consumer Electronics
11.5.2. IT & Telecommunication
11.5.3. Healthcare
11.5.4. Aerospace & Defense
11.5.5. Automotive
11.5.6. Industrial
11.5.7. Others
11.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 – 2030
11.6.1. Germany
11.6.2. U.K.
11.6.3. France
11.6.4. Rest of Europe
11.7. Market Attractiveness Analysis
11.7.1. By Platform
11.7.2. By End-use Industry
11.7.3. By Application
11.7.4. By Country
12. Asia Pacific Embedded Die Packaging Market Analysis and Forecast
12.1. Key Findings
12.2. Key Trends
12.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
12.3.1. IC Package Substrate
12.3.2. Rigid PCB
12.3.3. Flexible PCB
12.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
12.4.1. Smartphone & Tablets
12.4.2. Medical Implants and Wearable Devices
12.4.3. Industrial Sensing Devices
12.4.4. Industrial Controlling Devices
12.4.5. Industrial Metering Devices
12.4.6. Military Communication & Power Devices
12.4.7. Aircrafts
12.4.8. Security Devices
12.4.9. Automotive Modules
12.4.10. Communication & Computing Devices
12.4.11. Others (Security Cameras, Access Control, Etc.)
12.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
12.5.1. Consumer Electronics
12.5.2. IT & Telecommunication
12.5.3. Healthcare
12.5.4. Aerospace & Defense
12.5.5. Automotive
12.5.6. Industrial
12.5.7. Others
12.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 – 2030
12.6.1. China
12.6.2. Japan
12.6.3. India
12.6.4. Australia
12.6.5. Rest of Asia Pacific
12.7. Market Attractiveness Analysis
12.7.1. By Platform
12.7.2. By Application
12.7.3. By End-use Industry
12.7.4. By Country
13. Middle East & Africa Embedded Die Packaging Market Analysis and Forecast
13.1. Key Findings
13.2. Key Trends
13.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
13.3.1. IC Package Substrate
13.3.2. Rigid PCB
13.3.3. Flexible PCB
13.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
13.4.1. Smartphone & Tablets
13.4.2. Medical Implants and Wearable Devices
13.4.3. Industrial Sensing Devices
13.4.4. Industrial Controlling Devices
13.4.5. Industrial Metering Devices
13.4.6. Military Communication & Power Devices
13.4.7. Aircrafts
13.4.8. Security Devices
13.4.9. Automotive Modules
13.4.10. Communication & Computing Devices
13.4.11. Others (Security Cameras, Access Control, Etc.)
13.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
13.5.1. Consumer Electronics
13.5.2. IT & Telecommunication
13.5.3. Healthcare
13.5.4. Aerospace & Defense
13.5.5. Automotive
13.5.6. Industrial
13.5.7. Others
13.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 – 2030
13.6.1. GCC
13.6.2. South Africa
13.6.3. Rest of Middle East & Africa
13.7. Market Attractiveness Analysis
13.7.1. By Platform
13.7.2. By Application
13.7.3. By End-use Industry
13.7.4. By Country
14. South America Embedded Die Packaging Market Analysis and Forecast
14.1. Key Findings
14.2. Key Trends
14.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 – 2030
14.3.1. IC Package Substrate
14.3.2. Rigid PCB
14.3.3. Flexible PCB
14.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 – 2030
14.4.1. Smartphone & Tablets
14.4.2. Medical Implants and Wearable Devices
14.4.3. Industrial Sensing Devices
14.4.4. Industrial Controlling Devices
14.4.5. Industrial Metering Devices
14.4.6. Military Communication & Power Devices
14.4.7. Aircrafts
14.4.8. Security Devices
14.4.9. Automotive Modules
14.4.10. Communication & Computing Devices
14.4.11. Others (Security Cameras, Access Control, Etc.)
14.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 – 2030
14.5.1. Consumer Electronics
14.5.2. IT & Telecommunication
14.5.3. Healthcare
14.5.4. Aerospace & Defense
14.5.5. Automotive
14.5.6. Industrial
14.5.7. Others
14.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 – 2030
14.6.1. GCC
14.6.2. South Africa
14.6.3. Rest of Middle East & Africa
14.7. Market Attractiveness Analysis
14.7.1. By Platform
14.7.2. By Application
14.7.3. By End-use Industry
14.7.4. By Country
15. Competition Landscape
15.1. Market Player – Competition Matrix
15.2. Market Revenue Share Analysis (%), By Company (2019)
16. Company Profiles (Details – Overview, Financials, SWOT Analysis, Strategy)
16.1. ASE Group
16.1.1. Overview
16.1.2. Financials
16.1.3. SWOT Analysis
16.1.4. Strategy
16.2. AT&S
16.2.1. Overview
16.2.2. Financials
16.2.3. SWOT Analysis
16.2.4. Strategy
16.3. Fujitsu Limited
16.3.1. Overview
16.3.2. Financials
16.3.3. SWOT Analysis
16.3.4. Strategy
16.4. General Electric
16.4.1. Overview
16.4.2. Financials
16.4.3. SWOT Analysis
16.4.4. Strategy
16.5. Infineon Technologies
16.5.1. Overview
16.5.2. Financials
16.5.3. SWOT Analysis
16.5.4. Strategy
16.6. Microsemi Corporation
16.6.1. Overview
16.6.2. Financials
16.6.3. SWOT Analysis
16.6.4. Strategy
16.7. STMicroelectronics
16.7.1. Overview
16.7.2. Financials
16.7.3. SWOT Analysis
16.7.4. Strategy
16.8. TDK Corporation
16.8.1. Overview
16.8.2. Financials
16.8.3. SWOT Analysis
16.8.4. Strategy
16.9. Texas Instruments
16.9.1. Overview
16.9.2. Financials
16.9.3. SWOT Analysis
16.9.4. Strategy
16.10. Toshiba Corporation
16.10.1. Overview
16.10.2. Financials
16.10.3. SWOT Analysis
16.10.4. Strategy
17. Key Takeaways
List of TablesTable 01: Global Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 02: Global Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 03: Global Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 04: Global Embedded Die Packaging Market Revenue (US$ Mn), by Region, 2018–2030
Table 05: North America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 06: North America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 07: North America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 08: North America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030
Table 09: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 10: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 11: Europe Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 12: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030
Table 13: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 14: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 15: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 16: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030
Table 17: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 18: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 19: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 20: Middle East & Africa (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030
Table 21: South America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030
Table 22: South America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030
Table 23: South America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030
Table 24: South America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030