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レポート概要
| Transparency Market Research社の当調査レポートでは、高信頼性半導体の世界市場を分析し、市場実態を明らかにしています。本書は、序論、エグゼクティブサマリー、市場動向、関連産業＆主要指標分析、種類別（ディスクリート、アナログ、ミックス）分析、パッケージ材料別（プラスチック、セラミック）分析、技術別（表面実装技術、スルーホール技術）分析、エンドユーザー別（航空宇宙、防衛、宇宙）分析、地域別（北米、ヨーロッパ、アジア太平洋、中東・アフリカ、南米）分析、競争分析、企業情報などを収録しています。また、Digitron Semiconductors、Infineon Technologies AG、KCB Solutions, LLC、Microsemi Corporation、SEMICOA、Semtech Corporation、Skyworks Solutions Inc、Teledyne Technologies Incorporated、Testime Technology Ltd、Texas Instruments Inc、Vishay Intertechnology, Inc.などの企業情報を掲載しています。 ・序論 ・エグゼクティブサマリー ・市場動向 ・関連産業＆主要指標分析 ・世界の高信頼性半導体市場規模：種類別 - ディスクリート半導体の市場規模 - アナログ半導体の市場規模 - ミックス半導体の市場規模 ・世界の高信頼性半導体市場規模：パッケージ材料別 - プラスチックパッケージの市場規模 - セラミックパッケージの市場規模 ・世界の高信頼性半導体市場規模：技術別 - 表面実装技術の市場規模 - スルーホール技術の市場規模 ・世界の高信頼性半導体市場規模：エンドユーザー別 - 航空宇宙における市場規模 - 防衛における市場規模 - 宇宙における市場規模 ・世界の高信頼性半導体市場規模：地域別 - 北米の高信頼性半導体市場規模 - ヨーロッパの高信頼性半導体市場規模 - アジア太平洋の高信頼性半導体市場規模 - 中東・アフリカの高信頼性半導体市場規模 - 南米の高信頼性半導体市場規模 ・競争状況 ・企業情報 |
High-reliability Semiconductor Market – Scope of Report
TMR’s report on the global high-reliability semiconductor market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2022 to 2031. The report provides revenue of the global high-reliability semiconductor market for the period 2017–2031, considering 2022 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global high-reliability semiconductor market from 2022 to 2031.
The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players’ product literature, annual reports, press releases, and relevant documents to understand the high-reliability semiconductor market.
Secondary research also included Internet sources, statistical data from government agencies, websites, and trade associations. Analysts employed a combination of top-down and bottom-up approaches to study various attributes of the global high-reliability semiconductor market.
The report includes an elaborate executive summary, along with a snapshot of the growth behavior of various segments included in the scope of the study. Moreover, the report sheds light on the changing competitive dynamics in the global high-reliability semiconductor market. These serve as valuable tools for existing market players as well as for entities interested in participating in the global high-reliability semiconductor market.
The report delves into the competitive landscape of the global high-reliability semiconductor market. Key players operating in the global high-reliability semiconductor market have been identified and each one of these has been profiled, in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are attributes of players in the global high-reliability semiconductor market profiled in this report.
RESEARCH METHODOLOGY
The research methodology will be a combination of exhaustive primary and secondary research to analyze the market high-reliability semiconductor.
Secondary Research
Secondary research includes a search of company literature, technical writing, patent data, Internet sources, and statistical data from government websites, trade associations, and agencies. This has proven to be the most reliable, effective, and successful approach for obtaining precise data, capturing industry participants’ insights, and recognizing business opportunities.
Secondary research sources that we typically refer, but are not limited to:
Company websites, presentations, annual reports, white papers, technical paper, product brochure
Internal and external proprietary databases and relevant patents
National government documents, statistical databases, and market reports
News articles, press releases, and webcasts specific to companies operating in the market
Specific Secondary Sources:
• Industry Sources:
o WorldWideScience.org
o Elsevier, Inc.
o National Institutes of Health (NIH)
o PubMed
o NCBI
o Department of Health Care Service
• Trade Data Sources
o Trade Map
o UN Comtrade
o Trade Atlas
• Company Information
o OneSource Business Browser
o Hoover’s
o Factiva
o Bloomberg
• Mergers & Acquisitions
o Thomson Mergers & Acquisitions
o MergerStat
o Profound
Primary Research
During the course of research, we conduct in-depth interviews and discussions with a wide range of key industry participants and opinion leaders. Primary research represents bulk of research efforts, supplemented by extensive secondary research.
