▶ 調査レポート

アンテナ・イン・パッケージ(AiP)技術の世界市場2023-2031:産業分析、規模、シェア、成長、動向、予測

• 英文タイトル:Antenna-in-Package Technology Market (Packaging Technology: Flip Chip Ball Grid Array [FCBGA], Low-density Fan-out Package, High-density Fan-out Package, and Others [3D Stacking, 2.5D Stacking, etc.] - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031

Transparency Market Researchが調査・発行した産業分析レポートです。アンテナ・イン・パッケージ(AiP)技術の世界市場2023-2031:産業分析、規模、シェア、成長、動向、予測 / Antenna-in-Package Technology Market (Packaging Technology: Flip Chip Ball Grid Array [FCBGA], Low-density Fan-out Package, High-density Fan-out Package, and Others [3D Stacking, 2.5D Stacking, etc.] - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031 / MRC2305A002資料のイメージです。• レポートコード:MRC2305A002
• 出版社/出版日:Transparency Market Research / 2023年3月24日
• レポート形態:英文、PDF、201ページ
• 納品方法:Eメール
• 産業分類:電子
• 販売価格(消費税別)
  Single User¥857,660 (USD5,795)▷ お問い合わせ
  Multi User¥1,301,660 (USD8,795)▷ お問い合わせ
  Corporate License¥1,745,660 (USD11,795)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
Transparency Market Research社の当調査レポートによると、世界のアンテナ・イン・パッケージ(AiP)技術市場規模が、2023年の34.8百万ドルから2031年に327.3百万ドルとなり、予測期間中に年平均28.3%で成長すると推測されています。本レポートは、アンテナ・イン・パッケージ(AiP)技術の世界市場について徹底的に分析・調査を行い、序論、エグゼクティブサマリー、市場動向、関連産業・主要指標分析、パッケージ技術別(フリップチップボールグリッドアレイ(FCBGA)、低密度ファンアウトパッケージ、高密度ファンアウトパッケージ、その他)分析、周波数別(50GHz以下、51-100GHz、101-200GHz、201-300GHz、300GHz以上)分析、用途別(無線機・ジェスチャレーダー、自動車レーダー、ワイヤレスリンク、5Gデバイス/モバイルネットワーク、その他)分析、産業別(航空宇宙・防衛、自動車、家電、IT/通信、その他)分析、地域別(北米、ヨーロッパ、アジア太平洋、中東・アフリカ、南米)分析、競争状況、企業情報など、以下の項目を整理しています。また、3D Glass Solutions、Advanced Semiconductor Engineering, Inc.、Amkor Technology, Inc.、MediaTek Inc.、MixComm Inc.、Murata Manufacturing Co., Ltd、Powertech Technology Inc.、Samsung Electronics Co., Ltd.、Taiwan Semiconductor Manufacturing Company Limited、Texas Instruments Incorporated、TMY Technology Inc.など、主要企業情報を含んでいます。
・序論
・エグゼクティブサマリー
・市場動向
・関連産業・主要指標分析
・世界のアンテナ・イン・パッケージ(AiP)技術市場規模:パッケージ技術別
- フリップチップボールグリッドアレイ(FCBGA)における市場規模
- 低密度ファンアウトパッケージにおける市場規模
- 高密度ファンアウトパッケージにおける市場規模
- その他技術における市場規模
・世界のアンテナ・イン・パッケージ(AiP)技術市場規模:周波数別
- 50GHz以下アンテナ・イン・パッケージ(AiP)技術の市場規模
- 51-100GHzアンテナ・イン・パッケージ(AiP)技術の市場規模
- 101-200GHzアンテナ・イン・パッケージ(AiP)技術の市場規模
- 201-300GHzアンテナ・イン・パッケージ(AiP)技術の市場規模
- 300GHz以上アンテナ・イン・パッケージ(AiP)技術の市場規模
・世界のアンテナ・イン・パッケージ(AiP)技術市場規模:用途別
- 無線機・ジェスチャレーダーにおける市場規模
- 自動車レーダーにおける市場規模
- ワイヤレスリンクにおける市場規模
- 5Gデバイス/モバイルネットワークにおける市場規模
- その他用途における市場規模
・世界のアンテナ・イン・パッケージ(AiP)技術市場規模:産業別
- 航空宇宙・防衛における市場規模
- 自動車における市場規模
- 家電における市場規模
- IT/通信における市場規模
- その他産業における市場規模
・世界のアンテナ・イン・パッケージ(AiP)技術市場規模:地域別
- 北米のアンテナ・イン・パッケージ(AiP)技術市場規模
- ヨーロッパのアンテナ・イン・パッケージ(AiP)技術市場規模
- アジア太平洋のアンテナ・イン・パッケージ(AiP)技術市場規模
- 中東・アフリカのアンテナ・イン・パッケージ(AiP)技術市場規模
- 南米のアンテナ・イン・パッケージ(AiP)技術市場規模
・競争状況
・企業情報

