• 出版社/出版日：Mordor Intelligence / 2021年1月
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The Surface Mount Technology Market is expected to register a CAGR of 7.46% over the forecast period from 2021 to 2026. There are many ways for mounting components onto a PCB. Although through-hole methods have been significantly prevalent in the past, surface mounted technology (SMT) brings significant advantages. In SMT, components are placed directly on the surface of a PCB to create what is known as a surface-mount device (SMD). Due to its effectiveness and efficiency, SMT has significantly replaced through-hole technology methods for manufacturing PCBs. However, both methods can be used on the same PCB. This is because some components are not suited to surface mounting. These components might include large transformers and heatsinked power semiconductors. SMT components are smaller in size compared to through-hole units as they have smaller leads or do not have any leads at all.
– Most of the electronics are expected to be more compact, and there is an increase in demand for smaller units, where SMT makes this possible. But even though these units are not as bulky as older devices, there is a much higher component density, as well as more connections per component. This means that electronics can be more advanced and efficient than ever before, while the form factor is still as compact as possible. Fewer holes are required to be drilled into the boards, which leads to faster and more automated assembly processes, and the fact that components can be situated on either side of the circuit board simplifies things further. All of this results in less time required for setting up and production, a lower initial cost, reduced manufacture cost, and more efficient use of time.
– However, SMT is not suited for any large, high-power/high-voltage parts. Also, the small size of SMDs can create issues, in that the solder joint dimensions continue to become smaller as advances are made toward ultra-fine pitch technology. Ultimately, this means that less solder can be used for each joint, which can result in voiding and integrity issues. Further, building a multi-layer PCB is an expensive, time-consuming prospect; however, additive manufacturing provides the complex board which can be generated at a relatively low expense. 3D-printed electronics can create 3D circuits by printing the substrate item layer by layer and then adding the liquid ink on top of it that contains electronic functionalities. Surface-mount technology is essential here as it is added to create the final system. The result is a circuit that can take any shape imaginable.
– In August 2020, Electronic Systems, Inc., a provider electronic manufacturing services for PCB assembly through final system-level assemblies, which includes supply chain management and order fulfillment, purchased and installed two Fuji AIMEX II surface mount placement machines. To meet the increasing demands, Electronic Systems, Inc. will increase surface mount placement capacity and improve flexibility and also meet customers’ increasingly diverse product needs. The FUJI AIMEX series is a versatile machine used for high-mix production. Interchangeable & reconfigurable placement heads, substantial feeder capacity, massive panel support along with flexibility allows flexible production in a variety of sectors.
– The COVID-19 outbreak has had a considerable impact on the global and national economies. Many end-user industries have been affected, including those in electronics manufacturing. A large part of manufacturing includes work on the factory floor, where people are in close contact as they collaborate to boost productivity. The market is facing component shortages for building circuit boards. As many component manufacturers shut down or running at minimum capacity, the ability to keep a healthy stock of components on hand has been dramatically reduced. Many PCB components required for the operation of SMT assembly lines get shipped on regular commercial airlines as cargo. As flights have been canceled owing to international travel restrictions, shipping availability has diminished, and prices have escalated.
Key Market Trends
Automotive is Expected to Witness Significant Growth
– The increasing usage of electric vehicles across the world is also creating significant opportunities for the surface mount technology market. In May 2020, Trackwise Designs announced that it had secured a production order based on its Improved Harness Technology (IHT), for delivery in mid-2020. In support of initial vehicle production activities, this order follows successful funded innovative production activities last year for this UK-based designer and electric car manufacturer. Recently in May 2020, Tesla has done a turnaround on its previous position on vehicle-to-grid technology. According to a press release by Tesla, they are already integrating V2G technology in the electrical architecture of the Model 3. The company is doing reverse engineering of the Model 3 charger, which was fully bidirectional. To complement this design, the two-way design is replicated three times across the same Printed Circuit Board (PCB) on the Model 3 charger.
– According to the European Free Trade Association, registrations of electric vehicles in Europe jumped 57.4% in the first quarter of 2020. As the electric cars primarily constitute motor controller circuitry built on Printed Circuit Boards (PCBs), it is further expected to drive the demand in the forecast period as surface mount technology is preferred for the assembly of these PCBs. However, with the onset of COVID-19 pandemic, overall sales of passenger cars in the European Union, United Kingdom, and countries of the European Free Trade Association (EFTA) fell by 52.9% in Q1 of FY2020, when many showrooms were closed due to lockdowns. This is further expected to hinder the anticipated growth of the surface mount technology market in the short-term forecasts.
– In December 2019, Power management company Eaton’s eMobility business has formed a partnership with U.S.-based manufacturing services company Jabil for the production of electromechanical and PCB assemblies. Eaton partnered with Jabil based on several factors. One of the reasons for the tie-up is the addition of the surface-mount technology production capacity needed for the expected increase in global electronic circuit demand as per the company. Jabil partnered with Eaton to enable its vision of delivering electric vehicle solutions to passenger car, commercial vehicle, and off-highway original equipment manufacturers and support the rapidly growing vehicle electrification market.
– The rising importance of electronics in the automotive sector, coupled with the demand for zero failure rates, is the essential driver of quality control in SMT lines. In June 2020, Kopin Corporation, a provider of microdisplay subassemblies and high-resolution microdisplays, announced that Spatial Light Modulators (SLMs) and matching LED drivers from its subsidiary, Forth Dimension Displays Limited, have been used for integrating into GOEPEL electronic GmbH 3D SPI (Solder Paste Inspection) snd 3D AOI (Automated Optical Inspection) products. In Germany, GOEPEL is an inline inspection equipment manufacturer for Surface Mount Technology (SMT) production lines. The 3D SPI engages in the measurement of solder paste in all three dimensions, on every PCB in real-time, enabling improved yields and product quality while reducing waste and cost.
