▶ 調査レポート

ボールグリッドアレイ（BGA）PCBの世界市場2023年：プラスチックボールグリッドアレイ、セラミックボールグリッドアレイ、テープボールグリッドアレイ、エンハンストボールグリッドアレイ、フリップ チップボールグリッドアレイ、マイクロBGA
• 英文タイトル：Global Ball Grid Array (BGA) PCB Market Research Report 2023

QYResearchが調査・発行した産業分析レポートです。ボールグリッドアレイ（BGA）PCBの世界市場2023年：プラスチックボールグリッドアレイ、セラミックボールグリッドアレイ、テープボールグリッドアレイ、エンハンストボールグリッドアレイ、フリップ チップボールグリッドアレイ、マイクロBGA / Global Ball Grid Array (BGA) PCB Market Research Report 2023 / MRC23Q30712資料のイメージです。• レポートコード：MRC23Q30712
• 出版社/出版日：QYResearch / 2023年3月
• レポート形態：英文、PDF、106ページ
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レポート概要
本調査レポートは世界のボールグリッドアレイ（BGA）PCB市場について調査・分析し、世界のボールグリッドアレイ（BGA）PCB市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（プラスチックボールグリッドアレイ、セラミックボールグリッドアレイ、テープボールグリッドアレイ、エンハンストボールグリッドアレイ、フリップ チップボールグリッドアレイ、マイクロBGA）、用途別セグメント分析（家電、通信産業、工業、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Samsung Electro-Mechanics、Nanya PCB、TTM Technologies Inc.、Unimicron、Shennan Circuits、CMK Corporation、Kingboard、Creative Hi-tech Ltd.、Mer-Mar Electronics、JHYPCB、Multi Circuit Boards Ltd.、PCBAStore、Sierra Circuits、Cirexx、Pcbcart、RayMing、UCREATE ELECTRONIC GROUPなどが含まれています。世界のボールグリッドアレイ（BGA）PCB市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、ボールグリッドアレイ（BGA）PCB市場規模を推定する際に考慮しました。本レポートは、ボールグリッドアレイ（BGA）PCBの世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、ボールグリッドアレイ（BGA）PCBに関するビジネス上の意思決定に役立てることを目的としています。

・ボールグリッドアレイ（BGA）PCB市場の概要
- 製品の定義
- ボールグリッドアレイ（BGA）PCBのタイプ別セグメント
- 世界のボールグリッドアレイ（BGA）PCB市場成長率のタイプ別分析（プラスチックボールグリッドアレイ、セラミックボールグリッドアレイ、テープボールグリッドアレイ、エンハンストボールグリッドアレイ、フリップ チップボールグリッドアレイ、マイクロBGA）
- ボールグリッドアレイ（BGA）PCBの用途別セグメント
- 世界のボールグリッドアレイ（BGA）PCB市場成長率の用途別分析（家電、通信産業、工業、その他）
- 世界市場の成長展望
- 世界のボールグリッドアレイ（BGA）PCB生産量の推定と予測（2018年-2029年）
- 世界のボールグリッドアレイ（BGA）PCB生産能力の推定と予測（2018年-2029年）
- ボールグリッドアレイ（BGA）PCBの平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- ボールグリッドアレイ（BGA）PCB市場の競争状況およびトレンド

・ボールグリッドアレイ（BGA）PCBの地域別生産量
- ボールグリッドアレイ（BGA）PCB生産量の地域別推計と予測（2018年-2029年）
- 地域別ボールグリッドアレイ（BGA）PCB価格分析（2018年-2023年）
- 北米のボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）
- ヨーロッパのボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）
- 中国のボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）
- 日本のボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）
- 韓国のボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）
- インドのボールグリッドアレイ（BGA）PCB生産規模（2018年-2029年）

・ボールグリッドアレイ（BGA）PCBの地域別消費量
- ボールグリッドアレイ（BGA）PCB消費量の地域別推計と予測（2018年-2029年）
- 北米のボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- アメリカのボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- ヨーロッパのボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- アジア太平洋のボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- 中国のボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- 日本のボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- 韓国のボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- 東南アジアのボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- インドのボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）
- 中南米・中東・アフリカのボールグリッドアレイ（BGA）PCB消費量（2018年-2029年）