Antenna-in-Package Technology Market – Scope of Report
TMR’s report on the global antenna-in-package technology market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2023 to 2031. The report provides revenue of the global antenna-in-package technology market for the period 2017–2031, considering 2023 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global antenna-in-package technology market from 2023 to 2031.

The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players’ product literature, annual reports, press releases, and relevant documents to understand the antenna-in-package technology market.

Secondary research also included Internet sources, statistical data from government agencies, websites, and trade associations. Analysts employed a combination of top-down and bottom-up approaches to study various attributes of the global antenna-in-package technology market.

The report includes an elaborate executive summary, along with a snapshot of the growth behavior of various segments included in the scope of the study. Moreover, the report throws light on the changing competitive dynamics in the global antenna-in-package technology market. These serve as valuable tools for existing market players as well as for entities interested in participating in the global antenna-in-package technology market.

The report delves into the competitive landscape of the global antenna-in-package technology market. Key players operating in the global antenna-in-package technology market have been identified and each one of these has been profiled in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are the attributes of players in the global antenna-in-package technology market profiled in this report.

Key Questions Answered in Global Antenna-in-Package Technology Market Report
• What is the sales/revenue generated by antenna-in-package technology across all regions during the forecast period?
• What are the opportunities in the global antenna-in-package technology market?
• What are the major drivers, restraints, opportunities, and threats in the market?
• Which regional market is set to expand at the fastest CAGR during the forecast period?
• Which segment is expected to generate the highest revenue globally in 2031?
• Which segment is projected to expand at the highest CAGR during the forecast period?
• What are the market positions of different companies operating in the global market?

Antenna-in-Package Technology Market – Research Objectives and Research Approach
The comprehensive report on the global antenna-in-package technology market begins with an overview, followed by the scope and objectives of the study. The report provides detailed explanation of the objectives behind this study and key vendors and distributors operating in the market and regulatory scenario for approval of products.

For reading comprehensibility, the report has been compiled in a chapter-wise layout, with each section divided into smaller ones. The report comprises an exhaustive collection of graphs and tables that are appropriately interspersed. Pictorial representation of actual and projected values of key segments is visually appealing to readers. This also allows comparison of the market shares of key segments in the past and at the end of the forecast period.

The report analyzes the global antenna-in-package technology market in terms of product, end-user, and region. Key segments under each criterion have been studied at length, and the market share for each of these at the end of 2031 has been provided. Such valuable insights enable market stakeholders in making informed business decisions for investment in the global antenna-in-package technology market.