Asia Pacific is Expected to Witness Fastest Growth
– The market for surface mount technology is growing significantly in the Asia-Pacific region, mainly due to the presence of various PCB production facilities in the region. China is home to many PCB production facilities. AT&S’s most significant production unit is located in Shanghai with a focus on multi-layer PCB. This is because the company’s attention is on large volumes for mobile communications customers in China. Increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world. This is due to increasing population growth and urbanization. As per the GSM Association, more than 4 out of 5 connections will be smartphones by 2025. This trend is expected to increase the adoption of surface mount technology among consumer electronics in the region.
– In December 2019, Nexperia, a manufacturer of discrete and MOSFET components and logic & analog ICs, announced that Wingtech Technology, a Chinese telecom and computer equipment manufacturer has officially obtained a controlling stake in Nexperia from Beijing Jianguang Asset Management Co. Ltd (JAC Capital). In June 2020, Nexperia launched the latest range of GaN FET devices equipped next-generation high-voltage GaN HEMT H2 technology in the Nexperia’s proprietary CCPAK surface-mount packaging. Devices achieve superior on-state performance coupled with improved stability and simplify application designs due to their cascade configuration, which eliminates the requirement for complicated controls and drivers.
– With India’s government increasing customs duty on the printed circuit board assembly (PCBA), the critical component of any smartphone from 10% to 20%, in February 2020, Apple’s supplier Wistron announced to begin assembling PCBs for high-end iPhones. The assembling of PCBs is expected to start at Taiwanese manufacturer’s new iPhone plant located in Bengaluru. The move is also seen as to end dependency on China for component manufacturing slowly. This is expected to positively impact India’s market because the smartphone makers should be equipped with well-oiled surface-mount technology (SMT) assembly lines in place in which the components are placed or mounted directly onto the surface of a printed circuit board (PCB). According to India Cellular & Electronics Association of India (ICEA), nearly 320 million PCBA units are operating in India, out of which 160 million are being used in smartphones.
– In March 2020, Advanced Technology & Manufacturing (AT&M), one of Australia’s Electronic Manufacturing Service providers, announced that it had been awarded ISO 9001:2015 accreditation. The company offers turnkey PCB assembly inclusive of surface mount and associated services in the purchasing, assembly, and testing of Printed Circuit Boards (PCB) and other electronic products. In March 2020, Australian automotive electronics manufacturer Redarc announced that it could adapt its state-of-the-art PCB production line near Adelaide to build components for medical respirators as part of a nationwide manufacturing response to the COVID-19 pandemic. With its advanced Surface Mount Technology circuit board production line, Redarc has electromagnetic compatibility and vibration testing labs.
The Surface Mount Technology market comprises several global and regional players such as Fuji Machine Manufacturing Co., Ltd., Yamaha Motor Co., Ltd., Panasonic Corporation, Mycronic AB, etc. who are vying for attention in a contested market space. The market is moderately fragmented and poses high barriers to entry for the new players.
– June 2020 – Optronic made some significant investments that were quality enhancing for the PCB line by ordering surface mounting machine, MY300, from Mycronic AB. Optronic has also been a supplier to Mycronic as it manufactures all cameras for Mycronic surface mounting machines.
– April 2020 – Yamaha Motor Co., Ltd. made available the new YRM20 surface mounter. Built on a next-generation platform that embodies the intelligent factory, this high-efficiency premium modular mounter utilizes a high-speed, multi-purpose rotary head when combined with the new high-speed feeder, delivers high mounting performance.
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1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET INSIGHTS
4.1 Market Overview
4.2 Industry Attractiveness – Porter’s Five Force Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of New Entrants
4.2.4 Threat of Substitute Products
4.2.5 Intensity of Competitive Rivalry
4.3 Assessment of the impact due to COVID-19
5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Rising Demand For Miniaturization of Technology
5.1.2 Fewer Holes Required to Drill on PCBs Compared to Other Technologies
5.2 Market Restraints
5.2.1 SMT is Unsuitable for Any Large, High-Power and High-Voltage Parts and Parts Undergoing Frequent Mechanical Stress
6 MARKET SEGMENTATION
6.1 By Component
6.1.1 Passive Components
6.1.2 Active Components
188.8.131.52 Integrated Circuits
6.2 By End-User Industry
6.2.1 Consumer Electronics
6.2.3 Industrial Electronics
6.2.4 Aerospace and Defense
6.2.6 Other End-User Industries
6.3.1 North America
6.3.4 Rest of the World
7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 Fuji Machine Manufacturing Co., Ltd.
7.1.2 Yamaha Motor Co., Ltd.
7.1.3 Mycronic AB
7.1.4 ASM Assembly Systems GmbH & Co. KG
7.1.5 Panasonic Corporation
7.1.6 Nordson Corporation
7.1.7 Juki Corporation
7.1.8 Hanwha Group
7.1.9 Neoden Technology Co.,Ltd
7.1.10 Viscom AG
7.1.11 Electronic Manufacturing Services Group, Inc.
7.1.12 Kasdon Electronics Limited
8 INVESTMENT ANALYSIS
9 FUTURE OF THE MARKET