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レポート概要
| GlobalInfoResearchの最新の調査によると、世界のパワーデバイス用エポキシ成形材料の市場規模は2022年のxxx米ドルから2029年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を考慮しながら市場規模を推計しました。 このレポートは、世界のパワーデバイス用エポキシ成形材料市場に関する詳細かつ包括的な分析の結果です。定量的分析と定性的分析データが、メーカー別、地域別、国別、種類別、用途別に記載されています。 市場は常に変化しているため、本レポートでは、競争、需要と供給の傾向、および多くの市場にわたる需要の変化に影響する主要な要因を調査しました。主要な競合他社の企業概要と製品例、および2023年の市場シェア予測も記載しました。 本レポートの主な目的は次のとおりです。 - 世界および主要国の市場機会の規模を決定するため - パワーデバイス用エポキシ成形材料の成長可能性を評価するため - 各製品および最終用途市場の将来の成長を予測するため - 市場に影響を与える競争要因を評価するため パワーデバイス用エポキシ成形材料市場は種類と用途によって区分されます。2018年～2029年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメント ・SC、SOT、TO、その他 用途別セグメント ・自動車、家電、工業、その他 主要な市場プレーヤー ・Sumitomo Bakelite、Showa Denko、Chang Chun Group、Hysol Huawei Electronics、Panasonic、Kyocera、KCC、Eternal Materials、Jiangsu zhongpeng new material、Shin-Etsu Chemical、Nagase ChemteX Corporation、Tianjin Kaihua Insulating Material、HHCK、Scienchem、Beijing Sino-tech Electronic Material 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、パワーデバイス用エポキシ成形材料製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なパワーデバイス用エポキシ成形材料メーカーの企業概要、2019年～2022年までのパワーデバイス用エポキシ成形材料の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なパワーデバイス用エポキシ成形材料メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2018年～2029年までの地域別パワーデバイス用エポキシ成形材料の販売量、売上、成長性を示しています。 ・第5、6章では、2018年～2029年までのパワーデバイス用エポキシ成形材料の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2018年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2029年までの主要地域でのパワーデバイス用エポキシ成形材料市場予測を収録しています。 ・第12章では、市場力学、成長要因、阻害要因、トレンド、ポーターズファイブフォース分析、新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を掲載しています。 ・第13章では、主要な原材料、主要なサプライヤー、およびパワーデバイス用エポキシ成形材料の産業チェーンを掲載しています。 ・第14、15章では、パワーデバイス用エポキシ成形材料の販売チャネル、販売業者、顧客、調査結果について説明します。 ***** 目次(一部) ***** ・市場概要 - パワーデバイス用エポキシ成形材料の概要 - 種類別分析（2018年vs2022年vs2029年）：SC、SOT、TO、その他 - 用途別分析（2018年vs2022年vs2029年）：自動車、家電、工業、その他 - 世界のパワーデバイス用エポキシ成形材料市場規模・予測 - 世界のパワーデバイス用エポキシ成形材料生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - Sumitomo Bakelite、Showa Denko、Chang Chun Group、Hysol Huawei Electronics、Panasonic、Kyocera、KCC、Eternal Materials、Jiangsu zhongpeng new material、Shin-Etsu Chemical、Nagase ChemteX Corporation、Tianjin Kaihua Insulating Material、HHCK、Scienchem、Beijing Sino-tech Electronic Material ・メーカー別市場シェア・市場集中度 ・地域別市場分析2018年-2029年 ・種類別分析2018年-2029年：SC、SOT、TO、その他 ・用途別分析2018年-2029年：自動車、家電、工業、その他 ・パワーデバイス用エポキシ成形材料の北米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・パワーデバイス用エポキシ成形材料のヨーロッパ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・パワーデバイス用エポキシ成形材料のアジア市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・パワーデバイス用エポキシ成形材料の南米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・パワーデバイス用エポキシ成形材料の中東・アフリカ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・市場力学（成長要因、阻害要因、トレンド、ポーターズファイブフォース分析） ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
According to our (Global Info Research) latest study, the global Epoxy Molding Compound for Power Device market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Here are some key features and advantages of epoxy molding compound for power devices:
Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.
Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.
Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.
Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.
Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.
Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.
Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.
Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.
This report is a detailed and comprehensive analysis for global Epoxy Molding Compound for Power Device market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Epoxy Molding Compound for Power Device market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Epoxy Molding Compound for Power Device market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Epoxy Molding Compound for Power Device market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Epoxy Molding Compound for Power Device market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2018-2023.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Epoxy Molding Compound for Power Device
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace.