レポート目次

1. Preface
    1.1. Market Introduction
    1.2. Market and Segments Definition
    1.3. Market Taxonomy
    1.4. Research Methodology
    1.5. Assumption and Acronyms
2. Executive Summary
    2.1. Global Antenna-in-Package Technology Market Overview
    2.2. Regional Outline
    2.3. Industry Outline
    2.4. Market Dynamics Snapshot
    2.5. Competition Blueprint
3. Market Dynamics
    3.1. Macro-economic Factors
    3.2. Drivers
    3.3. Restraints
    3.4. Opportunities
    3.5. Key Trends
    3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
    4.1. Parent Industry Overview – Global Radio Frequency Integrated Circuit (RFIC) Industry Overview
    4.2. Supply chain Analysis
    4.3. Technology Roadmap Analysis
    4.4. Industry SWOT Analysis
    4.5. Porter Five Forces Analysis
    4.6. COVID-19 Impact and Recovery Analysis
5. Global Antenna-in-Package Technology Market Analysis, by Packaging Technology
    5.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        5.1.1. Flip Chip Ball Grid Array (FCBGA)
        5.1.2. Low-density Fan-out Package
        5.1.3. High-density Fan-out Package
        5.1.4. Others
    5.2. Others Market Attractiveness Analysis, by Packaging Technology
6. Global Antenna-in-Package Technology Market Analysis, by Frequency
    6.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        6.1.1. Up to 50 GHz
        6.1.2. 51-100 GHz
        6.1.3. 101-200 GHz
        6.1.4. 201-300 GHz
        6.1.5. Above 300 GHz
    6.2. Market Attractiveness Analysis, by Frequency
7. Global Antenna-in-Package Technology Market Analysis, by Application
    7.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        7.1.1. Radios and Gesture Radars
        7.1.2. Automotive Radars
        7.1.3. Wireless links
        7.1.4. 5G Devices/Mobile Networks
        7.1.5. Smart Cameras
        7.1.6. Wearable Devices
        7.1.7. Others
    7.2. Market Attractiveness Analysis, by Application
8. Global Antenna-in-Package Technology Market Analysis, by End-use Industry
    8.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        8.1.1. Aerospace & Defense
        8.1.2. Automotive
        8.1.3. Consumer Electronics
        8.1.4. IT & Telecommunication
        8.1.5. Industrial
        8.1.6. Others
    8.2. Market Attractiveness Analysis, by End-use Industry
9. Global Antenna-in-Package Technology Market Analysis and Forecast, by Region
    9.1. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Region, 2023-2031
        9.1.1. North America
        9.1.2. Europe
        9.1.3. Asia Pacific
        9.1.4. Middle East & Africa
        9.1.5. South America
    9.2. Market Attractiveness Analysis, by Region
10. North America Antenna-in-Package Technology Market Analysis and Forecast
    10.1. Market Snapshot
    10.2. Drivers and Restraints: Impact Analysis
    10.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        10.3.1. Flip Chip Ball Grid Array (FCBGA)
        10.3.2. Low-density Fan-out Package
        10.3.3. High-density Fan-out Package
        10.3.4. Others
    10.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        10.4.1. Up to 50 GHz
        10.4.2. 51-100 GHz
        10.4.3. 101-200 GHz
        10.4.4. 201-300 GHz
        10.4.5. Above 300 GHz
    10.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        10.5.1. Radios and Gesture Radars
        10.5.2. Automotive Radars
        10.5.3. Wireless links
        10.5.4. 5G Devices/Mobile Networks
        10.5.5. Smart Cameras
        10.5.6. Wearable Devices
        10.5.7. Others
    10.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        10.6.1. Aerospace & Defense
        10.6.2. Automotive
        10.6.3. Consumer Electronics
        10.6.4. IT & Telecommunication
        10.6.5. Industrial
        10.6.6. Others
    10.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
        10.7.1. The U.S.
        10.7.2. Canada
        10.7.3. Rest of North America
    10.8. Market Attractiveness Analysis
        10.8.1. By Packaging Technology
        10.8.2. By Frequency
        10.8.3. By Application
        10.8.4. By End-use Industry
        10.8.5. By Country/Sub-region
11. Europe Antenna-in-Package Technology Market Analysis and Forecast
    11.1. Market Snapshot
    11.2. Drivers and Restraints: Impact Analysis
    11.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        11.3.1. Flip Chip Ball Grid Array (FCBGA)
        11.3.2. Low-density Fan-out Package
        11.3.3. High-density Fan-out Package
        11.3.4. Others
