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世界の半導体製造装置市場(~2027):フロントエンド機器別、製品タイプ別、寸法別、ファブ施設機器別、バックエンド機器別、地域別

• 英文タイトル:Semiconductor Manufacturing Equipment Market Research Report by Front-End Equipment, Product Type, Dimension, Fab Facility Equipment, Back-End Equipment, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

360iResearchが調査・発行した産業分析レポートです。世界の半導体製造装置市場(~2027):フロントエンド機器別、製品タイプ別、寸法別、ファブ施設機器別、バックエンド機器別、地域別 / Semiconductor Manufacturing Equipment Market Research Report by Front-End Equipment, Product Type, Dimension, Fab Facility Equipment, Back-End Equipment, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19 / MRC2304A080資料のイメージです。• レポートコード:MRC2304A080
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、220ページ
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レポート概要
360iResearch社は、2021年に862.3億ドルであった世界の半導体製造装置市場規模が2022年に935.2億ドルに到達し、2027年までにCAGR 8.71%で成長して1,423.6億ドルへと拡大すると予測しています。当調査資料では、半導体製造装置の世界市場について多角的な視点から分析を行い、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、フロントエンド装置別(成膜装置、リソグラフィー装置、ウェーハ洗浄装置、水面調整装置)分析、製品タイプ別(メモリロジック、微小電気機械システム(MEMS)、マイクロプロセッサーユニット(MPU))分析、ファブ施設装置別(自動化装置、化学制御装置、ガス制御装置)分析、バックエンド装置別(組み立て&パッケージング装置、ダイシング&ボンディング装置、計測装置、水質検査装置)分析、地域別(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)分析、競争状況、企業情報などの項目をまとめました。なお、当書内の企業情報としては、Advanced Dicing Technologies Ltd.、Advantest Corporation、Applied Materials, Inc.、ASML Holding N.V.、EV Group、Evatec AG、Hitachi High-Technologies Corporation、KLA Corporation、Kokusai Electric Corporation、Lam Research Corporationなどが掲載されています。
・序論
・調査方法
・エグゼクティブサマリー
・市場概要
・市場インサイト
・世界の半導体製造装置市場規模:フロントエンド装置別
- 成膜装置の市場規模
- リソグラフィー装置の市場規模
- ウェーハ洗浄装置の市場規模
- 水面調整装置の市場規模
・世界の半導体製造装置市場規模:製品タイプ別
- メモリロジックの市場規模
- 微小電気機械システム(MEMS)の市場規模
- マイクロプロセッサーユニット(MPU)の市場規模
・世界の半導体製造装置市場規模:ファブ施設装置別
- 自動化装置の市場規模
- 化学制御装置の市場規模
- ガス制御装置の市場規模
・世界の半導体製造装置市場規模:バックエンド装置別
- 組み立て&パッケージング装置の市場規模
- ダイシング&ボンディング装置の市場規模
- 計測装置の市場規模
- 水質検査装置の市場規模
・世界の半導体製造装置市場規模:地域別
- 南北アメリカの半導体製造装置市場規模
アメリカの半導体製造装置市場規模
カナダの半導体製造装置市場規模
ブラジルの半導体製造装置市場規模
...
- アジア太平洋の半導体製造装置市場規模
日本の半導体製造装置市場規模
中国の半導体製造装置市場規模
インドの半導体製造装置市場規模
韓国の半導体製造装置市場規模
台湾の半導体製造装置市場規模
...
- ヨーロッパ/中東/アフリカの半導体製造装置市場規模
イギリスの半導体製造装置市場規模
ドイツの半導体製造装置市場規模
フランスの半導体製造装置市場規模
ロシアの半導体製造装置市場規模
...
- その他地域の半導体製造装置市場規模
・競争状況
・企業情報

The Global Semiconductor Manufacturing Equipment Market size was estimated at USD 86.23 billion in 2021 and expected to reach USD 93.52 billion in 2022, and is projected to grow at a CAGR 8.71% to reach USD 142.36 billion by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Semiconductor Manufacturing Equipment to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Front-End Equipment, the market was studied across Deposition Equipment, Lithography Equipment, Wafer Cleaning Equipment, and Water Surface Conditioning Equipment. The Deposition Equipment is further studied across Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD). The Lithography Equipment is further studied across Deep Ultraviolet (DUV) Lithography and Extreme ultraviolet (EUV) Lithography. The Wafer Cleaning Equipment is further studied across Batch Immersion Cleaning System, Batch Spray Cleaning System, Scrubber, Single-Wafer Cryogenic System, and Single-Wafer Spray System. The Water Surface Conditioning Equipment is further studied across Chemical Mechanical Planarization and Etching.