・タイプ別セグメント：プラスチックボールグリッドアレイ、セラミックボールグリッドアレイ、テープボールグリッドアレイ、エンハンストボールグリッドアレイ、フリップ チップボールグリッドアレイ、マイクロBGA
- 世界のボールグリッドアレイ（BGA）PCBのタイプ別生産量（2018年-2023年）
- 世界のボールグリッドアレイ（BGA）PCBのタイプ別生産量（2024年-2029年）
- 世界のボールグリッドアレイ（BGA）PCBのタイプ別価格

・用途別セグメント：家電、通信産業、工業、その他
- 世界のボールグリッドアレイ（BGA）PCBの用途別生産量（2018年-2023年）
- 世界のボールグリッドアレイ（BGA）PCBの用途別生産量（2024年-2029年）
- 世界のボールグリッドアレイ（BGA）PCBの用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
Samsung Electro-Mechanics、Nanya PCB、TTM Technologies Inc.、Unimicron、Shennan Circuits、CMK Corporation、Kingboard、Creative Hi-tech Ltd.、Mer-Mar Electronics、JHYPCB、Multi Circuit Boards Ltd.、PCBAStore、Sierra Circuits、Cirexx、Pcbcart、RayMing、UCREATE ELECTRONIC GROUP

・産業チェーンと販売チャネルの分析
- ボールグリッドアレイ（BGA）PCB産業チェーン分析
- ボールグリッドアレイ（BGA）PCBの主要原材料
- ボールグリッドアレイ（BGA）PCBの販売チャネル
- ボールグリッドアレイ（BGA）PCBのディストリビューター
- ボールグリッドアレイ（BGA）PCBの主要顧客

・ボールグリッドアレイ（BGA）PCB市場ダイナミクス
- ボールグリッドアレイ（BGA）PCBの業界動向
- ボールグリッドアレイ（BGA）PCB市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.
The global Ball Grid Array (BGA) PCB market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Ball Grid Array (BGA) PCB is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Ball Grid Array (BGA) PCB is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Ball Grid Array (BGA) PCB include Samsung Electro-Mechanics, Nanya PCB, TTM Technologies Inc., Unimicron, Shennan Circuits, CMK Corporation, Kingboard, Creative Hi-tech Ltd. and Mer-Mar Electronics, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) PCB.
The Ball Grid Array (BGA) PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Ball Grid Array (BGA) PCB market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Ball Grid Array (BGA) PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
UCREATE ELECTRONIC GROUP
Segment by Type
Plastic Ball Grid Array
Ceramic Ball Grid Array
Tape Ball Grid Array
Enhanced Ball Grid Array
Flip Chip Ball Grid Array
Micro BGA
Segment by Application
Consumer Electronics
Communications Industrial
Industrial
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Ball Grid Array (BGA) PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Ball Grid Array (BGA) PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

