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レポート概要
| 本調査資料では、世界の高帯域幅メモリー（HBM）市場について調査し、イントロダクション、調査手法、エグゼクティブサマリー、市場インサイト、市場動向、材料種類別（プラスチック、段ボール、紙、その他）分析、製品種類別（箱、保護包装ベース製品、その他）分析、産業別（ファッション・衣類、家電、食品・飲料、パーソナルケア製品、その他）分析、地域別分析、競争状況、投資分析、将来機会などの項目を掲載しています。 ・イントロダクション ・調査手法 ・エグゼクティブサマリー ・市場インサイト ・市場動向 ・世界の高帯域幅メモリー（HBM）市場規模：材料種類別（プラスチック、段ボール、紙、その他） ・世界の高帯域幅メモリー（HBM）市場規模：製品種類別（箱、保護包装ベース製品、その他） ・世界の高帯域幅メモリー（HBM）市場規模：産業別（ファッション・衣類、家電、食品・飲料、パーソナルケア製品、その他） ・世界の高帯域幅メモリー（HBM）市場規模：地域別 ・競争状況 ・投資分析 ・将来機会 |
The High Bandwidth Memory market is expected to register a CAGR of 33.5% during the forecast period (2021-2026). Major factors driving the growth of the high bandwidth memory (HBM) market include the growing need for high-bandwidth, low power consumption, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.
– With the growing application of graphics, the appetite for the fast delivery of information (bandwidth) has also increased. Therefore HBM memory performs better than a GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.
– For instance, AMD provides high bandwidth memory that uses vertically stacked memory chips interconnected by microscopic wires called through-silicon vias or TSVs. These break the processing bottleneck due to its benefits, such as 94% less space compared to GDDR5, lower power consumption, lightweight, and higher performance in terms of processing speed. The above factors increase their industry-wide applications.
– Lack of stability under extreme environmental conditions is restraining the market. Extreme ecological conditions significantly impact it in terms of the durability and reliability of memory devices. For instance, the more thermal stress a memory device is exposed to, the more of a risk there is of damaging it, which challenges a market to grow.
– Additionally, the human cost of life, the impact of the spread of the COVID-19 virus on the global economy, is only beginning to be appreciated. It has profound implications for the world’s technology supply chain. In the short term, there will be lower demand. Still, in the long run, the need for high bandwidth memory market will increase due to emerging technologies, like 5G, the Internet of Things, high-performance computing, and the intelligent edge.
– This ongoing pandemic situation has led to the lockdown in all over the world. However, the disruptions caused in starting four months of 2020 could result in order delays and lead time across the supply chain during 2020. Additionally, the 3rd Generation Partnership Project (3GPP) also announced its decision to delay the 5G standard updates due to COVID-19. Hence these factors are the major restraint for this market.
Key Market Trends
Accelerated Processing Units to Have the Largest Growth
– APUs integrate both GPU and CPU capabilities on a single SoC. It improves the overall energy efficiency of the APUs by eliminating connections between chips as well as the processing speed owing to improved data transfer rate. Hence this boosts the growth of the market due to increased applicability in various industries.
– AMD (US), one of the leading manufacturers of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications. Moreover, increasing demand for low power consumption, high-bandwidth, and highly scalable memories, and a rising trend of miniaturization of electronic devices are also influencing the growth of this market.
– The complete application of high bandwidth memory technology in supercomputers, robotics, and gaming opens significant opportunities for the industry in many developed as well as emerging economies. For instance, NVIDIA powers US-based Summit, the world’s fastest supercomputer, as well as the most rapid systems in Europe and Japan. More than 130 supercomputers on the TOP500 list are accelerated by NVIDIA, including five of the top 10.
– The intensifying need for heavy graphic applications enables the broad application of high bandwidth memory technology in supercomputers, robotics, and gaming and provide significant opportunities for the industry in many developed as well as emerging economies. However, thermal issues caused by the high level of integration and high initial cost are the key restraining factor for market growth.
North America to Hold the Largest Share in the Market
– The high adoption of HBM memories in North America is primarily due to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing due to the increasing market for AI, machine learning, and cloud computing.