Based on Product Type, the market was studied across Memory Logics, Micro-electromechanical system (MEMS), and Microprocessor Units (MPU).

Based on Dimension, the market was studied across 2.5D ICs, 2D ICs, and 3D ICs.

Based on Fab Facility Equipment, the market was studied across Automation Equipment, Chemical Control Equipment, and Gas Control Equipment.

Based on Back-End Equipment, the market was studied across Assembly & Packaging, Dicing & Bonding, Metrology, and Water Testing.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Semiconductor Manufacturing Equipment market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Semiconductor Manufacturing Equipment Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Semiconductor Manufacturing Equipment Market, including Advanced Dicing Technologies Ltd., Advantest Corporation, Applied Materials, Inc., ASML Holding N.V., EV Group, Evatec AG, Hitachi High-Technologies Corporation, KLA Corporation, Kokusai Electric Corporation, Lam Research Corporation, Modutek Corporation, Nikon Corporation, NOIVION S.r.l., Nordson Corporation, Onto Innovation Inc., SCREEN Semiconductor Solutions Co., Ltd., Semiconductor Equipment Corporation, Teradyne Inc., Tokyo Electron Ltd., and Veeco Instruments Inc..

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Semiconductor Manufacturing Equipment Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Semiconductor Manufacturing Equipment Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Semiconductor Manufacturing Equipment Market?
4. What is the competitive strategic window for opportunities in the Global Semiconductor Manufacturing Equipment Market?
5. What are the technology trends and regulatory frameworks in the Global Semiconductor Manufacturing Equipment Market?
6. What is the market share of the leading vendors in the Global Semiconductor Manufacturing Equipment Market?
7. What modes and strategic moves are considered suitable for entering the Global Semiconductor Manufacturing Equipment Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growing semiconductor industry and rising demand for semiconductor fabrication facilities
5.1.1.2. Rising demand for advanced and miniaturized semiconductor components in consumer electronics
5.1.1.3. Advancements in the lithography process enable advances in integrated circuits and devices
5.1.2. Restraints
5.1.2.1. High investments and maintenance expenses
5.1.3. Opportunities
5.1.3.1. Increasing demand for factory automation in the semiconductor industry
5.1.3.2. Proliferation of government initiatives for semiconductor manufacturing equipment
5.1.4. Challenges
5.1.4.1. Technical concerns associated with the semiconductor fabrication procedure
5.2. Cumulative Impact of COVID-19

6. Semiconductor Manufacturing Equipment Market, by Front-End Equipment
6.1. Introduction
6.2. Deposition Equipment
6.3.1. Chemical Vapor Deposition (CVD)
6.3.2. Physical Vapor Deposition (PVD)
6.3. Lithography Equipment
6.4.1. Deep Ultraviolet (DUV) Lithography
6.4.2. Extreme ultraviolet (EUV) Lithography
6.4. Wafer Cleaning Equipment
6.5.1. Batch Immersion Cleaning System
6.5.2. Batch Spray Cleaning System
6.5.3. Scrubber
6.5.4. Single-Wafer Cryogenic System
6.5.5. Single-Wafer Spray System
6.5. Water Surface Conditioning Equipment
6.6.1. Chemical Mechanical Planarization
6.6.2. Etching

7. Semiconductor Manufacturing Equipment Market, by Product Type
7.1. Introduction
7.2. Memory Logics
7.3. Micro-electromechanical system (MEMS)
7.4. Microprocessor Units (MPU)

8. Semiconductor Manufacturing Equipment Market, by Dimension
8.1. Introduction
8.2. 2.5D ICs
8.3. 2D ICs
8.4. 3D ICs

9. Semiconductor Manufacturing Equipment Market, by Fab Facility Equipment
9.1. Introduction
9.2. Automation Equipment
9.3. Chemical Control Equipment
9.4. Gas Control Equipment

10. Semiconductor Manufacturing Equipment Market, by Back-End Equipment
10.1. Introduction
10.2. Assembly & Packaging
10.3. Dicing & Bonding
10.4. Metrology
10.5. Water Testing