レポート目次

1 Ball Grid Array (BGA) PCB Market Overview
1.1 Product Definition
1.2 Ball Grid Array (BGA) PCB Segment by Type
1.2.1 Global Ball Grid Array (BGA) PCB Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Plastic Ball Grid Array
1.2.3 Ceramic Ball Grid Array
1.2.4 Tape Ball Grid Array
1.2.5 Enhanced Ball Grid Array
1.2.6 Flip Chip Ball Grid Array
1.2.7 Micro BGA
1.3 Ball Grid Array (BGA) PCB Segment by Application
1.3.1 Global Ball Grid Array (BGA) PCB Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Communications Industrial
1.3.4 Industrial
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Ball Grid Array (BGA) PCB Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Ball Grid Array (BGA) PCB Production Estimates and Forecasts (2018-2029)
1.4.4 Global Ball Grid Array (BGA) PCB Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Ball Grid Array (BGA) PCB Production Market Share by Manufacturers (2018-2023)
2.2 Global Ball Grid Array (BGA) PCB Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Ball Grid Array (BGA) PCB, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Ball Grid Array (BGA) PCB Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Ball Grid Array (BGA) PCB Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Product Offered and Application
2.8 Global Key Manufacturers of Ball Grid Array (BGA) PCB, Date of Enter into This Industry
2.9 Ball Grid Array (BGA) PCB Market Competitive Situation and Trends
2.9.1 Ball Grid Array (BGA) PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest Ball Grid Array (BGA) PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Ball Grid Array (BGA) PCB Production by Region
3.1 Global Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Ball Grid Array (BGA) PCB Production Value by Region (2018-2029)
3.2.1 Global Ball Grid Array (BGA) PCB Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Ball Grid Array (BGA) PCB by Region (2024-2029)
3.3 Global Ball Grid Array (BGA) PCB Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Ball Grid Array (BGA) PCB Production by Region (2018-2029)
3.4.1 Global Ball Grid Array (BGA) PCB Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Ball Grid Array (BGA) PCB by Region (2024-2029)
3.5 Global Ball Grid Array (BGA) PCB Market Price Analysis by Region (2018-2023)
3.6 Global Ball Grid Array (BGA) PCB Production and Value, Year-over-Year Growth
3.6.1 North America Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Ball Grid Array (BGA) PCB Production Value Estimates and Forecasts (2018-2029)
4 Ball Grid Array (BGA) PCB Consumption by Region
4.1 Global Ball Grid Array (BGA) PCB Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Ball Grid Array (BGA) PCB Consumption by Region (2018-2029)
4.2.1 Global Ball Grid Array (BGA) PCB Consumption by Region (2018-2023)
4.2.2 Global Ball Grid Array (BGA) PCB Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Ball Grid Array (BGA) PCB Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Ball Grid Array (BGA) PCB Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Ball Grid Array (BGA) PCB Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Ball Grid Array (BGA) PCB Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Ball Grid Array (BGA) PCB Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Ball Grid Array (BGA) PCB Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Ball Grid Array (BGA) PCB Production by Type (2018-2029)
5.1.1 Global Ball Grid Array (BGA) PCB Production by Type (2018-2023)
5.1.2 Global Ball Grid Array (BGA) PCB Production by Type (2024-2029)
5.1.3 Global Ball Grid Array (BGA) PCB Production Market Share by Type (2018-2029)
5.2 Global Ball Grid Array (BGA) PCB Production Value by Type (2018-2029)
5.2.1 Global Ball Grid Array (BGA) PCB Production Value by Type (2018-2023)
5.2.2 Global Ball Grid Array (BGA) PCB Production Value by Type (2024-2029)
5.2.3 Global Ball Grid Array (BGA) PCB Production Value Market Share by Type (2018-2029)
5.3 Global Ball Grid Array (BGA) PCB Price by Type (2018-2029)
6 Segment by Application
6.1 Global Ball Grid Array (BGA) PCB Production by Application (2018-2029)
6.1.1 Global Ball Grid Array (BGA) PCB Production by Application (2018-2023)
6.1.2 Global Ball Grid Array (BGA) PCB Production by Application (2024-2029)
6.1.3 Global Ball Grid Array (BGA) PCB Production Market Share by Application (2018-2029)
6.2 Global Ball Grid Array (BGA) PCB Production Value by Application (2018-2029)
6.2.1 Global Ball Grid Array (BGA) PCB Production Value by Application (2018-2023)
6.2.2 Global Ball Grid Array (BGA) PCB Production Value by Application (2024-2029)
6.2.3 Global Ball Grid Array (BGA) PCB Production Value Market Share by Application (2018-2029)
6.3 Global Ball Grid Array (BGA) PCB Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Corporation Information
7.1.2 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Product Portfolio
7.1.3 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 Nanya PCB
7.2.1 Nanya PCB Ball Grid Array (BGA) PCB Corporation Information
7.2.2 Nanya PCB Ball Grid Array (BGA) PCB Product Portfolio
7.2.3 Nanya PCB Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Nanya PCB Main Business and Markets Served
7.2.5 Nanya PCB Recent Developments/Updates
7.3 TTM Technologies Inc.
7.3.1 TTM Technologies Inc. Ball Grid Array (BGA) PCB Corporation Information
7.3.2 TTM Technologies Inc. Ball Grid Array (BGA) PCB Product Portfolio
