Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist. It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to GIR’s investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
Global Die-Attach Materials key players include Alpha Assembly Solutions, SMIC, Henkel, etc. Global top three manufacturers hold a share about 40%. Asia Pacific is the largest market, with a share about 70%, followed by Europe and North America, have a share over 22 percent. In terms of Production, Die Attach Paste is the largest segment, with a share over 87%. And in terms of Application, the largest application is SMT Assembly, followed by Semiconductor Packaging, Automotive, etc.

Market Analysis and Insights: Global and China Die-Attach Materials Market
This report focuses on global and China Die-Attach Materials market.
In 2020, the global Die-Attach Materials market size was US$ 505 million and it is expected to reach US$ 725.2 million by the end of 2027, with a CAGR of 3.4% during 2021-2027. In China the Die-Attach Materials market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Die-Attach Materials Scope and Market Size
Die-Attach Materials market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Die-Attach Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For China market, this report focuses on the Die-Attach Materials market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in China.

Segment by Type
Die Attach Paste
Die Attach Wire
Others

Segment by Application
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

By Company
Alpha Assembly Solutions
SMIC
Henkel
Shenmao Technology
Heraeu
Shenzhen Weite New Material
Sumitomo Bakelite
Indium
AIM
Tamura
Kyocera
TONGFANG TECH
NAMICS
Hitachi Chemical
Nordson EFD
Asahi Solder
Dow
Shanghai Jinji
Inkron
Palomar Technologies