11. Americas Semiconductor Manufacturing Equipment Market
11.1. Introduction
11.2. Argentina
11.3. Brazil
11.4. Canada
11.5. Mexico
11.6. United States

12. Asia-Pacific Semiconductor Manufacturing Equipment Market
12.1. Introduction
12.2. Australia
12.3. China
12.4. India
12.5. Indonesia
12.6. Japan
12.7. Malaysia
12.8. Philippines
12.9. Singapore
12.10. South Korea
12.11. Taiwan
12.12. Thailand
12.13. Vietnam

13. Europe, Middle East & Africa Semiconductor Manufacturing Equipment Market
13.1. Introduction
13.2. Denmark
13.3. Egypt
13.4. Finland
13.5. France
13.6. Germany
13.7. Israel
13.8. Italy
13.9. Netherlands
13.10. Nigeria
13.11. Norway
13.12. Poland
13.13. Qatar
13.14. Russia
13.15. Saudi Arabia
13.16. South Africa
13.17. Spain
13.18. Sweden
13.19. Switzerland
13.20. Turkey
13.21. United Arab Emirates
13.22. United Kingdom

14. Competitive Landscape
14.1. FPNV Positioning Matrix
14.1.1. Quadrants
14.1.2. Business Strategy
14.1.3. Product Satisfaction
14.2. Market Ranking Analysis, By Key Player
14.3. Market Share Analysis, By Key Player
14.4. Competitive Scenario
14.4.1. Merger & Acquisition
14.4.2. Agreement, Collaboration, & Partnership
14.4.3. New Product Launch & Enhancement
14.4.4. Investment & Funding
14.4.5. Award, Recognition, & Expansion

15. Company Usability Profiles
15.1. Advanced Dicing Technologies Ltd.
15.1.1. Business Overview
15.1.2. Key Executives
15.1.3. Product & Services
15.2. Advantest Corporation
15.2.1. Business Overview
15.2.2. Key Executives
15.2.3. Product & Services
15.3. Applied Materials, Inc.
15.3.1. Business Overview
15.3.2. Key Executives
15.3.3. Product & Services
15.4. ASML Holding N.V.
15.4.1. Business Overview
15.4.2. Key Executives
15.4.3. Product & Services
15.5. EV Group
15.5.1. Business Overview
15.5.2. Key Executives
15.5.3. Product & Services
15.6. Evatec AG
15.6.1. Business Overview
15.6.2. Key Executives
15.6.3. Product & Services
15.7. Hitachi High-Technologies Corporation
15.7.1. Business Overview
15.7.2. Key Executives
15.7.3. Product & Services
15.8. KLA Corporation
15.8.1. Business Overview
15.8.2. Key Executives
15.8.3. Product & Services
15.9. Kokusai Electric Corporation
15.9.1. Business Overview
15.9.2. Key Executives
15.9.3. Product & Services
15.10. Lam Research Corporation
15.10.1. Business Overview
15.10.2. Key Executives
15.10.3. Product & Services
15.11. Modutek Corporation
15.11.1. Business Overview
15.11.2. Key Executives
15.11.3. Product & Services
15.12. Nikon Corporation
15.12.1. Business Overview
15.12.2. Key Executives
15.12.3. Product & Services
15.13. NOIVION S.r.l.
15.13.1. Business Overview
15.13.2. Key Executives
15.13.3. Product & Services
15.14. Nordson Corporation
15.14.1. Business Overview
15.14.2. Key Executives
15.14.3. Product & Services
15.15. Onto Innovation Inc.
15.15.1. Business Overview
15.15.2. Key Executives
15.15.3. Product & Services
15.16. SCREEN Semiconductor Solutions Co., Ltd.
15.16.1. Business Overview
15.16.2. Key Executives
15.16.3. Product & Services
15.17. Semiconductor Equipment Corporation
15.17.1. Business Overview
15.17.2. Key Executives
15.17.3. Product & Services
15.18. Teradyne Inc.
15.18.1. Business Overview
15.18.2. Key Executives
15.18.3. Product & Services
15.19. Tokyo Electron Ltd.
15.19.1. Business Overview
15.19.2. Key Executives
15.19.3. Product & Services
15.20. Veeco Instruments Inc.
15.20.1. Business Overview
15.20.2. Key Executives
15.20.3. Product & Services

16. Appendix
16.1. Discussion Guide
16.2. License & Pricing