7.3.3 TTM Technologies Inc. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.3.4 TTM Technologies Inc. Main Business and Markets Served
7.3.5 TTM Technologies Inc. Recent Developments/Updates
7.4 Unimicron
7.4.1 Unimicron Ball Grid Array (BGA) PCB Corporation Information
7.4.2 Unimicron Ball Grid Array (BGA) PCB Product Portfolio
7.4.3 Unimicron Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Unimicron Main Business and Markets Served
7.4.5 Unimicron Recent Developments/Updates
7.5 Shennan Circuits
7.5.1 Shennan Circuits Ball Grid Array (BGA) PCB Corporation Information
7.5.2 Shennan Circuits Ball Grid Array (BGA) PCB Product Portfolio
7.5.3 Shennan Circuits Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Shennan Circuits Main Business and Markets Served
7.5.5 Shennan Circuits Recent Developments/Updates
7.6 CMK Corporation
7.6.1 CMK Corporation Ball Grid Array (BGA) PCB Corporation Information
7.6.2 CMK Corporation Ball Grid Array (BGA) PCB Product Portfolio
7.6.3 CMK Corporation Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.6.4 CMK Corporation Main Business and Markets Served
7.6.5 CMK Corporation Recent Developments/Updates
7.7 Kingboard
7.7.1 Kingboard Ball Grid Array (BGA) PCB Corporation Information
7.7.2 Kingboard Ball Grid Array (BGA) PCB Product Portfolio
7.7.3 Kingboard Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Kingboard Main Business and Markets Served
7.7.5 Kingboard Recent Developments/Updates
7.8 Creative Hi-tech Ltd.
7.8.1 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Corporation Information
7.8.2 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Product Portfolio
7.8.3 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Creative Hi-tech Ltd. Main Business and Markets Served
7.7.5 Creative Hi-tech Ltd. Recent Developments/Updates
7.9 Mer-Mar Electronics
7.9.1 Mer-Mar Electronics Ball Grid Array (BGA) PCB Corporation Information
7.9.2 Mer-Mar Electronics Ball Grid Array (BGA) PCB Product Portfolio
7.9.3 Mer-Mar Electronics Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Mer-Mar Electronics Main Business and Markets Served
7.9.5 Mer-Mar Electronics Recent Developments/Updates
7.10 JHYPCB
7.10.1 JHYPCB Ball Grid Array (BGA) PCB Corporation Information
7.10.2 JHYPCB Ball Grid Array (BGA) PCB Product Portfolio
7.10.3 JHYPCB Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.10.4 JHYPCB Main Business and Markets Served
7.10.5 JHYPCB Recent Developments/Updates
7.11 Multi Circuit Boards Ltd.
7.11.1 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Corporation Information
7.11.2 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Product Portfolio
7.11.3 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Multi Circuit Boards Ltd. Main Business and Markets Served
7.11.5 Multi Circuit Boards Ltd. Recent Developments/Updates
7.12 PCBAStore
7.12.1 PCBAStore Ball Grid Array (BGA) PCB Corporation Information
7.12.2 PCBAStore Ball Grid Array (BGA) PCB Product Portfolio
7.12.3 PCBAStore Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.12.4 PCBAStore Main Business and Markets Served
7.12.5 PCBAStore Recent Developments/Updates
7.13 Sierra Circuits
7.13.1 Sierra Circuits Ball Grid Array (BGA) PCB Corporation Information
7.13.2 Sierra Circuits Ball Grid Array (BGA) PCB Product Portfolio
7.13.3 Sierra Circuits Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Sierra Circuits Main Business and Markets Served
7.13.5 Sierra Circuits Recent Developments/Updates
7.14 Cirexx
7.14.1 Cirexx Ball Grid Array (BGA) PCB Corporation Information
7.14.2 Cirexx Ball Grid Array (BGA) PCB Product Portfolio
7.14.3 Cirexx Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Cirexx Main Business and Markets Served
7.14.5 Cirexx Recent Developments/Updates
7.15 Pcbcart
7.15.1 Pcbcart Ball Grid Array (BGA) PCB Corporation Information
7.15.2 Pcbcart Ball Grid Array (BGA) PCB Product Portfolio
7.15.3 Pcbcart Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Pcbcart Main Business and Markets Served
7.15.5 Pcbcart Recent Developments/Updates
7.16 RayMing
7.16.1 RayMing Ball Grid Array (BGA) PCB Corporation Information
7.16.2 RayMing Ball Grid Array (BGA) PCB Product Portfolio
7.16.3 RayMing Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.16.4 RayMing Main Business and Markets Served
7.16.5 RayMing Recent Developments/Updates
7.17 UCREATE ELECTRONIC GROUP
7.17.1 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Corporation Information
7.17.2 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Product Portfolio
7.17.3 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Production, Value, Price and Gross Margin (2018-2023)
7.17.4 UCREATE ELECTRONIC GROUP Main Business and Markets Served
7.17.5 UCREATE ELECTRONIC GROUP Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Ball Grid Array (BGA) PCB Industry Chain Analysis
8.2 Ball Grid Array (BGA) PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Ball Grid Array (BGA) PCB Production Mode & Process
8.4 Ball Grid Array (BGA) PCB Sales and Marketing
8.4.1 Ball Grid Array (BGA) PCB Sales Channels
8.4.2 Ball Grid Array (BGA) PCB Distributors
8.5 Ball Grid Array (BGA) PCB Customers
9 Ball Grid Array (BGA) PCB Market Dynamics
9.1 Ball Grid Array (BGA) PCB Industry Trends
9.2 Ball Grid Array (BGA) PCB Market Drivers
9.3 Ball Grid Array (BGA) PCB Market Challenges
9.4 Ball Grid Array (BGA) PCB Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer


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