This report profiles key players in the global Epoxy Molding Compound for Power Device market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics and Panasonic, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Epoxy Molding Compound for Power Device market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
SC
SOT
TO
Other
Market segment by Application
Automotive
Consumer Electronics
Industrial
Other
Major players covered
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Epoxy Molding Compound for Power Device product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Epoxy Molding Compound for Power Device, with price, sales, revenue and global market share of Epoxy Molding Compound for Power Device from 2018 to 2023.
Chapter 3, the Epoxy Molding Compound for Power Device competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Epoxy Molding Compound for Power Device breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Epoxy Molding Compound for Power Device market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Epoxy Molding Compound for Power Device.
Chapter 14 and 15, to describe Epoxy Molding Compound for Power Device sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
1.1 Product Overview and Scope of Epoxy Molding Compound for Power Device
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Epoxy Molding Compound for Power Device Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 SC
1.3.3 SOT
1.3.4 TO
1.3.5 Other
1.4 Market Analysis by Application
1.4.1 Overview: Global Epoxy Molding Compound for Power Device Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 Automotive
1.4.3 Consumer Electronics
1.4.4 Industrial
1.4.5 Other
1.5 Global Epoxy Molding Compound for Power Device Market Size & Forecast
1.5.1 Global Epoxy Molding Compound for Power Device Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Epoxy Molding Compound for Power Device Sales Quantity (2018-2029)
1.5.3 Global Epoxy Molding Compound for Power Device Average Price (2018-2029)
2 Manufacturers Profiles
2.1 Sumitomo Bakelite
2.1.1 Sumitomo Bakelite Details
2.1.2 Sumitomo Bakelite Major Business
2.1.3 Sumitomo Bakelite Epoxy Molding Compound for Power Device Product and Services
2.1.4 Sumitomo Bakelite Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 Sumitomo Bakelite Recent Developments/Updates
2.2 Showa Denko
2.2.1 Showa Denko Details
2.2.2 Showa Denko Major Business
2.2.3 Showa Denko Epoxy Molding Compound for Power Device Product and Services
2.2.4 Showa Denko Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Showa Denko Recent Developments/Updates
2.3 Chang Chun Group
2.3.1 Chang Chun Group Details
2.3.2 Chang Chun Group Major Business
2.3.3 Chang Chun Group Epoxy Molding Compound for Power Device Product and Services
2.3.4 Chang Chun Group Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 Chang Chun Group Recent Developments/Updates
2.4 Hysol Huawei Electronics
2.4.1 Hysol Huawei Electronics Details
2.4.2 Hysol Huawei Electronics Major Business
2.4.3 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Product and Services
2.4.4 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 Hysol Huawei Electronics Recent Developments/Updates
2.5 Panasonic
2.5.1 Panasonic Details
2.5.2 Panasonic Major Business
2.5.3 Panasonic Epoxy Molding Compound for Power Device Product and Services
2.5.4 Panasonic Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 Panasonic Recent Developments/Updates
2.6 Kyocera
2.6.1 Kyocera Details
2.6.2 Kyocera Major Business
2.6.3 Kyocera Epoxy Molding Compound for Power Device Product and Services
2.6.4 Kyocera Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 Kyocera Recent Developments/Updates
2.7 KCC
2.7.1 KCC Details
2.7.2 KCC Major Business
2.7.3 KCC Epoxy Molding Compound for Power Device Product and Services
2.7.4 KCC Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 KCC Recent Developments/Updates
2.8 Eternal Materials
2.8.1 Eternal Materials Details
2.8.2 Eternal Materials Major Business
2.8.3 Eternal Materials Epoxy Molding Compound for Power Device Product and Services
2.8.4 Eternal Materials Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 Eternal Materials Recent Developments/Updates
