 | • レポートコード：MRC309Z6105 • 出版社/出版日：GlobalInfoResearch / 2023年9月 • レポート形態：英文、PDF、116ページ • 納品方法：Eメール（2-3営業日） • 産業分類：機械&装置 |
| Single User | ￥515,040 (USD3,480) | ▷ お問い合わせ |
| Corporate User | ￥1,030,080 (USD6,960) | ▷ お問い合わせ |
• お支払方法：銀行振込（納品後、ご請求書送付）
レポート概要
| GlobalInfoResearchの最新の調査によると、世界のウェーハ研削研磨機の市場規模は2022年のxxx米ドルから2029年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を考慮しながら市場規模を推計しました。 このレポートは、世界のウェーハ研削研磨機市場に関する詳細かつ包括的な分析の結果です。定量的分析と定性的分析データが、メーカー別、地域別、国別、種類別、用途別に記載されています。 市場は常に変化しているため、本レポートでは、競争、需要と供給の傾向、および多くの市場にわたる需要の変化に影響する主要な要因を調査しました。主要な競合他社の企業概要と製品例、および2023年の市場シェア予測も記載しました。 本レポートの主な目的は次のとおりです。 - 世界および主要国の市場機会の規模を決定するため - ウェーハ研削研磨機の成長可能性を評価するため - 各製品および最終用途市場の将来の成長を予測するため - 市場に影響を与える競争要因を評価するため ウェーハ研削研磨機市場は種類と用途によって区分されます。2018年～2029年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメント ・片面研削研磨機、両面研削研磨機 用途別セグメント ・半導体製造、MEMS製造、その他 主要な市場プレーヤー ・DISCO Corporation、Strasbaugh Inc.、Okamoto Corporation、Logitech Ltd.、Lapmaster Wolters GmbH、G&N Genauigkeits Maschinenbau Nürnberg GmbH、Engis Corporation、SpeedFam Co., Ltd.、Peter Wolters GmbH、Koyo Machinery USA, Inc.、ACME Electronics Corporation、KLA Corporation、Melchiorre S.r.l.、Ebara Corporation、Suprema Industries、Beijing Semicore Zkx Electronics Equipment Co., Ltd. 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、ウェーハ研削研磨機製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なウェーハ研削研磨機メーカーの企業概要、2019年～2022年までのウェーハ研削研磨機の価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なウェーハ研削研磨機メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2018年～2029年までの地域別ウェーハ研削研磨機の販売量、売上、成長性を示しています。 ・第5、6章では、2018年～2029年までのウェーハ研削研磨機の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2018年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2029年までの主要地域でのウェーハ研削研磨機市場予測を収録しています。 ・第12章では、市場力学、成長要因、阻害要因、トレンド、ポーターズファイブフォース分析、新型コロナウイルス感染症とロシア・ウクライナ戦争の影響を掲載しています。 ・第13章では、主要な原材料、主要なサプライヤー、およびウェーハ研削研磨機の産業チェーンを掲載しています。 ・第14、15章では、ウェーハ研削研磨機の販売チャネル、販売業者、顧客、調査結果について説明します。 ***** 目次(一部) ***** ・市場概要 - ウェーハ研削研磨機の概要 - 種類別分析（2018年vs2022年vs2029年）：片面研削研磨機、両面研削研磨機 - 用途別分析（2018年vs2022年vs2029年）：半導体製造、MEMS製造、その他 - 世界のウェーハ研削研磨機市場規模・予測 - 世界のウェーハ研削研磨機生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - DISCO Corporation、Strasbaugh Inc.、Okamoto Corporation、Logitech Ltd.、Lapmaster Wolters GmbH、G&N Genauigkeits Maschinenbau Nürnberg GmbH、Engis Corporation、SpeedFam Co., Ltd.、Peter Wolters GmbH、Koyo Machinery USA, Inc.、ACME Electronics Corporation、KLA Corporation、Melchiorre S.r.l.、Ebara Corporation、Suprema Industries、Beijing Semicore Zkx Electronics Equipment Co., Ltd. ・メーカー別市場シェア・市場集中度 ・地域別市場分析2018年-2029年 ・種類別分析2018年-2029年：片面研削研磨機、両面研削研磨機 ・用途別分析2018年-2029年：半導体製造、MEMS製造、その他 ・ウェーハ研削研磨機の北米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・ウェーハ研削研磨機のヨーロッパ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・ウェーハ研削研磨機のアジア市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・ウェーハ研削研磨機の南米市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・ウェーハ研削研磨機の中東・アフリカ市場 - 種類別市場規模2018年-2029年 - 用途別市場規模2018年-2029年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・市場力学（成長要因、阻害要因、トレンド、ポーターズファイブフォース分析） ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
According to our (Global Info Research) latest study, the global Wafer Grinding and Polishing Machine market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period.