– The rapidly changing technologies and high data generation, across the industries, are creating a need for more efficient processing systems. These are also some of the factors driving the demand for high bandwidth memory market in the region.
– Additionally, the US government has started the Data Center Optimization Initiative (DCOI) to deliver better services to the public while increasing return-on-investment to taxpayers, by consolidating many data centers in the country. The consolidation process includes the process for building hyper-scale data centers and to shut-off the underperforming ones. To date, the government has closed over 3,215 data centers in the country.
– Moreover, the memory manufacturing companies in North America are seeking opportunities for production expansions. For instance, Intel has already started the phases of its new fabrication plant in Arizona for manufacturing next-generation memory and storage solutions. For this project, the company spent USD 1 billion as the first phase of investment out of the total cost of USD 7 billion. Investments such as these will boost the growth of HBM in the region.
Competitive Landscape
The high bandwidth memory market is highly fragmented as the market is highly competitive and consists of several major players. The competitive rivalry in this industry is primarily dependent on the sustainable competitive advantage through innovation, levels of market penetration, and power of competitive strategy. Since the market is capital intensive, the barriers to exit are high as well. Some of the key players in the market are Intel Corporation, Toshiba Corporation, Fujitsu Ltd, etc. Some of the key recent developments in the market are –
– April 2020 – Advanced Micro Devices launched new AMD Radeon Pro 5000 series Graphics Processing Units (GPU) for the iMAC platform. These new GPUs are built on 7nm process technology and consist of 16GB of high-speed GDDR6 memory, which can run a wide range of graphically intensive applications and workloads.
– March 2020 – Marvell Technology announced the launch of ThunderX3, which consists of new TX3 also ups the clock frequencies and also allowing the chip to scale up to 384 threads in a single socket. Moreover, this innovative technology will not only expand its current customer base but also increases the brand reputation for this company.
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1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET INSIGHT
4.1 Market Overview
4.2 Industry Value Chain Analysis
4.3 Industry Attractiveness – Porter’s Five Forces Analysis
4.3.1 Bargaining Power of Suppliers
4.3.2 Bargaining Power of Buyers
4.3.3 Threat of New Entrants
4.3.4 Intensity of Competitive Rivalry
4.3.5 Threat of Substitute Products
5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Sustained Rise in Volume of Consumer Shipments
5.1.2 Key Product and Material Innovations, Coupled with Growing Emphasis on Gaining Competitive Advantage Through Packaging
5.1.3 Growing Demand for Luxury Packaging
5.2 Market Challenges
5.2.1 Material-specific Regulations on Use of Plastic, and Relative Lack of Exposure on Good Manufacturing Practices
5.3 Key Case Studies and Implementation of Use Cases Related to Innovations in E-commerce Packaging
5.4 Impact of COVID-19 on the E-commerce and Packaging Industries
6 MARKET SEGMENTATION
6.1 By Material Type
6.1.1 Plastic
6.1.2 Corrugated Board
6.1.3 Paper
6.1.4 Other Material Types
6.2 By Product Type
6.2.1 Boxes
6.2.2 Protective Packaging-based Products
6.2.3 Other Product Types
6.3 By End User Industry
6.3.1 Fashion and Apparel
6.3.2 Consumer Electronics
6.3.3 Food and Beverage
6.3.4 Personal Care Products
6.3.5 Other End User Industries
6.4 By Country
6.4.1 United States
6.4.2 Canada
7 COMPETITIVE LANDSCAPE
7.1 Company Profiles
7.1.1 Amcor PLC
7.1.2 Mondi PLC
7.1.3 International Paper Company
7.1.4 Smurfit Kappa Group PLC
7.1.5 DS Smith PLC
7.1.6 CCL Industries Inc.
7.1.7 Georgia-Pacific LLC
7.1.8 Sonoco Products Company
7.1.9 Storopack Inc.
7.1.10 Sealed Air Corporation
8 INVESTMENT ANALYSIS
9 FUTURE OPPORTUNITIES