2.9 Jiangsu zhongpeng new material
2.9.1 Jiangsu zhongpeng new material Details
2.9.2 Jiangsu zhongpeng new material Major Business
2.9.3 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Product and Services
2.9.4 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 Jiangsu zhongpeng new material Recent Developments/Updates
2.10 Shin-Etsu Chemical
2.10.1 Shin-Etsu Chemical Details
2.10.2 Shin-Etsu Chemical Major Business
2.10.3 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Product and Services
2.10.4 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.10.5 Shin-Etsu Chemical Recent Developments/Updates
2.11 Nagase ChemteX Corporation
2.11.1 Nagase ChemteX Corporation Details
2.11.2 Nagase ChemteX Corporation Major Business
2.11.3 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Product and Services
2.11.4 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.11.5 Nagase ChemteX Corporation Recent Developments/Updates
2.12 Tianjin Kaihua Insulating Material
2.12.1 Tianjin Kaihua Insulating Material Details
2.12.2 Tianjin Kaihua Insulating Material Major Business
2.12.3 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Product and Services
2.12.4 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.12.5 Tianjin Kaihua Insulating Material Recent Developments/Updates
2.13 HHCK
2.13.1 HHCK Details
2.13.2 HHCK Major Business
2.13.3 HHCK Epoxy Molding Compound for Power Device Product and Services
2.13.4 HHCK Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.13.5 HHCK Recent Developments/Updates
2.14 Scienchem
2.14.1 Scienchem Details
2.14.2 Scienchem Major Business
2.14.3 Scienchem Epoxy Molding Compound for Power Device Product and Services
2.14.4 Scienchem Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.14.5 Scienchem Recent Developments/Updates
2.15 Beijing Sino-tech Electronic Material
2.15.1 Beijing Sino-tech Electronic Material Details
2.15.2 Beijing Sino-tech Electronic Material Major Business
2.15.3 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Product and Services
2.15.4 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.15.5 Beijing Sino-tech Electronic Material Recent Developments/Updates
3 Competitive Environment: Epoxy Molding Compound for Power Device by Manufacturer
3.1 Global Epoxy Molding Compound for Power Device Sales Quantity by Manufacturer (2018-2023)
3.2 Global Epoxy Molding Compound for Power Device Revenue by Manufacturer (2018-2023)
3.3 Global Epoxy Molding Compound for Power Device Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Epoxy Molding Compound for Power Device by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Epoxy Molding Compound for Power Device Manufacturer Market Share in 2022
3.4.2 Top 6 Epoxy Molding Compound for Power Device Manufacturer Market Share in 2022
3.5 Epoxy Molding Compound for Power Device Market: Overall Company Footprint Analysis
3.5.1 Epoxy Molding Compound for Power Device Market: Region Footprint
3.5.2 Epoxy Molding Compound for Power Device Market: Company Product Type Footprint
3.5.3 Epoxy Molding Compound for Power Device Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Epoxy Molding Compound for Power Device Market Size by Region
4.1.1 Global Epoxy Molding Compound for Power Device Sales Quantity by Region (2018-2029)
4.1.2 Global Epoxy Molding Compound for Power Device Consumption Value by Region (2018-2029)
4.1.3 Global Epoxy Molding Compound for Power Device Average Price by Region (2018-2029)
4.2 North America Epoxy Molding Compound for Power Device Consumption Value (2018-2029)
4.3 Europe Epoxy Molding Compound for Power Device Consumption Value (2018-2029)
4.4 Asia-Pacific Epoxy Molding Compound for Power Device Consumption Value (2018-2029)
4.5 South America Epoxy Molding Compound for Power Device Consumption Value (2018-2029)
4.6 Middle East and Africa Epoxy Molding Compound for Power Device Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
5.2 Global Epoxy Molding Compound for Power Device Consumption Value by Type (2018-2029)
5.3 Global Epoxy Molding Compound for Power Device Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
6.2 Global Epoxy Molding Compound for Power Device Consumption Value by Application (2018-2029)