Wafer grinding and polishing machine is a device used for grinding and polishing semiconductor wafers. It is mainly used in the post process of semiconductor manufacturing, for thinning wafers, removing surface defects, improving flatness and surface roughness, and adjusting the thickness and size of wafers. Wafer grinding and polishing machines typically use automated operating methods, which can process multiple wafers for grinding and polishing simultaneously. The main working process includes the following steps: grinding: In the grinding stage, the wafer is placed on a grinding plate, and the surface of the wafer is ground using grinding particles by rotating and applying appropriate grinding pressure, thereby removing a certain thickness of the wafer. Polishing: In the polishing stage, the surface of the wafer after grinding is placed on the polishing disc, in contact with the polishing pad. By rotating the disc and applying appropriate polishing pressure, using polishing liquid as the medium, the wafer surface is further ground and polished to achieve higher flatness and smoothness. Cleaning and Inspection: After grinding and polishing, the wafer needs to undergo subsequent steps such as cleaning and inspection to remove residual particles, polishing solution, and other impurities, and undergo quality inspection. Wafer grinding and polishing machines play an important role in semiconductor manufacturing processes, which can be used to prepare flat wafer surfaces to meet the requirements of devices. It is widely used in fields such as integrated circuit manufacturing, optoelectronic device manufacturing, sensor manufacturing, etc., helping to improve the quality of wafers, enhance device performance, and promote the development of the semiconductor industry.
The Global Info Research report includes an overview of the development of the Wafer Grinding and Polishing Machine industry chain, the market status of Semiconductor Manufacturing (Single Side Grinding and Polishing Machine, Double-Sided Grinding and Polishing Machine), MEMS Manufacturing (Single Side Grinding and Polishing Machine, Double-Sided Grinding and Polishing Machine), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Wafer Grinding and Polishing Machine.
Regionally, the report analyzes the Wafer Grinding and Polishing Machine markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Wafer Grinding and Polishing Machine market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Wafer Grinding and Polishing Machine market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Wafer Grinding and Polishing Machine industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Units), revenue generated, and market share of different by Type (e.g., Single Side Grinding and Polishing Machine, Double-Sided Grinding and Polishing Machine).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Wafer Grinding and Polishing Machine market.
Regional Analysis: The report involves examining the Wafer Grinding and Polishing Machine market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Wafer Grinding and Polishing Machine market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Wafer Grinding and Polishing Machine:
Company Analysis: Report covers individual Wafer Grinding and Polishing Machine manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Wafer Grinding and Polishing Machine This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Semiconductor Manufacturing, MEMS Manufacturing).
Technology Analysis: Report covers specific technologies relevant to Wafer Grinding and Polishing Machine. It assesses the current state, advancements, and potential future developments in Wafer Grinding and Polishing Machine areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Wafer Grinding and Polishing Machine market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Wafer Grinding and Polishing Machine market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
Single Side Grinding and Polishing Machine
Double-Sided Grinding and Polishing Machine
Market segment by Application
Semiconductor Manufacturing
MEMS Manufacturing
Others
Major players covered
DISCO Corporation
Strasbaugh Inc.