    11.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        11.4.1. Up to 50 GHz
        11.4.2. 51-100 GHz
        11.4.3. 101-200 GHz
        11.4.4. 201-300 GHz
        11.4.5. Above 300 GHz
    11.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        11.5.1. Radios and Gesture Radars
        11.5.2. Automotive Radars
        11.5.3. Wireless links
        11.5.4. 5G Devices/Mobile Networks
        11.5.5. Smart Cameras
        11.5.6. Wearable Devices
        11.5.7. Others
    11.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        11.6.1. Aerospace & Defense
        11.6.2. Automotive
        11.6.3. Consumer Electronics
        11.6.4. IT & Telecommunication
        11.6.5. Industrial
        11.6.6. Others
    11.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
        11.7.1. The U.K.
        11.7.2. Germany
        11.7.3. France
        11.7.4. Rest of Europe
    11.8. Market Attractiveness Analysis
        11.8.1. By Packaging Technology
        11.8.2. By Frequency
        11.8.3. By Application
        11.8.4. By End-use Industry
        11.8.5. By Country/Sub-region
12. Asia Pacific Antenna-in-Package Technology Market Analysis and Forecast
    12.1. Market Snapshot
    12.2. Drivers and Restraints: Impact Analysis
    12.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        12.3.1. Flip Chip Ball Grid Array (FCBGA)
        12.3.2. Low-density Fan-out Package
        12.3.3. High-density Fan-out Package
        12.3.4. Others
    12.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        12.4.1. Up to 50 GHz
        12.4.2. 51-100 GHz
        12.4.3. 101-200 GHz
        12.4.4. 201-300 GHz
        12.4.5. Above 300 GHz
    12.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        12.5.1. Radios and Gesture Radars
        12.5.2. Automotive Radars
        12.5.3. Wireless links
        12.5.4. 5G Devices/Mobile Networks
        12.5.5. Smart Cameras
        12.5.6. Wearable Devices
        12.5.7. Others
    12.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        12.6.1. Aerospace & Defense
        12.6.2. Automotive
        12.6.3. Consumer Electronics
        12.6.4. IT & Telecommunication
        12.6.5. Industrial
        12.6.6. Others
    12.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country & Sub-Region, 2023-2031
        12.7.1. China
        12.7.2. Japan
        12.7.3. South Korea
        12.7.4. Taiwan
        12.7.5. ASEAN
        12.7.6. Rest of Asia Pacific
    12.8. Market Attractiveness Analysis
        12.8.1. By Packaging Technology
        12.8.2. By Frequency
        12.8.3. By Application
        12.8.4. By End-use Industry
        12.8.5. By Country/Sub-region
13. Middle East & Africa Antenna-in-Package Technology Market Analysis and Forecast
    13.1. Market Snapshot
    13.2. Drivers and Restraints: Impact Analysis
    13.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        13.3.1. Flip Chip Ball Grid Array (FCBGA)
        13.3.2. Low-density Fan-out Package
        13.3.3. High-density Fan-out Package
        13.3.4. Others
    13.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        13.4.1. Up to 50 GHz
        13.4.2. 51-100 GHz
        13.4.3. 101-200 GHz
        13.4.4. 201-300 GHz
        13.4.5. Above 300 GHz
    13.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        13.5.1. Radios and Gesture Radars
        13.5.2. Automotive Radars
        13.5.3. Wireless links
        13.5.4. 5G Devices/Mobile Networks
        13.5.5. Smart Cameras
        13.5.6. Wearable Devices
        13.5.7. Others
    13.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        13.6.1. Aerospace & Defense
        13.6.2. Automotive
        13.6.3. Consumer Electronics
        13.6.4. IT & Telecommunication
        13.6.5. Industrial
        13.6.6. Others
    13.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country, 2023-2031
        13.7.1. GCC
        13.7.2. South Africa
        13.7.3. Rest of Middle East & Africa
    13.8. Market Attractiveness Analysis
        13.8.1. By Packaging Technology
        13.8.2. By Frequency
        13.8.3. By Application
        13.8.4. By End-use Industry
        13.8.5. By Country
14. South America Antenna-in-Package Technology Market Analysis and Forecast
    14.1. Market Snapshot
    14.2. Drivers and Restraints: Impact Analysis
    14.3. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Packaging Technology, 2023-2031
        14.3.1. Flip Chip Ball Grid Array (FCBGA)
        14.3.2. Low-density Fan-out Package
        14.3.3. High-density Fan-out Package