6.3 Global Epoxy Molding Compound for Power Device Average Price by Application (2018-2029)
7 North America
7.1 North America Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
7.2 North America Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
7.3 North America Epoxy Molding Compound for Power Device Market Size by Country
7.3.1 North America Epoxy Molding Compound for Power Device Sales Quantity by Country (2018-2029)
7.3.2 North America Epoxy Molding Compound for Power Device Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
8.2 Europe Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
8.3 Europe Epoxy Molding Compound for Power Device Market Size by Country
8.3.1 Europe Epoxy Molding Compound for Power Device Sales Quantity by Country (2018-2029)
8.3.2 Europe Epoxy Molding Compound for Power Device Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Epoxy Molding Compound for Power Device Market Size by Region
9.3.1 Asia-Pacific Epoxy Molding Compound for Power Device Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Epoxy Molding Compound for Power Device Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
10.2 South America Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
10.3 South America Epoxy Molding Compound for Power Device Market Size by Country
10.3.1 South America Epoxy Molding Compound for Power Device Sales Quantity by Country (2018-2029)
10.3.2 South America Epoxy Molding Compound for Power Device Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Epoxy Molding Compound for Power Device Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Epoxy Molding Compound for Power Device Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Epoxy Molding Compound for Power Device Market Size by Country
11.3.1 Middle East & Africa Epoxy Molding Compound for Power Device Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Epoxy Molding Compound for Power Device Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Epoxy Molding Compound for Power Device Market Drivers
12.2 Epoxy Molding Compound for Power Device Market Restraints
12.3 Epoxy Molding Compound for Power Device Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Epoxy Molding Compound for Power Device and Key Manufacturers
13.2 Manufacturing Costs Percentage of Epoxy Molding Compound for Power Device
13.3 Epoxy Molding Compound for Power Device Production Process
13.4 Epoxy Molding Compound for Power Device Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Epoxy Molding Compound for Power Device Typical Distributors
14.3 Epoxy Molding Compound for Power Device Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
| 【パワーデバイス用エポキシ成形材料について】 パワーデバイス用エポキシ成形材料は、半導体パワーデバイスの製造に不可欠な材料として、電子機器の高性能化、コンパクト化を実現するために重要な役割を果たしています。エポキシ成形材料は、主にエポキシ樹脂を基にした複合材料であり、特に高温や高圧環境においても安定した性能を発揮することが求められます。このような材料の定義、特徴、種類、用途、そして関連技術について詳しく説明します。 エポキシ樹脂は、優れた電気絶縁性、機械的強度、耐熱性を備えており、パワーデバイスの封止材料として広く利用されています。これにより、内部の電子部品を外部環境から保護し、信頼性を向上させることが可能です。特に、発熱が大きくなるパワーデバイスでは、熱伝導性もまた重要な性能指標となります。このため、エポキシ成形材料には熱伝導性を持たせるための添加剤が使用されることが一般的です。これにより、デバイスの熱管理が容易になり、寿命の延長や性能の向上が図られます。 エポキシ成形材料の特徴として、まず第一に耐熱性が挙げられます。パワーデバイスは高温の環境下でも動作する必要があるため、成形材料も高温に耐えられる必要があります。また、エポキシ樹脂は化学的安定性が高く、湿気や化学薬品からの保護効果も期待できるため、長期間の使用においても劣化しにくい特性を持っています。 第二に、電気絶縁性能が優れています。この特性は、パワーデバイスの内部回路が周囲からの影響を受けることなく動作するために不可欠です。特に、エレクトロニクス分野では、耐電圧が高く、絶縁破壊が起こりにくい材料が求められます。エポキシ成形材料はこの要件を満たすために、特別に配合されていることが多いです。 第三に、成形性が良好であるという点も重要です。エポキシ樹脂は、アイソサイアネート（Isocyanate）や硬化剤と混合することで、液体状から固体に変化する特性があります。このプロセスにより、複雑な形状の部品を製造することができ、効率的な生産が可能となるのです。 エポキシ成形材料の種類には、様々なカテゴリーがあります。例えば、熱硬化性エポキシ樹脂は一度硬化すると再度柔らかくすることができないため、高い耐熱性と強度を持っています。一方、熱可塑性エポキシ樹脂は加熱により再加工が可能で、リサイクルしやすい特性があります。これにより、環境負荷を軽減することが重要視されています。さらに、導電性エポキシ樹脂や高耐熱エポキシ樹脂など、特定の用途に特化したバリエーションも数多く存在します。 用途としては、パワーMOSFETやIGBT（絶縁ゲートバイポーラトランジスタ）、ダイオードなどのパワーデバイスの封止に限らず、LED照明、電源ユニットなどさまざまな電子デバイスにおいて利用されています。特に、近年のエネルギー効率向上や電動車、再生可能エネルギー関連のデバイス需要増加に伴い、パワーデバイス用エポキシ成形材料の需要も急速に拡大しています。 関連技術としては、熱管理技術や冷却技術が重要です。熱伝導性の向上や、冷却効率を高めるための材料選定は、パワーデバイスの信頼性に直結しています。また、実装技術やパッケージング技術もエポキシ成形材料の性能を最大限に引き出すために重要です。最近では、3Dプリンティング技術を用いた製造方法や、ナノテクノロジーを利用してエポキシ樹脂の特性を強化する研究も進められています。 エポキシ成形材料は、エレクトロニクスの進化とともに、その特性に対する要求も日々変化しています。持続可能な開発を目指す中で、環境に優しい材料の研究や、より高機能な材料の開発が進められており、これによりパワーデバイスの性能向上や、小型化が推進されています。このように、パワーデバイス用エポキシ成形材料は、今後もますます重要な役割を果たすことでしょう。 |