Okamoto Corporation
Logitech Ltd.
Lapmaster Wolters GmbH
G&N Genauigkeits Maschinenbau Nürnberg GmbH
Engis Corporation
SpeedFam Co., Ltd.
Peter Wolters GmbH
Koyo Machinery USA, Inc.
ACME Electronics Corporation
KLA Corporation
Melchiorre S.r.l.
Ebara Corporation
Suprema Industries
Beijing Semicore Zkx Electronics Equipment Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinding and Polishing Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinding and Polishing Machine, with price, sales, revenue and global market share of Wafer Grinding and Polishing Machine from 2018 to 2023.
Chapter 3, the Wafer Grinding and Polishing Machine competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinding and Polishing Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Wafer Grinding and Polishing Machine market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding and Polishing Machine.
Chapter 14 and 15, to describe Wafer Grinding and Polishing Machine sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
1.1 Product Overview and Scope of Wafer Grinding and Polishing Machine
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Wafer Grinding and Polishing Machine Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 Single Side Grinding and Polishing Machine
1.3.3 Double-Sided Grinding and Polishing Machine
1.4 Market Analysis by Application
1.4.1 Overview: Global Wafer Grinding and Polishing Machine Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 Semiconductor Manufacturing
1.4.3 MEMS Manufacturing
1.4.4 Others
1.5 Global Wafer Grinding and Polishing Machine Market Size & Forecast
1.5.1 Global Wafer Grinding and Polishing Machine Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Wafer Grinding and Polishing Machine Sales Quantity (2018-2029)
1.5.3 Global Wafer Grinding and Polishing Machine Average Price (2018-2029)
2 Manufacturers Profiles
2.1 DISCO Corporation
2.1.1 DISCO Corporation Details
2.1.2 DISCO Corporation Major Business
2.1.3 DISCO Corporation Wafer Grinding and Polishing Machine Product and Services
2.1.4 DISCO Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 DISCO Corporation Recent Developments/Updates
2.2 Strasbaugh Inc.
2.2.1 Strasbaugh Inc. Details
2.2.2 Strasbaugh Inc. Major Business
2.2.3 Strasbaugh Inc. Wafer Grinding and Polishing Machine Product and Services
2.2.4 Strasbaugh Inc. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Strasbaugh Inc. Recent Developments/Updates
2.3 Okamoto Corporation
2.3.1 Okamoto Corporation Details
2.3.2 Okamoto Corporation Major Business
2.3.3 Okamoto Corporation Wafer Grinding and Polishing Machine Product and Services
2.3.4 Okamoto Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 Okamoto Corporation Recent Developments/Updates
2.4 Logitech Ltd.
2.4.1 Logitech Ltd. Details
2.4.2 Logitech Ltd. Major Business
2.4.3 Logitech Ltd. Wafer Grinding and Polishing Machine Product and Services
2.4.4 Logitech Ltd. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 Logitech Ltd. Recent Developments/Updates
2.5 Lapmaster Wolters GmbH
2.5.1 Lapmaster Wolters GmbH Details
2.5.2 Lapmaster Wolters GmbH Major Business
2.5.3 Lapmaster Wolters GmbH Wafer Grinding and Polishing Machine Product and Services
2.5.4 Lapmaster Wolters GmbH Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 Lapmaster Wolters GmbH Recent Developments/Updates
2.6 G&N Genauigkeits Maschinenbau Nürnberg GmbH
2.6.1 G&N Genauigkeits Maschinenbau Nürnberg GmbH Details
2.6.2 G&N Genauigkeits Maschinenbau Nürnberg GmbH Major Business
2.6.3 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding and Polishing Machine Product and Services
2.6.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 G&N Genauigkeits Maschinenbau Nürnberg GmbH Recent Developments/Updates