        14.3.4. Others
    14.4. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Frequency, 2023-2031
        14.4.1. Up to 50 GHz
        14.4.2. 51-100 GHz
        14.4.3. 101-200 GHz
        14.4.4. 201-300 GHz
        14.4.5. Above 300 GHz
    14.5. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Application, 2023-2031
        14.5.1. Radios and Gesture Radars
        14.5.2. Automotive Radars
        14.5.3. Wireless links
        14.5.4. 5G Devices/Mobile Networks
        14.5.5. Smart Cameras
        14.5.6. Wearable Devices
        14.5.7. Others
    14.6. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by End-use Industry, 2023-2031
        14.6.1. Aerospace & Defense
        14.6.2. Automotive
        14.6.3. Consumer Electronics
        14.6.4. IT & Telecommunication
        14.6.5. Industrial
        14.6.6. Others
    14.7. Antenna-in-Package Technology Market Size (US$ Mn) Analysis & Forecast, by Country, 2023-2031
        14.7.1. Brazil
        14.7.2. Rest of South America
    14.8. Market Attractiveness Analysis
        14.8.1. By Packaging Technology
        14.8.2. By Frequency
        14.8.3. By Application
        14.8.4. By End-use Industry
        14.8.5. By Country
15. Competition Assessment
    15.1. Global Antenna-in-Package Technology Market Competition Matrix – Antenna-in-Package Technology Dashboard View
        15.1.1. Global Market Company Share Analysis, by Value (2022)
        15.1.2. Technological Differentiator
16. Company Profiles (Global Manufacturers/Suppliers)
    16.1. 3D Glass Solutions
        16.1.1. Overview
        16.1.2. Product Portfolio
        16.1.3. Sales Footprint
        16.1.4. Key Subsidiaries or Distributors
        16.1.5. Strategy and Recent Developments
        16.1.6. Key Financials
    16.2. Advanced Semiconductor Engineering, Inc.
        16.2.1. Overview
        16.2.2. Product Portfolio
        16.2.3. Sales Footprint
        16.2.4. Key Subsidiaries or Distributors
        16.2.5. Strategy and Recent Developments
        16.2.6. Key Financials
    16.3. Amkor Technology, Inc.
        16.3.1. Overview
        16.3.2. Product Portfolio
        16.3.3. Sales Footprint
        16.3.4. Key Subsidiaries or Distributors
        16.3.5. Strategy and Recent Developments
        16.3.6. Key Financials
    16.4. MediaTek Inc.
        16.4.1. Overview
        16.4.2. Product Portfolio
        16.4.3. Sales Footprint
        16.4.4. Key Subsidiaries or Distributors
        16.4.5. Strategy and Recent Developments
        16.4.6. Key Financials
    16.5. MixComm Inc.
        16.5.1. Overview
        16.5.2. Product Portfolio
        16.5.3. Sales Footprint
        16.5.4. Key Subsidiaries or Distributors
        16.5.5. Strategy and Recent Developments
        16.5.6. Key Financials
    16.6. Murata Manufacturing Co., Ltd
        16.6.1. Overview
        16.6.2. Product Portfolio
        16.6.3. Sales Footprint
        16.6.4. Key Subsidiaries or Distributors
        16.6.5. Strategy and Recent Developments
        16.6.6. Key Financials
    16.7. Powertech Technology Inc.
        16.7.1. Overview
        16.7.2. Product Portfolio
        16.7.3. Sales Footprint
        16.7.4. Key Subsidiaries or Distributors
        16.7.5. Strategy and Recent Developments
        16.7.6. Key Financials
    16.8. Samsung Electronics Co., Ltd.
        16.8.1. Overview
        16.8.2. Product Portfolio
        16.8.3. Sales Footprint
        16.8.4. Key Subsidiaries or Distributors
        16.8.5. Strategy and Recent Developments
        16.8.6. Key Financials
    16.9. Taiwan Semiconductor Manufacturing Company Limited
        16.9.1. Overview
        16.9.2. Product Portfolio
        16.9.3. Sales Footprint
        16.9.4. Key Subsidiaries or Distributors
        16.9.5. Strategy and Recent Developments
        16.9.6. Key Financials
    16.10. Texas Instruments Incorporated
        16.10.1. Overview
        16.10.2. Product Portfolio
        16.10.3. Sales Footprint
        16.10.4. Key Subsidiaries or Distributors
        16.10.5. Strategy and Recent Developments
        16.10.6. Key Financials
    16.11. TMY Technology Inc.
        16.11.1. Overview
        16.11.2. Product Portfolio
        16.11.3. Sales Footprint
        16.11.4. Key Subsidiaries or Distributors
        16.11.5. Strategy and Recent Developments
        16.11.6. Key Financials
17. Recommendation
    17.1. Identification of Potential Market Spaces
    17.2. Understanding Buying Process of Customers
    17.3. Preferred Sales & Marketing Strategy