We conduct primary interviews on the ongoing basis with industry participants and commentators to validate data and analysis. A typical research interview fulfills the following functions:
Provides first-hand information on market size, market trends, growth trends, competitive landscape, outlook, etc.
Helps in validating and strengthening secondary research findings
Further develops the analysis team’s expertise and market understanding
Primary research involves e-mail interactions, telephonic interviews, as well as face-to-face interviews for each market, category, segment, and sub-segment across geographies
Participants who typically take part in such a process include, but are not limited to:
Industry participants: Marketing/product managers, market intelligence managers, and regional sales managers
Purchasing/Sourcing managers, technical personnel, distributors
Outside experts: Investment bankers, valuation experts, and research analysts specializing in specific markets
Key opinion leaders specializing in different areas corresponding to different industry verticals
List of primary participants, but not limited to:
Advanced Oncotherapy PLC
Danfysik A/S
Hitachi, Ltd.
IBA Worldwide
Mevion Medical Systems, Inc.
Data Triangulation: Information culled from “Secondary & Primary Sources” is cross-checked with “TMR Knowledge Repository”, which is updated every quarter.
Market Estimation: Market size estimations involved in-depth study of product features, technology updates, geographic presence, product demand, sales data (value or volume), historical year-on-year growth, and others. Other approaches were also utilized to derive market size and forecasts. Where no hard data was available, we employed modeling techniques in order to produce comprehensive datasets. A rigorous methodology has been adopted, wherein the available hard data are cross-referenced with the following data types to produce estimates:
Demographic Data: Healthcare expenditure, inflation rates, and others
Industry Indicators: R&D investment, technology stage, and infrastructure, sector growth, and facilities
Market Forecasting: Market forecasts for various segments are derived taking into account drivers, restraints/challenges, and opportunities prevailing in the market and considering advantages/disadvantages of segments/sub-segments over other segments/sub-segments. Business environment, historical sales pattern, unmet needs, competitive intensity, and country-wise surgery data are some of the other pivotal factors, which are considered to derive market forecasts.
1. Preface
1.1. Market Introduction
1.2. Market and Segments Definition
1.3. Market Taxonomy
1.4. Research Methodology
1.5. Assumption and Acronyms
2. Executive Summary
2.1. Global High-reliability Semiconductor Market Overview
2.2. Regional Outline
2.3. Industry Outline
2.4. Market Dynamics Snapshot
2.5. Competition Blueprint
3. Market Dynamics
3.1. Macro-economic Factors
3.2. Drivers
3.3. Restraints
3.4. Opportunities
3.5. Key Trends
3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
4.1. Parent Industry Overview – Global Semiconductor Industry Overview
4.2. Supply Chain Analysis
4.3. Technology Roadmap Analysis
4.4. Industry SWOT Analysis
4.5. Porter’s Five Forces Analysis
4.6. COVID-19 Impact and Recovery Analysis
5. Global High-reliability Semiconductor Market Analysis, by Type
5.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
5.1.1. Discrete
5.1.2. Analog
5.1.3. Mixed
5.2. Market Attractiveness Analysis, by Type
6. Global High-reliability Semiconductor Market Analysis, by Packaging Material
6.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
6.1.1. Plastic
6.1.2. Ceramic
6.2. Market Attractiveness Analysis, by Packaging Material
7. Global High-reliability Semiconductor Market Analysis, by Technology
7.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
7.1.1. Surface Mount Technology (SMT)
7.1.2. Through Hole Technology (THT)
7.2. Market Attractiveness Analysis, by Technology
8. Global High-reliability Semiconductor Market Analysis, by Quality Level
8.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
8.1.1. JAN
8.1.2. JANX
8.1.3. JANTXV
8.1.4. JANS
8.1.5. JANSR
8.1.6. QMLQ
8.1.7. QMLV
8.2. Market Attractiveness Analysis, by Quality Level
9. Global High-reliability Semiconductor Market Analysis, by End-use Industry
9.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
9.1.1. Aerospace
9.1.2. Defense
9.1.3. Space
9.2. Market Attractiveness Analysis, by End-use Industry
10. Global High-reliability Semiconductor Market Analysis and Forecast, by Region
10.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Region, 2017–2031
10.1.1. North America
10.1.2. Europe
10.1.3. Asia Pacific
10.1.4. Middle East & Africa
10.1.5. South America
10.2. Market Attractiveness Analysis, by Region
11. North America High-reliability Semiconductor Market Analysis and Forecast
11.1. Market Snapshot
11.2. Drivers and Restraints: Impact Analysis
11.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
11.3.1. Discrete
11.3.2. Analog
11.3.3. Mixed
11.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
11.4.1. Plastic
11.4.2. Ceramic
11.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
11.5.1. Surface Mount Technology (SMT)
11.5.2. Through Hole Technology (THT)
11.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
11.6.1. JAN
11.6.2. JANX
11.6.3. JANTXV
11.6.4. JANS
11.6.5. JANSR
11.6.6. QMLQ
11.6.7. QMLV
11.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
11.7.1. Aerospace
11.7.2. Defense
11.7.3. Space
11.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017–2031
11.8.1. The U.S.
11.8.2. Canada
11.8.3. Rest of North America
11.9. Market Attractiveness Analysis
11.9.1. By Type
11.9.2. By Packaging Material
11.9.3. By Technology
11.9.4. By Quality Level
11.9.5. By End-use Industry
11.9.6. By Country/Sub-region
12. Europe High-reliability Semiconductor Market Analysis and Forecast
12.1. Market Snapshot
12.2. Drivers and Restraints: Impact Analysis
12.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
12.3.1. Discrete
12.3.2. Analog
12.3.3. Mixed
12.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
12.4.1. Plastic
12.4.2. Ceramic
12.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
12.5.1. Surface Mount Technology (SMT)
12.5.2. Through Hole Technology (THT)
12.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
12.6.1. JAN
12.6.2. JANX
12.6.3. JANTXV
12.6.4. JANS
12.6.5. JANSR
12.6.6. QMLQ
12.6.7. QMLV
12.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
12.7.1. Aerospace
12.7.2. Defense
12.7.3. Space
12.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017–2031
12.8.1. U.K.
12.8.2. Germany
12.8.3. France
12.8.4. Rest of Europe
12.9. Market Attractiveness Analysis
12.9.1. By Type
12.9.2. By Packaging Material
12.9.3. By Technology
12.9.4. By Quality Level
12.9.5. By End-use Industry
12.9.6. By Country/Sub-region
13. Asia Pacific High-reliability Semiconductor Market Analysis and Forecast
13.1. Market Snapshot
13.2. Drivers and Restraints: Impact Analysis
13.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
13.3.1. Discrete
13.3.2. Analog
13.3.3. Mixed
13.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
13.4.1. Plastic
13.4.2. Ceramic
13.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
13.5.1. Surface Mount Technology (SMT)
13.5.2. Through Hole Technology (THT)
13.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
13.6.1. JAN
13.6.2. JANX
13.6.3. JANTXV
13.6.4. JANS
13.6.5. JANSR
13.6.6. QMLQ
13.6.7. QMLV
13.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
13.7.1. Aerospace
13.7.2. Defense
13.7.3. Space
13.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017–2031
13.8.1. China
13.8.2. India
13.8.3. Japan
13.8.4. South Korea
13.8.5. ASEAN
13.8.6. Rest of Asia Pacific
13.9. Market Attractiveness Analysis
13.9.1. By Type
13.9.2. By Packaging Material
13.9.3. By Technology
13.9.4. By Quality Level
13.9.5. By End-use Industry
13.9.6. By Country/Sub-region
14. Middle East & Africa High-reliability Semiconductor Market Analysis and Forecast
14.1. Market Snapshot
14.2. Drivers and Restraints: Impact Analysis
14.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
14.3.1. Discrete
14.3.2. Analog
14.3.3. Mixed
14.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
14.4.1. Plastic
14.4.2. Ceramic
14.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
14.5.1. Surface Mount Technology (SMT)
14.5.2. Through Hole Technology (THT)
14.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
14.6.1. JAN
14.6.2. JANX
14.6.3. JANTXV
14.6.4. JANS
14.6.5. JANSR
14.6.6. QMLQ
14.6.7. QMLV
14.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
14.7.1. Aerospace
14.7.2. Defense
14.7.3. Space
14.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017–2031
14.8.1. GCC
14.8.2. South Africa
14.8.3. Rest of the Middle East & Africa
14.9. Market Attractiveness Analysis
14.9.1. By Type
14.9.2. By Packaging Material
14.9.3. By Technology
14.9.4. By Quality Level
14.9.5. By End-use Industry
14.9.6. By Country/Sub-region
15. South America High-reliability Semiconductor Market Analysis and Forecast
15.1. Market Snapshot
15.2. Drivers and Restraints: Impact Analysis
15.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017–2031
15.3.1. Discrete
15.3.2. Analog
15.3.3. Mixed
15.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017–2031
15.4.1. Plastic
15.4.2. Ceramic
15.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017–2031
15.5.1. Surface Mount Technology (SMT)
15.5.2. Through Hole Technology (THT)
15.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017–2031
15.6.1. JAN
15.6.2. JANX
15.6.3. JANTXV
15.6.4. JANS
15.6.5. JANSR
15.6.6. QMLQ
15.6.7. QMLV
15.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017–2031
15.7.1. Aerospace
15.7.2. Defense
15.7.3. Space
15.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017–2031
15.8.1. Brazil
15.8.2. Rest of South America
15.9. Market Attractiveness Analysis
15.9.1. By Type
15.9.2. By Packaging Material
15.9.3. By Technology
15.9.4. By Quality Level
15.9.5. By End-use Industry
15.9.6. By Country/Sub-region
16. Competition Assessment
16.1. Global High-reliability Semiconductor Market Competition Matrix – a Dashboard View
16.1.1. Global High-reliability Semiconductor Market Company Share Analysis, by Value (2021)
16.1.2. Technological Differentiator
17. Company Profiles (Global Manufacturers/Suppliers)
17.1. Digitron Semiconductors
17.1.1. Overview
17.1.2. Product Portfolio
17.1.3. Sales Footprint
17.1.4. Key Subsidiaries or Distributors
17.1.5. Strategy and Recent Developments
17.1.6. Key Financials
17.2. Infineon Technologies AG
17.2.1. Overview
17.2.2. Product Portfolio
17.2.3. Sales Footprint
17.2.4. Key Subsidiaries or Distributors
17.2.5. Strategy and Recent Developments
17.2.6. Key Financials
17.3. KCB Solutions, LLC
17.3.1. Overview
17.3.2. Product Portfolio
17.3.3. Sales Footprint
17.3.4. Key Subsidiaries or Distributors
17.3.5. Strategy and Recent Developments
17.3.6. Key Financials
17.4. Microsemi Corporation
17.4.1. Overview
17.4.2. Product Portfolio
17.4.3. Sales Footprint
17.4.4. Key Subsidiaries or Distributors
17.4.5. Strategy and Recent Developments
17.4.6. Key Financials
17.5. SEMICOA
17.5.1. Overview
17.5.2. Product Portfolio
17.5.3. Sales Footprint
17.5.4. Key Subsidiaries or Distributors
17.5.5. Strategy and Recent Developments
17.5.6. Key Financials
17.6. Semtech Corporation
17.6.1. Overview
17.6.2. Product Portfolio
17.6.3. Sales Footprint
17.6.4. Key Subsidiaries or Distributors
17.6.5. Strategy and Recent Developments
17.6.6. Key Financials
17.7. Skyworks Solutions Inc
17.7.1. Overview
17.7.2. Product Portfolio
17.7.3. Sales Footprint
17.7.4. Key Subsidiaries or Distributors
17.7.5. Strategy and Recent Developments
17.7.6. Key Financials
17.8. Teledyne Technologies Incorporated
17.8.1. Overview
17.8.2. Product Portfolio
17.8.3. Sales Footprint
17.8.4. Key Subsidiaries or Distributors
17.8.5. Strategy and Recent Developments
17.8.6. Key Financials
17.9. Testime Technology Ltd
17.9.1. Overview
17.9.2. Product Portfolio
17.9.3. Sales Footprint
17.9.4. Key Subsidiaries or Distributors
17.9.5. Strategy and Recent Developments
17.9.6. Key Financials
17.10. Texas Instruments Inc
17.10.1. Overview
17.10.2. Product Portfolio
17.10.3. Sales Footprint
17.10.4. Key Subsidiaries or Distributors
17.10.5. Strategy and Recent Developments
17.10.6. Key Financials
17.11. Vishay Intertechnology, Inc
17.11.1. Overview
17.11.2. Product Portfolio
17.11.3. Sales Footprint
17.11.4. Key Subsidiaries or Distributors
17.11.5. Strategy and Recent Developments
17.11.6. Key Financials
18. Recommendation
18.1. Opportunity Assessment
18.1.1. By Type
18.1.2. By Packaging Material
18.1.3. By Technology
18.1.4. By Quality Level
18.1.5. By End-use Industry
18.1.6. By Region