2.7 Engis Corporation
2.7.1 Engis Corporation Details
2.7.2 Engis Corporation Major Business
2.7.3 Engis Corporation Wafer Grinding and Polishing Machine Product and Services
2.7.4 Engis Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 Engis Corporation Recent Developments/Updates
2.8 SpeedFam Co., Ltd.
2.8.1 SpeedFam Co., Ltd. Details
2.8.2 SpeedFam Co., Ltd. Major Business
2.8.3 SpeedFam Co., Ltd. Wafer Grinding and Polishing Machine Product and Services
2.8.4 SpeedFam Co., Ltd. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 SpeedFam Co., Ltd. Recent Developments/Updates
2.9 Peter Wolters GmbH
2.9.1 Peter Wolters GmbH Details
2.9.2 Peter Wolters GmbH Major Business
2.9.3 Peter Wolters GmbH Wafer Grinding and Polishing Machine Product and Services
2.9.4 Peter Wolters GmbH Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 Peter Wolters GmbH Recent Developments/Updates
2.10 Koyo Machinery USA, Inc.
2.10.1 Koyo Machinery USA, Inc. Details
2.10.2 Koyo Machinery USA, Inc. Major Business
2.10.3 Koyo Machinery USA, Inc. Wafer Grinding and Polishing Machine Product and Services
2.10.4 Koyo Machinery USA, Inc. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.10.5 Koyo Machinery USA, Inc. Recent Developments/Updates
2.11 ACME Electronics Corporation
2.11.1 ACME Electronics Corporation Details
2.11.2 ACME Electronics Corporation Major Business
2.11.3 ACME Electronics Corporation Wafer Grinding and Polishing Machine Product and Services
2.11.4 ACME Electronics Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.11.5 ACME Electronics Corporation Recent Developments/Updates
2.12 KLA Corporation
2.12.1 KLA Corporation Details
2.12.2 KLA Corporation Major Business
2.12.3 KLA Corporation Wafer Grinding and Polishing Machine Product and Services
2.12.4 KLA Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.12.5 KLA Corporation Recent Developments/Updates
2.13 Melchiorre S.r.l.
2.13.1 Melchiorre S.r.l. Details
2.13.2 Melchiorre S.r.l. Major Business
2.13.3 Melchiorre S.r.l. Wafer Grinding and Polishing Machine Product and Services
2.13.4 Melchiorre S.r.l. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.13.5 Melchiorre S.r.l. Recent Developments/Updates
2.14 Ebara Corporation
2.14.1 Ebara Corporation Details
2.14.2 Ebara Corporation Major Business
2.14.3 Ebara Corporation Wafer Grinding and Polishing Machine Product and Services
2.14.4 Ebara Corporation Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.14.5 Ebara Corporation Recent Developments/Updates
2.15 Suprema Industries
2.15.1 Suprema Industries Details
2.15.2 Suprema Industries Major Business
2.15.3 Suprema Industries Wafer Grinding and Polishing Machine Product and Services
2.15.4 Suprema Industries Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.15.5 Suprema Industries Recent Developments/Updates
2.16 Beijing Semicore Zkx Electronics Equipment Co., Ltd.
2.16.1 Beijing Semicore Zkx Electronics Equipment Co., Ltd. Details
2.16.2 Beijing Semicore Zkx Electronics Equipment Co., Ltd. Major Business
2.16.3 Beijing Semicore Zkx Electronics Equipment Co., Ltd. Wafer Grinding and Polishing Machine Product and Services
2.16.4 Beijing Semicore Zkx Electronics Equipment Co., Ltd. Wafer Grinding and Polishing Machine Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.16.5 Beijing Semicore Zkx Electronics Equipment Co., Ltd. Recent Developments/Updates
3 Competitive Environment: Wafer Grinding and Polishing Machine by Manufacturer
3.1 Global Wafer Grinding and Polishing Machine Sales Quantity by Manufacturer (2018-2023)
3.2 Global Wafer Grinding and Polishing Machine Revenue by Manufacturer (2018-2023)
3.3 Global Wafer Grinding and Polishing Machine Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Wafer Grinding and Polishing Machine by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Wafer Grinding and Polishing Machine Manufacturer Market Share in 2022
3.4.2 Top 6 Wafer Grinding and Polishing Machine Manufacturer Market Share in 2022
3.5 Wafer Grinding and Polishing Machine Market: Overall Company Footprint Analysis
3.5.1 Wafer Grinding and Polishing Machine Market: Region Footprint
3.5.2 Wafer Grinding and Polishing Machine Market: Company Product Type Footprint
3.5.3 Wafer Grinding and Polishing Machine Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Wafer Grinding and Polishing Machine Market Size by Region
4.1.1 Global Wafer Grinding and Polishing Machine Sales Quantity by Region (2018-2029)
4.1.2 Global Wafer Grinding and Polishing Machine Consumption Value by Region (2018-2029)
4.1.3 Global Wafer Grinding and Polishing Machine Average Price by Region (2018-2029)
4.2 North America Wafer Grinding and Polishing Machine Consumption Value (2018-2029)
4.3 Europe Wafer Grinding and Polishing Machine Consumption Value (2018-2029)
4.4 Asia-Pacific Wafer Grinding and Polishing Machine Consumption Value (2018-2029)
4.5 South America Wafer Grinding and Polishing Machine Consumption Value (2018-2029)
4.6 Middle East and Africa Wafer Grinding and Polishing Machine Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
5.2 Global Wafer Grinding and Polishing Machine Consumption Value by Type (2018-2029)
5.3 Global Wafer Grinding and Polishing Machine Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
6.2 Global Wafer Grinding and Polishing Machine Consumption Value by Application (2018-2029)
6.3 Global Wafer Grinding and Polishing Machine Average Price by Application (2018-2029)
7 North America
7.1 North America Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
7.2 North America Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
7.3 North America Wafer Grinding and Polishing Machine Market Size by Country
7.3.1 North America Wafer Grinding and Polishing Machine Sales Quantity by Country (2018-2029)
7.3.2 North America Wafer Grinding and Polishing Machine Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
8.2 Europe Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
8.3 Europe Wafer Grinding and Polishing Machine Market Size by Country
8.3.1 Europe Wafer Grinding and Polishing Machine Sales Quantity by Country (2018-2029)
8.3.2 Europe Wafer Grinding and Polishing Machine Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Wafer Grinding and Polishing Machine Market Size by Region
9.3.1 Asia-Pacific Wafer Grinding and Polishing Machine Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Wafer Grinding and Polishing Machine Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
10.2 South America Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
10.3 South America Wafer Grinding and Polishing Machine Market Size by Country
10.3.1 South America Wafer Grinding and Polishing Machine Sales Quantity by Country (2018-2029)
10.3.2 South America Wafer Grinding and Polishing Machine Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Wafer Grinding and Polishing Machine Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Wafer Grinding and Polishing Machine Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Wafer Grinding and Polishing Machine Market Size by Country
11.3.1 Middle East & Africa Wafer Grinding and Polishing Machine Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Wafer Grinding and Polishing Machine Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Wafer Grinding and Polishing Machine Market Drivers
12.2 Wafer Grinding and Polishing Machine Market Restraints
12.3 Wafer Grinding and Polishing Machine Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Wafer Grinding and Polishing Machine and Key Manufacturers
13.2 Manufacturing Costs Percentage of Wafer Grinding and Polishing Machine
13.3 Wafer Grinding and Polishing Machine Production Process
13.4 Wafer Grinding and Polishing Machine Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Wafer Grinding and Polishing Machine Typical Distributors
14.3 Wafer Grinding and Polishing Machine Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer